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SN65HVD251DG4

Texas Instruments

SN65HVD251DG4 by Texas Instruments

SN65HVD251DG4 by Texas Instruments is a BICMOS technology interface circuit with 1 Mbps data rate. It operates at a nominal voltage of 5V and has a max supply current of 0.065 mA. This small outline package is commonly used in automotive applications.

Median Price

$4.090

Lifecycle Status

EOL

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 782 parts In-Stock

1+ parts

$4.090

100+ parts

$3.000

1k+ parts

$2.550

10k+ parts

$1.970

782

$4.090

$3.000

$2.550

$1.970

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$2.680

100+ parts

-

1k+ parts

-

10k+ parts

-

750

$2.680

-

-

-

Digiode

USA . 4,862 parts In-Stock

1+ parts

$3.886

100+ parts

-

1k+ parts

-

10k+ parts

-

4,862

$3.886

-

-

-

Infinite Electronics LLP

India . 1,026 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,026

-

-

-

-

Vyrian

USA . 755 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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755

-

-

-

-

Cyclops Electronics Ltd

UK . 228 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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228

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 4,602 parts In-Stock

1+ parts

$2.380

100+ parts

-

1k+ parts

-

10k+ parts

-

4,602

$2.380

-

-

-

Continental Prestige Electronics

USA . 3,391 parts In-Stock

1+ parts

$2.380

100+ parts

-

1k+ parts

-

10k+ parts

$2.332

3,391

$2.380

-

-

$2.332

Modulus Dynamics

Lithuania . 50 parts In-Stock

1+ parts

$2.642

100+ parts

$2.615

1k+ parts

$2.536

10k+ parts

-

50

$2.642

$2.615

$2.536

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$2.680

100+ parts

-

1k+ parts

$2.546

10k+ parts

$2.492

100

$2.680

-

$2.546

$2.492

Semicontronic

India . 710 parts In-Stock

1+ parts

$3.480

100+ parts

$3.393

1k+ parts

$3.376

10k+ parts

-

710

$3.480

$3.393

$3.376

-

Ampacity Inc.

Singapore . 389 parts In-Stock

1+ parts

$3.480

100+ parts

-

1k+ parts

-

10k+ parts

-

389

$3.480

-

-

-

Corphita

USA . 2,430 parts In-Stock

1+ parts

$3.681

100+ parts

-

1k+ parts

-

10k+ parts

-

2,430

$3.681

-

-

-

Parana Technologies

USA . 1,638 parts In-Stock

1+ parts

$6.574

100+ parts

-

1k+ parts

$7.314

10k+ parts

-

1,638

$6.574

-

$7.314

-

DigiPath Technology Company

USA . 2,214 parts In-Stock

1+ parts

$7.239

100+ parts

-

1k+ parts

-

10k+ parts

-

2,214

$7.239

-

-

-

ChromeModa Solutions

Germany . 3,446 parts In-Stock

1+ parts

$7.387

100+ parts

$6.057

1k+ parts

-

10k+ parts

-

3,446

$7.387

$6.057

-

-

IDEA Electronic Components Group

UK . 2,270 parts In-Stock

1+ parts

$7.387

100+ parts

-

1k+ parts

$6.648

10k+ parts

-

2,270

$7.387

-

$6.648

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$8.225

100+ parts

$7.813

1k+ parts

$7.813

10k+ parts

-

500

$8.225

$7.813

$7.813

-

Corohmni

South Africa . 23 parts In-Stock

1+ parts

$10.738

100+ parts

-

1k+ parts

-

10k+ parts

-

23

$10.738

-

-

-

AZTECH Wire

Italy . 428 parts In-Stock

1+ parts

$19.850

100+ parts

-

1k+ parts

-

10k+ parts

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428

$19.850

-

-

-

Lixinc

USA . 14,048 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14,048

-

-

-

-

Robosynatics

Brazil . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Lucentia Tech

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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500

-

-

-

-

Microchip USA

USA . 309 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

309

-

-

-

-

Overview

Upgrade your network connections with the SN65HVD251DG4 by Texas Instruments. As a leader in the industry, Texas Instruments ensures only the highest quality products for its customers. This network interface offers exceptional value, benefits, and advantages for various applications. With its small outline package style and surface mount capabilities, it is perfect for automotive use. Experience reliable and efficient data transfer at 1 Mbps, while enjoying the ease of installation with its dual terminal position. Trust Texas Instruments to provide you with the best network interfaces for all your connectivity needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards.

Power Supplies (V): 5

Operating at 5V is common in many electronic devices, ensuring compatibility with various systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows for reliable performance even in hot conditions.

Data Rate: 1 Mbps

With a data rate of 1 Mbps, the product can efficiently transfer data at a moderate speed.

Technical Specifications

Network Interfaces SN65HVD251DG4 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.065 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN65HVD251DG4 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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