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AR8031-AL1B

Qualcomm

AR8031-AL1B by Qualcomm

Qualcomm's AR8031-AL1B is an Ethernet transceiver with a data rate of 1000 Mbps. It operates at temperatures ranging from -40 to 85°C, making it suitable for industrial applications. With a terminal pitch of 0.4 mm and no lead terminal form, it offers reliable network connectivity in a compact square package.

Median Price

$5.079

Lifecycle Status

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12

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Arrow

USA . 815 parts In-Stock

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Cyclops Electronics Ltd

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K-1 Technologies

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ComSIT Distribution GmbH

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Vyrian

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Nova Conductors

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Modulus Dynamics

Lithuania . 1,510 parts In-Stock

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$7.710

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Corohmni

South Africa . 1,010 parts In-Stock

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Advanced Electronics

New Zealand . 50 parts In-Stock

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Aztec Data Supply Inc.

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AZTECH Wire

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Futuretech Components

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Lucentia Tech

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Overview

Elevate your network connectivity with the powerful AR8031-AL1B by Qualcomm. As a leading manufacturer in the industry, Qualcomm delivers top-notch quality and reliability in their network interfaces. With its compact square package shape and 48 terminals, this chip carrier offers unparalleled performance for various applications. Experience seamless data transmission at 1000 Mbps with a nominal supply voltage of 3.3V. Trust Qualcomm to provide industrial-grade temperature resilience and no-lead terminal form for ultimate durability. Upgrade your network experience today with the AR8031-AL1B and unlock a world of possibilities.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on a PCB, saving space and reducing assembly time.

Package Shape: SQUARE

Square package shape makes it easy to handle and install in a compact space on the PCB.

No. of Terminals: 48

Having 48 terminals allows for a reliable connection and efficient data transmission in a network interface.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and ensure stability during operation.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures enables this network interface to function in both extreme cold and hot environments.

Telecom IC Type: ETHERNET TRANSCEIVER

Being an Ethernet transceiver ensures high-speed and reliable data transmission in network communication, making this product suitable for advanced networking applications.

Data Rate: 1000 Mbps

With a data rate of 1000 Mbps, this network interface can handle high-speed data transfer, making it ideal for applications requiring fast and efficient network connectivity.

Technical Specifications

Network Interfaces AR8031-AL1B attributes and parameters. Explore more Network Interfaces devices from Qualcomm

Specs

Data Rate:

1000 Mbps

JESD-30 Code:

S-XQCC-N48

Length:

6 mm

No. of Functions:

1

No. of Terminals:

48

No. of Transceivers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.24SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Maximum Supply Current:

113.7 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

AR8031-AL1B Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Qualcomm

Qualcomm develops and licenses wireless technology and designs chips for smartphones. The company's key patents revolve around CDMA and OFDMA technologies, which are standards in wireless communications that are the backbone of all 3G and 4G networks. The firm is a leader in 5G network technology as well. Qualcomm's IP is licensed by virtually all wireless device makers. The firm is also the world's largest wireless chip vendor, supplying nearly every premier handset maker with leading-edge processors. Qualcomm also sells RF-front end modules into smartphones and chips into automotive and Internet of Things markets.

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