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TLE7251VLEXUMA1

Infineon Technologies

TLE7251VLEXUMA1 by Infineon Technologies

TLE7251VLEXUMA1 by Infineon Technologies is a network interface IC with 8 terminals and a small outline, heat sink package. It operates at a nominal voltage of 5V and has a max seated height of 1.15mm. This IC is commonly used in telecom applications for interface circuitry.

Median Price

$1.790

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 9,890 parts In-Stock

1+ parts

$1.760

100+ parts

$1.322

1k+ parts

$1.260

10k+ parts

$1.218

9,890

$1.760

$1.322

$1.260

$1.218

Arrow

USA . 773 parts In-Stock

1+ parts

$1.821

100+ parts

$1.377

1k+ parts

$1.300

10k+ parts

-

773

$1.821

$1.377

$1.300

-

Mouser Electronics

USA . 6,023 parts In-Stock

1+ parts

$2.620

100+ parts

$1.590

1k+ parts

$1.390

10k+ parts

$1.320

6,023

$2.620

$1.590

$1.390

$1.320

DigiKey

USA . 22,235 parts In-Stock

1+ parts

$3.050

100+ parts

$1.858

1k+ parts

$1.643

10k+ parts

$1.590

22,235

$3.050

$1.858

$1.643

$1.590

Rochester

USA . 1,996 parts In-Stock

1+ parts

-

100+ parts

$1.190

1k+ parts

$1.060

10k+ parts

$1.000

1,996

-

$1.190

$1.060

$1.000

Verical

USA . 773 parts In-Stock

1+ parts

-

100+ parts

$1.377

1k+ parts

$1.300

10k+ parts

-

773

-

$1.377

$1.300

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.180

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$1.180

-

-

-

Digiode

USA . 701 parts In-Stock

1+ parts

$1.254

100+ parts

-

1k+ parts

-

10k+ parts

-

701

$1.254

-

-

-

TME

Poland . 3 parts In-Stock

1+ parts

$1.340

100+ parts

$0.840

1k+ parts

-

10k+ parts

-

3

$1.340

$0.840

-

-

Bristol Electronics

USA . 116 parts In-Stock

1+ parts

$2.400

100+ parts

$1.488

1k+ parts

-

10k+ parts

-

116

$2.400

$1.488

-

-

Vyrian

USA . 32,747 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

32,747

-

-

-

-

Chip Stock

USA . 6,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,200

-

-

-

-

Sensible Micro Corp

USA . 6,147 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,147

-

-

-

-

Velocity Electronics

USA . 4,999 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,999

-

-

-

-

ComSIT Distribution GmbH

Germany . 2,996 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,996

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,000 parts In-Stock

1+ parts

$0.919

100+ parts

$0.611

1k+ parts

$0.398

10k+ parts

-

5,000

$0.919

$0.611

$0.398

-

Semicontronic

India . 33,500 parts In-Stock

1+ parts

$1.120

100+ parts

$1.092

1k+ parts

$1.086

10k+ parts

-

33,500

$1.120

$1.092

$1.086

-

Ampacity Inc.

Singapore . 32,920 parts In-Stock

1+ parts

$1.120

100+ parts

-

1k+ parts

-

10k+ parts

-

32,920

$1.120

-

-

-

Argo Parts USA

USA . 2,298 parts In-Stock

1+ parts

$1.180

100+ parts

-

1k+ parts

-

10k+ parts

-

2,298

$1.180

-

-

-

Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

$1.180

100+ parts

$1.121

1k+ parts

$1.065

10k+ parts

$1.050

300

$1.180

$1.121

$1.065

$1.050

Corphita

USA . 268 parts In-Stock

1+ parts

$1.188

100+ parts

-

1k+ parts

-

10k+ parts

-

268

$1.188

-

-

-

Modulus Dynamics

Lithuania . 391 parts In-Stock

1+ parts

$9.620

100+ parts

$9.235

1k+ parts

$8.850

10k+ parts

-

391

$9.620

$9.235

$8.850

-

Futuretech Components

Singapore . 11,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 8,514 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,514

-

-

-

-

iodParts Technologies Inc.

India . 4,995 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,995

-

-

-

-

Overview

Discover the TLE7251VLEXUMA1 by Infineon Technologies, a top-quality network interface that offers unmatched performance and reliability. With its innovative design and advanced features, this product is perfect for various applications. Manufactured by Infineon Technologies, a trusted name in the industry, you can trust in the exceptional quality and durability of this product. Experience seamless connectivity and enhanced functionality with the TLE7251VLEXUMA1, while enjoying the convenience it brings to your projects. Don't miss out on the value, benefits, and advantages this product offers. Upgrade your network interface today!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY. This material provides durability and protection to the product, making it suitable for various environments.

Surface Mount:

YES. This feature allows for easy installation and integration of the network interface, saving time and effort during assembly.

No. of Functions:

1. With this network interface offering a single function, it simplifies its usage and makes it more focused on its specific task.

Screening Level:

AEC-Q100. This high screening level ensures the product meets stringent automotive industry requirements, making it reliable and suitable for automotive applications.

Package Shape:

SQUARE. The square shape of the package offers efficient use of space and allows for easy placement on circuit boards.

No. of Terminals:

8. Having 8 terminals enables connectivity to other components, expanding the functionality and versatility of the network interface.

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE. This package style combines compactness, efficient heat dissipation, and reduced height, making it ideal for space-constrained applications while maintaining thermal stability.

Terminal Finish:

TIN. The terminal finish of tin ensures good solderability, facilitating reliable connections and preventing corrosion, ensuring the longevity of the product.

Terminal Position:

DUAL. The dual terminal position allows for flexibility in circuit design and provides multiple connection options, enhancing the adaptability of the network interface.

Maximum Seated Height:

1.15 mm. The low profile of the product makes it suitable for compact devices, enabling efficient utilization of limited space.

Width:

3 mm. With a small width, this network interface can be incorporated into tight assemblies and narrow layouts, expanding its range of potential applications.

Length:

3 mm. The short length of the network interface further enhances its compatibility with space-constrained devices, promoting design flexibility.

Terminal Form:

NO LEAD. The absence of lead enhances the product's environmental friendliness by reducing potential harmful materials, making it a sustainable choice.

Telecom IC Type:

INTERFACE CIRCUIT. This product's telecom IC type ensures reliable and efficient communication within a network, contributing to seamless data transfer and network performance.

Nominal Supply Voltage:

5 V. Operating at a widely used 5 V supply voltage, this network interface can easily integrate into existing systems, reducing compatibility issues.

Terminal Pitch:

0.65 mm. The narrow terminal pitch allows for closer spacing between terminals, facilitating high-density circuitry and compact designs in electronic devices.

Moisture Sensitivity Level (MSL):

2A. With a moisture sensitivity level of 2A, this product is less susceptible to moisture-related issues during assembly and operation, enhancing its quality and reliability.

Technical Specifications

Network Interfaces TLE7251VLEXUMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

2A

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

1.15 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TLE7251VLEXUMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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