Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TLE7251VLEXUMA1 by Infineon Technologies is a network interface IC with 8 terminals and a small outline, heat sink package. It operates at a nominal voltage of 5V and has a max seated height of 1.15mm. This IC is commonly used in telecom applications for interface circuitry.
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iodParts Technologies Inc.
PLASTIC/EPOXY. This material provides durability and protection to the product, making it suitable for various environments.
YES. This feature allows for easy installation and integration of the network interface, saving time and effort during assembly.
1. With this network interface offering a single function, it simplifies its usage and makes it more focused on its specific task.
AEC-Q100. This high screening level ensures the product meets stringent automotive industry requirements, making it reliable and suitable for automotive applications.
SQUARE. The square shape of the package offers efficient use of space and allows for easy placement on circuit boards.
8. Having 8 terminals enables connectivity to other components, expanding the functionality and versatility of the network interface.
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE. This package style combines compactness, efficient heat dissipation, and reduced height, making it ideal for space-constrained applications while maintaining thermal stability.
TIN. The terminal finish of tin ensures good solderability, facilitating reliable connections and preventing corrosion, ensuring the longevity of the product.
DUAL. The dual terminal position allows for flexibility in circuit design and provides multiple connection options, enhancing the adaptability of the network interface.
1.15 mm. The low profile of the product makes it suitable for compact devices, enabling efficient utilization of limited space.
3 mm. With a small width, this network interface can be incorporated into tight assemblies and narrow layouts, expanding its range of potential applications.
3 mm. The short length of the network interface further enhances its compatibility with space-constrained devices, promoting design flexibility.
NO LEAD. The absence of lead enhances the product's environmental friendliness by reducing potential harmful materials, making it a sustainable choice.
INTERFACE CIRCUIT. This product's telecom IC type ensures reliable and efficient communication within a network, contributing to seamless data transfer and network performance.
5 V. Operating at a widely used 5 V supply voltage, this network interface can easily integrate into existing systems, reducing compatibility issues.
0.65 mm. The narrow terminal pitch allows for closer spacing between terminals, facilitating high-density circuitry and compact designs in electronic devices.
2A. With a moisture sensitivity level of 2A, this product is less susceptible to moisture-related issues during assembly and operation, enhancing its quality and reliability.
Network Interfaces TLE7251VLEXUMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Screening Level:
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
TLE7251VLEXUMA1 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
MMBT2222ALT1G
Onsemi
MMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, max power dissipation of 0.3W, and hFE of 75. Ideal for switching applications, it operates b/w -55 to 150 °C with a max collector-emitter voltage of 40V. This surface-mount device has a transition frequency of 300MHz and turn-on time of 35ns.
LM358AN
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM317AEMP/NOPB
Texas Instruments
LM317AEMP/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and a max output current of 1.5A. It operates in temperatures ranging from -40°C to 125°C, making it suitable for various applications requiring precise voltage regulation in a compact package.
KSZ9031RNXIC
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
SMBJ18CA
World Products
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H
Linear Technology
LM107H by Linear Technology is an Operational Amplifier with a max input offset voltage of 3000uV, common mode reject ratio of 96dB, and min voltage gain of 50000. It is used in military applications due to its MILITARY temperature grade and BIPOLAR technology for precise signal processing in harsh environments.
M24308/2-1F
Air Electro
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; MIL Conformity: YES; Additional Features: STANDARD: MIL-DTL-24308;
1N4148
Crimson Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Weitronic Enterprise
1N4148WS
Rochester Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Signetics
BAV99
National Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Package Shape or Style: RECTANGULAR; Maximum Operating Current: 1.5 mA; Package Equivalence Code: SIP3,.1,50;
350766-1
TE Connectivity
TE Connectivity 350766-1 is a rectangular power connector with 0.25" mating contact pitch, rated for 600V and operating temperatures from -55 to 105°C. It has a durable design with POLYAMIDE insulator material, suitable for commercial applications requiring secure crimp termination in cable mounting setups.
2N2222A
Taitron Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
LL4148
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
ERJU06F10R0V
Panasonic
ERJU06F10R0V by Panasonic is an 0805 size SMT fixed resistor with a resistance of 10 ohm and 1% tolerance. It operates b/w -55 to 155 °C, suitable for AEC-Q200 standards in automotive applications due to its high temperature coefficient of 100 ppm/°C. With a max operating voltage of 150 V and power dissipation of 0.125 W, it is ideal for surface mounting type.
2N7002,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 30; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
Shandong Yiguang Electronic Joint Stock
M39029/58360
Esterline Technologies
CONNECTOR ACCESSORY; Terminal Type: CRIMP; Removal Tools: M81969/14-01; Associated Military - Specifications: MIL-DTL-38999; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT;
DP83620SQ/NOPB
DP83620SQ/NOPB by Texas Instruments is a Network Interface with 100000 Mbps data rate, operating at -40 to 85 °C. It features CMOS technology, 48 terminals in a square package style, and requires 3.3 V supply voltage. Ideal for Ethernet transceiver applications in industrial settings due to its compact size and surface mount capability.
LAN8742I-CZ-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
KSZ9031RNXIC-TR
Microchip Technology
Microchip's KSZ9031RNXIC-TR is a 48-terminal Ethernet transceiver with a data rate of 1000 Mbps. Operating temperature ranges from -40 to 85°C, making it suitable for industrial applications. This surface-mount chip carrier has a very thin profile and matte tin finish, ideal for networking interfaces.
14450R-500
Adesto Technologies
Network Interfaces;
LTC2875IDD#TRPBF
Analog Devices
LTC2875IDD#TRPBF by Analog Devices is a network interface IC with 8 terminals and a small outline package. It operates in industrial temperature range (-40 to 85°C) and has a nominal voltage of 3.3V. This IC is commonly used for telecom interface circuits.
AR8031-AL1B-R
Qualcomm
Qualcomm's AR8031-AL1B-R is an Ethernet transceiver with 1000 Mbps data rate, operating at -40 to 85°C. It features a square chip carrier package style, 48 terminals, and requires 3.3V supply voltage. Ideal for industrial telecom applications due to its compact size and low power consumption of 113.7 mA.
KSZ8041TL
ETHERNET TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: TFQFP; Package Shape: SQUARE;
DP83848CVV/NOPB
DP83848CVV/NOPB by Texas Instruments is a 3.3V Ethernet transceiver with 100000 Mbps data rate. It features a quad terminal position, matte tin finish, and operates b/w 0-70°C. Ideal for network interfaces in commercial applications due to its compact flatpack design and fine pitch terminals.
KSZ8851-16MLLI
KSZ8851-16MLLI by Microchip: Ethernet transceiver with 48 terminals, operates at -40 to 85°C. Package style is flatpack, low profile, fine pitch for industrial applications. Features include CMOS technology, matte tin finish, and 1.8V supply voltage.
TCAN337GDR
TCAN337GDR by Texas Instruments is an automotive-grade network interface IC with 8 terminals, operating at -40 to 125°C. It features a data rate of 5 Mbps, terminal pitch of 1.27 mm, and nominal voltage of 3.3 V. Ideal for telecom applications requiring small outline packages and surface mount capabilities.
TCAN4550RGYQ1
TCAN4550RGYQ1 by Texas Instruments is an AEC-Q100 compliant interface circuit with 20 terminals in a chip carrier package. It operates b/w -40 to 125°C, making it suitable for automotive applications. With a compact size of 3.5mm width and 4.5mm length, it is ideal for surface mount designs in automotive electronics.
KSZ8061RNDW
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
TCAN1042HDQ1
TCAN1042HDQ1 by Texas Instruments is an Ethernet transceiver with a data rate of 2 Mbps. It operates at temperatures ranging from -55°C to 125°C and has a supply voltage of 5V. This network interface IC is designed for automotive applications, featuring AEC-Q100 screening and MILITARY temperature grade suitability.
TJA1057GTK
NXP Semiconductors
NXP Semiconductors' TJA1057GTK is an AEC-Q100 compliant interface circuit with 8 terminals, small outline package style, and 5V nominal voltage. It is designed for automotive applications requiring a compact form factor (3x3mm) and surface mount capability. The device offers reliable network connectivity in vehicles with its low profile design and dual terminal position.
TJA1057GTK/3
NXP Semiconductors' TJA1057GTK/3 is an AEC-Q100 compliant interface circuit with 8 terminals, small outline package style, and 5V nominal voltage. It is designed for automotive applications requiring a compact (3x3mm) surface-mount solution with dual terminal position.
MCP2551-I/SNG
MCP2551-I/SNG by Microchip: CAN transceiver, 1 Mbps data rate, 5V supply voltage. Ideal for industrial applications. Small outline package with dual terminals and matte tin finish.
DP83848JSQ/NOPB
ETHERNET TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE;
MCP2542FDT-H/MNY
MCP2542FDT-H/MNY by Microchip is a CAN FD transceiver with 8 Mbps data rate, suitable for automotive applications. It operates at -40 to 150°C, with a supply voltage of 5V and max current of 140mA. The package is small outline, heat sink, very thin profile, with nickel palladium gold finish and dual terminals.
AR8033-AL1A-R
Qualcomm Atheros
ETHERNET TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
MAX3051ESA+T
Analog Devices' MAX3051ESA+T is a BICMOS technology network interface IC with 8 terminals, operating at 3.3V. It offers a data rate of 1 Mbps and is ideal for industrial applications requiring interface circuitry in small outline packages.
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TLE7250GVIOXUMA2
Infineon Technologies
TLE7250GVIOXUMA2 by Infineon Technologies is a network interface IC with 8 terminals in a small outline package. It operates at a nominal voltage of 5V and has gull wing terminal form. This AEC-Q100 compliant device is commonly used in automotive communication systems.
TLE7268SKXUMA1
INTERFACE CIRCUIT; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3;
TLE72593GEXUMA3
TLE72593GEXUMA3 by Infineon is an 8-terminal interface circuit with a nominal voltage of 8V. It features a small outline package style, gull wing terminal form, and AEC-Q100 screening level. Ideal for network interfaces in automotive applications due to its compact size and surface-mount capability.
TLE7250GXUMA1
TLE7250GXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, 5V supply voltage, and 1.27mm terminal pitch. It is designed for telecom applications requiring small outline package style and dual terminal position for compact designs.
TLE7268LCXUMA1
INTERFACE CIRCUIT; Moisture Sensitivity Level (MSL): 2A; JESD-609 Code: e3; Terminal Finish: TIN;
TLE7251VSJXUMA1
TLE7251VSJXUMA1 by Infineon Technologies is an AEC-Q100 compliant network interface IC with 8 terminals in a small outline package. It operates at 5V, has gull wing terminals, and is suitable for telecom applications requiring interface circuits.
TLE7257LEXUMA1
LIN TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HTSON; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 2A;
TLE72593LEXUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HTSON; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 2A;
TLE7250SJXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
TLE7250XLEXUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HTSON; Package Shape: SQUARE; Maximum Seated Height: 1.15 mm;
TLE7250LEXUMA1
TLE7250LEXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, small outline package style, and 5V supply voltage. It features a square package shape, tin terminal finish, and dual terminal position. Ideal for automotive applications requiring a compact design and reliable network interfaces.
TLE7250VLEXUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: SON; Package Shape: SQUARE; JESD-609 Code: e3;
TLE7263EXUMA2
LAN SWITCHING CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: SSOP; Package Shape: RECTANGULAR; Nominal Supply Voltage: 13.5 V;
TLE7263E
TLE7263E by Infineon Technologies is a LAN switching circuit with 36 terminals in a small outline package. It operates at a nominal voltage of 13.5V and has a peak reflow temperature of 260°C. This network interface IC is designed for surface mount applications in telecommunications equipment.
TLE7250XSJ
INTERFACE CIRCUIT; Terminal Finish: NICKEL GOLD PALLADIUM; Moisture Sensitivity Level (MSL): 2A;
TLE7250XSJXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; No. of Functions: 1;
TLE7250SJ
CAN FD TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: NICKEL GOLD PALLADIUM;
TLE7251VLE
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HTSON; Package Shape: SQUARE; Terminal Pitch: .65 mm;
TLE7250GVIO
CAN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Length: 5 mm;
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