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TCAN1042HGVDQ1

Texas Instruments

TCAN1042HGVDQ1 by Texas Instruments

TCAN1042HGVDQ1 by Texas Instruments is an Ethernet transceiver with a data rate of 5 Mbps. It operates at a max temperature of 125°C and has a small outline package style. This network interface IC is suitable for military applications.

Median Price

$2.370

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 509 parts In-Stock

1+ parts

$2.370

100+ parts

$1.610

1k+ parts

$1.570

10k+ parts

$1.300

509

$2.370

$1.610

$1.570

$1.300

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$1.340

100+ parts

-

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700

$1.340

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-

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Digiode

USA . 2,678 parts In-Stock

1+ parts

$2.252

100+ parts

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2,678

$2.252

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Chip Stock

USA . 77,180 parts In-Stock

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77,180

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Vyrian

USA . 3,108 parts In-Stock

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3,108

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,772 parts In-Stock

1+ parts

$1.111

100+ parts

-

1k+ parts

-

10k+ parts

$1.089

6,772

$1.111

-

-

$1.089

Argo Parts USA

USA . 3,889 parts In-Stock

1+ parts

$1.111

100+ parts

-

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3,889

$1.111

-

-

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$1.313

100+ parts

-

1k+ parts

$1.261

10k+ parts

-

50

$1.313

-

$1.261

-

Ampacity Inc.

Singapore . 194 parts In-Stock

1+ parts

$2.010

100+ parts

-

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194

$2.010

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Corphita

USA . 3,596 parts In-Stock

1+ parts

$2.133

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3,596

$2.133

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Semicontronic

India . 418 parts In-Stock

1+ parts

$4.380

100+ parts

$4.270

1k+ parts

$4.249

10k+ parts

-

418

$4.380

$4.270

$4.249

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AZTECH Wire

Italy . 198 parts In-Stock

1+ parts

$5.441

100+ parts

-

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198

$5.441

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Corohmni

South Africa . 203 parts In-Stock

1+ parts

$8.636

100+ parts

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203

$8.636

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Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$8.844

100+ parts

$8.401

1k+ parts

$8.401

10k+ parts

-

40

$8.844

$8.401

$8.401

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Parana Technologies

USA . 98 parts In-Stock

1+ parts

$11.339

100+ parts

-

1k+ parts

$11.767

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98

$11.339

-

$11.767

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DigiPath Technology Company

USA . 2,088 parts In-Stock

1+ parts

$12.485

100+ parts

$11.486

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2,088

$12.485

$11.486

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ChromeModa Solutions

Germany . 2,418 parts In-Stock

1+ parts

$12.740

100+ parts

$10.447

1k+ parts

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2,418

$12.740

$10.447

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IDEA Electronic Components Group

UK . 1,564 parts In-Stock

1+ parts

$12.740

100+ parts

$12.103

1k+ parts

$11.466

10k+ parts

-

1,564

$12.740

$12.103

$11.466

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Microchip USA

USA . 1,857 parts In-Stock

1+ parts

$36.020

100+ parts

$35.500

1k+ parts

$35.250

10k+ parts

$34.990

1,857

$36.020

$35.500

$35.250

$34.990

Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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Lixinc

USA . 15,463 parts In-Stock

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15,463

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A-Z Elektronik GmbH

Germany . 1,559 parts In-Stock

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1,559

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Perfect Parts

USA . 706 parts In-Stock

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706

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Overview

Experience the highest quality and reliability with the TCAN1042HGVDQ1 from Texas Instruments. As a leader in the industry, Texas Instruments delivers exceptional products that surpass expectations. This Ethernet transceiver is perfect for network interfaces, offering seamless connectivity and ensuring smooth data transfer at a blazing 5 Mbps data rate. With its compact design and robust construction, it can withstand extreme temperatures and harsh environments. Trust in Texas Instruments to provide you with the best solution for your networking needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body enhances the product's durability and resistance to external factors, making it suitable for various network interface applications.

Surface Mount: YES

The surface mount feature enables easy installation and integration of the product onto circuit boards, contributing to efficient and streamlined manufacturing processes.

No. of Functions: 1

With a single function, this product simplifies network interface designs, reducing complexity and optimizing performance.

Screening Level: AEC-Q100

Meeting the stringent AEC-Q100 screening level ensures enhanced reliability and performance in critical automotive applications, making this product a reliable choice for network interfaces in vehicles.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility with various board layouts, maximizing flexibility in product placement and design.

No. of Terminals: 8

The presence of 8 terminals facilitates secure connections, ensuring stable and reliable data transmission across the network interface.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes this product compact and space-efficient, facilitating its use in applications with limited board space.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature tolerance of 125°C enables reliable functionality in demanding environments, making it a suitable choice for industrial and commercial network interfaces.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C ensures reliable operation even in extremely cold environments, expanding the product's suitability for a wide range of network interface applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold terminal finish provides excellent corrosion resistance and low electrical resistance, ensuring reliable connections and long-term performance.

Terminal Position: DUAL

The dual terminal position allows for versatile board mounting options, facilitating ease of installation and optimizing space utilization.

Maximum Seated Height: 1.75 mm

With a maximum seated height of 1.75 mm, this product offers a low-profile design, making it suitable for applications with height restrictions while maintaining efficient performance.

Width: 3.895 mm

The product's narrow width of 3.895 mm contributes to its compactness and compatibility with space-constrained network interface designs.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper and controlled soldering during manufacturing, guaranteeing reliable connections and long-term performance.

Peak Reflow Temperature °C: 260

This product can withstand a peak reflow temperature of 260°C, enabling it to undergo the soldering process without compromising its functionality and durability.

Length: 4.905 mm

The product's length of 4.905 mm further enhances its compatibility with compact network interface designs, enabling seamless integration into various applications.

Temperature Grade: MILITARY

This product's temperature grade, being military-grade, ensures exceptional reliability and performance in extreme temperature environments, making it an ideal choice for demanding military applications.

No. of Channels: 1

With a single channel, this product simplifies network interface configurations, reducing complexity and optimizing signal transmission efficiency.

Terminal Form: GULL WING

The gull wing terminal form allows for secure solder connections, ensuring long-term reliability and stable performance of the network interface.

No. of Transceivers: 1

The presence of a single transceiver streamlines network interface designs while maintaining efficient data transmission and compatibility with various communication protocols.

Maximum Supply Current: 110 mA

The maximum supply current rating of 110 mA ensures efficient power consumption, making this product an energy-efficient choice for network interfaces.

Telecom IC Type: ETHERNET TRANSCEIVER

Being an Ethernet transceiver, this product supports reliable and high-speed data transmission over Ethernet networks, making it an excellent choice for network interfaces in telecom applications.

Nominal Supply Voltage: 5 V

The product's nominal supply voltage of 5 V ensures compatibility with standard power sources, making it easy to integrate into various network interface designs.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm allows for precise connections and ease of assembly during manufacturing, ensuring reliable signal transmission across the network interface.

Data Rate: 5 Mbps

With a data rate of 5 Mbps, this product enables efficient and speedy data transfer, making it suitable for network interfaces requiring moderate to high-speed communication.

Moisture Sensitivity Level (MSL): 1

The moisture sensitivity level 1 ensures the product's reliability and functionality, even during challenges posed by humidity and moisture, making it a robust choice for network interfaces.

Technical Specifications

Network Interfaces TCAN1042HGVDQ1 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

5 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

110 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.895 mm

Trade Compliance

TCAN1042HGVDQ1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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