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TJA1040T/CM

NXP Semiconductors

TJA1040T/CM by NXP Semiconductors

NXP Semiconductors' TJA1040T/CM is an 8-terminal network interface IC with a small outline package. It features nickel palladium gold silver terminal finish, dual position, and gull wing form. Ideal for telecom applications, it operates at a nominal 5V supply voltage and withstands peak reflow temperature of 260°C for up to 30 seconds.

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16

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1k+

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Chip Stock

USA . 19,055 parts In-Stock

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Infinite Electronics LLP

India . 10,000 parts In-Stock

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Formix International

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Flip Electronics

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Digiode

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Sensible Micro Corp

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J2 Sourcing AB

Sweden . 1,106 parts In-Stock

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ComSIT Distribution GmbH

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Vyrian

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Rebound Electronics

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PC Components Company LLC

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Bristol Electronics

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Nova Conductors

Japan . 60 parts In-Stock

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Connect4Technologies Inc.

Canada . 21 parts In-Stock

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Cyclops Electronics Ltd

UK . 5 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 759 parts In-Stock

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$6.335

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$9.457

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$8.985

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Aztec Data Supply Inc.

USA . 3,245 parts In-Stock

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$10.040

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Corohmni

South Africa . 40 parts In-Stock

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Semicontronic

India . 1,198 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

Singapore . 1,498 parts In-Stock

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Epart123

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Israel . 519 parts In-Stock

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Overview

Unlock seamless communication with the TJA1040T/CM by NXP Semiconductors. Crafted with precision and reliability in mind, this network interface device offers unparalleled performance for a wide range of applications. From automotive to industrial settings, this small outline package boasts dual terminal positions and a nickel palladium gold silver finish for optimal connectivity. Elevate your projects with the superior quality and value of the TJA1040T/CM.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for use in various networking applications.

Surface Mount: YES

Being surface mountable, this product is easy to install onto circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on the circuit board, enabling compact and neat designs.

No. of Terminals: 8

With 8 terminals, this product offers multiple connection points, enhancing connectivity options in networking setups.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in reducing the overall footprint of the product, making it suitable for space-constrained applications.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The use of multiple terminal finish options ensures reliable and corrosion-resistant connections, improving the longevity and performance of the product.

Terminal Position: DUAL

Dual terminal position allows for flexibility in connecting the product to the circuit board, accommodating various wiring configurations.

Maximum Seated Height: 1.75 mm

The low maximum seated height enables the product to be installed in slim devices without adding bulk, maintaining a streamlined design.

Width: 3.9 mm

The narrow width of 3.9 mm contributes to space efficiency on the circuit board, enabling compact and organized networking layouts.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this product offers quick and efficient soldering during assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures secure and reliable solder joints, enhancing the overall quality and durability of the product.

Length: 4.9 mm

The compact length of 4.9 mm contributes to the overall small form factor of the product, making it suitable for space-sensitive networking applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering, ensuring secure connections for reliable networking performance.

Telecom IC Type: INTERFACE CIRCUIT

Designed as an interface circuit, this product facilitates seamless communication between different networking components, enhancing overall network functionality.

Nominal Supply Voltage: 5 V

With a nominal supply voltage of 5 V, this product is compatible with standard power sources, making it versatile for various networking applications.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise and secure connections, minimizing the risk of signal interference and ensuring reliable data transmission in networking setups.

Technical Specifications

Network Interfaces TJA1040T/CM attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TJA1040T/CM Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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