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TJA1050T/H/V,112

NXP Semiconductors

TJA1050T/H/V,112 by NXP Semiconductors

TJA1050T/H/V,112 by NXP Semiconductors is a network interface IC with 8 terminals and a supply voltage of 5V. It operates at temperatures ranging from -40 to 125°C and has a data rate of 1 Mbps. This IC is commonly used in automotive applications for interface circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,281 parts In-Stock

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Anansix

USA . 2,571 parts In-Stock

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Digiode

USA . 1,179 parts In-Stock

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Nova Conductors

Japan . 68 parts In-Stock

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Aztec Data Supply Inc.

USA . 74 parts In-Stock

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$10.890

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74

$10.890

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AZTECH Wire

Italy . 269 parts In-Stock

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$13.184

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Advanced Electronics

New Zealand . 10 parts In-Stock

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$13.772

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$13.084

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$13.084

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Microchip USA

USA . 270 parts In-Stock

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$16.623

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Corohmni

South Africa . 324 parts In-Stock

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$16.720

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Ampacity Inc.

Singapore . 672 parts In-Stock

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$128.000

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One Stop Electronics

USA . 810 parts In-Stock

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$198.000

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Semicontronic

India . 614 parts In-Stock

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$776.000

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$756.600

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$752.720

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UNI Independent Distributors

Spain . 7,091 parts In-Stock

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Corphita

USA . 3,571 parts In-Stock

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Argo Parts USA

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Bastille Electronics

Australia . 300 parts In-Stock

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Continental Prestige Electronics

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Modulus Dynamics

Lithuania . 51 parts In-Stock

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Overview

Experience the next level of network connectivity with the TJA1050T/H/V,112 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors brings you a top-quality product that guarantees seamless communication and enhanced performance. Designed for automotive applications, this small outline interface circuit offers incredible value and benefits to our customers. With its advanced CMOS technology and a data rate of 1 Mbps, it ensures fast and reliable transmission, while its durable plastic/epoxy package body material and nickel palladium gold terminal finish guarantee long-lasting durability. Upgrade your network interfaces today with the TJA1050T/H/V,112 and experience unparalleled connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and resistance against environmental factors, making this network interface suitable for a wide range of applications.

Surface Mount: YES

With surface mount capability, this network interface can be easily mounted onto circuit boards, allowing for efficient and straightforward integration into various electronic devices.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact form factor, making it ideal for space-constrained applications where size is a critical factor.

Power Supplies (V): 5

Operating at 5 volts, this network interface provides a standardized power supply, ensuring compatibility and ease of integration with other electronic components.

No. of Terminals: 8

The presence of 8 terminals enables multiple connections, facilitating robust and reliable data transmission between different components or systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances portability and makes it suitable for applications where size and weight are crucial considerations.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this network interface can withstand high-temperature environments, enhancing its reliability and suitability for demanding applications.

Minimum Operating Temperature: -40 °C

The network interface's minimum operating temperature of -40°C ensures its functionality even in extremely cold conditions, making it reliable across a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold as the terminal finish ensures excellent conductivity, corrosion resistance, and longevity, contributing to the product's overall reliability and durability.

Terminal Position: DUAL

The dual terminal position offers flexibility in connecting the network interface, allowing for various installation options, potentially simplifying the device integration process.

Maximum Seated Height: 1.75 mm

With a maximum seated height of 1.75 mm, this network interface contributes to the overall compactness of devices, making it a suitable choice for applications with space constraints.

Width: 3.9 mm

The narrow width of 3.9 mm contributes to the product's compact form factor and allows for efficient utilization of space in electronic devices.

Length: 4.9 mm

The length of 4.9 mm further enhances the product's compactness, making it an ideal choice for applications requiring miniaturization.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive standards, this network interface can withstand challenging conditions, such as temperature fluctuations and vibrations, making it suitable for automotive applications.

Technology: CMOS

Utilizing CMOS technology enhances the network interface's power efficiency, enabling longer battery life and energy savings in portable or low-power devices.

Terminal Form: GULL WING

The gull-wing terminal form allows for secure soldering and strong mechanical connections, ensuring reliable electrical contacts and contributing to the product's overall performance.

Maximum Supply Current: 0.075 mA

With a maximum supply current of 0.075 mA, this network interface operates on low power, making it suitable for energy-conscious applications and extending battery life.

Telecom IC Type: INTERFACE CIRCUIT

Being an interface circuit type, this network interface provides seamless connectivity and reliable data transfer between different telecommunication components, making it a suitable choice for telecommunication applications.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures compatibility with standard electronic systems, allowing for hassle-free integration and operation.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch provides appropriate spacing between terminals, making it easier for assembly and preventing accidental short-circuits during installation or maintenance.

Data Rate: 1 Mbps

With a data rate of 1 Mbps, this network interface supports high-speed data transmission, contributing to efficient and fast communication within the network.

Technical Specifications

Network Interfaces TJA1050T/H/V,112 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.075 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TJA1050T/H/V,112 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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