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TLE7250XLEXUMA1

Infineon Technologies

TLE7250XLEXUMA1 by Infineon Technologies

TLE7250XLEXUMA1 by Infineon Technologies is a network interface IC with 8 terminals, suitable for telecom applications. It operates at a nominal voltage of 5V and has a terminal pitch of 0.65mm. With AEC-Q100 screening level, it is designed for automotive environments.

Median Price

$1.548

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,131 parts In-Stock

1+ parts

-

100+ parts

$1.520

1k+ parts

$1.260

10k+ parts

$1.120

1,131

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$1.520

$1.260

$1.120

Verical

USA . 1,131 parts In-Stock

1+ parts

-

100+ parts

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$1.575

10k+ parts

$1.400

1,131

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-

$1.575

$1.400

Distributors (In-Stock)

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Chip Stock

USA . 24,103 parts In-Stock

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Vyrian

USA . 7,760 parts In-Stock

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7,760

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Ack Elektronik San.Tic.Ltd.Sti

. 1,000 parts In-Stock

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Digiode

USA . 204 parts In-Stock

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204

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,989 parts In-Stock

1+ parts

$1.060

100+ parts

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3,989

$1.060

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Microchip USA

USA . 1,893 parts In-Stock

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$7.842

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$7.842

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Corohmni

South Africa . 273 parts In-Stock

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$10.222

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273

$10.222

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AZTECH Wire

Italy . 288 parts In-Stock

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$13.500

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$13.500

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Component Stockers USA

USA . 10,396 parts In-Stock

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$13.950

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$13.950

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Aztec Data Supply Inc.

USA . 32,220 parts In-Stock

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$16.639

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$16.639

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Modulus Dynamics

Lithuania . 605 parts In-Stock

1+ parts

$17.934

100+ parts

$17.217

1k+ parts

$16.499

10k+ parts

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605

$17.934

$17.217

$16.499

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QUARKTWIN TECHNOLOGY LTD

USA . 27,412 parts In-Stock

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RC Electronics

USA . 16,200 parts In-Stock

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$1.440

1k+ parts

$1.360

10k+ parts

$1.330

16,200

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$1.440

$1.360

$1.330

Continental Prestige Electronics

USA . 1,194 parts In-Stock

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1,194

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Aranea Global

USA . 500 parts In-Stock

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500

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Argo Parts USA

USA . 322 parts In-Stock

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322

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Corphita

USA . 106 parts In-Stock

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106

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Overview

Unlock seamless communication with the TLE7250XLEXUMA1 by Infineon Technologies, a top-notch network interface designed to elevate your connectivity experience. Infineon's reputation for excellence ensures unmatched quality and reliability, making this product a standout choice in its category. Ideal for a wide range of applications, this innovative solution offers unparalleled value, benefits, and advantages to customers seeking efficient and robust network interfaces. Experience the difference with the TLE7250XLEXUMA1 and take your communication capabilities to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the network interface, ensuring a long lifespan.

Surface Mount: YES

Being surface mountable makes installation of this network interface quick and easy, saving time and effort.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality, making this network interface suitable for automotive applications.

No. of Terminals: 8

The 8 terminals provide sufficient connectivity options for interfacing with other components in the network.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V makes this network interface compatible with standard power sources, simplifying integration into existing systems.

Technical Specifications

Network Interfaces TLE7250XLEXUMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

2A

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

1.15 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TLE7250XLEXUMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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