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TJA1050T/V,112

NXP Semiconductors

TJA1050T/V,112 by NXP Semiconductors

NXP Semiconductors' TJA1050T/V,112 is a network interface IC with 8 terminals and 5V supply voltage. It operates at data rates up to 1 Mbps, suitable for automotive applications due to its temperature range of -40 to 125°C. The small outline package with gull wing terminals makes it ideal for surface mount designs in various electronic systems.

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4

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1k+

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Vyrian

USA . 11,929 parts In-Stock

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Digiode

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Nova Conductors

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Anansix

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Aztec Data Supply Inc.

USA . 4,607 parts In-Stock

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$6.193

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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AZTECH Wire

Italy . 843 parts In-Stock

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Corohmni

South Africa . 342 parts In-Stock

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One Stop Electronics

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Semicontronic

India . 663 parts In-Stock

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$586.950

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$583.940

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Ampacity Inc.

Singapore . 1,595 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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UNI Independent Distributors

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Microchip USA

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Corphita

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Continental Prestige Electronics

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Bastille Electronics

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Argo Parts USA

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Overview

Unlock seamless communication and unparalleled reliability with the NXP Semiconductors TJA1050T/V,112 Network Interface. Crafted to perfection by industry leaders, this interface offers unrivaled quality and performance for a wide range of applications. With its advanced technology and innovative design, this product ensures optimal connectivity and efficiency. Experience the value and benefits that this top-of-the-line device brings to your projects. Elevate your networking capabilities with the TJA1050T/V,112 and stay ahead of the curve in today's fast-paced digital world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the product lightweight and durable, perfect for use in a variety of settings.

Surface Mount: YES

Being surface mountable allows for easy installation on circuit boards, saving space and making the product suitable for compact designs.

Power Supplies (V): 5

Operating at a standard 5V power supply makes it compatible with most setups, ensuring ease of integration.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environments and prolonged use without overheating.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, improving overall performance and efficiency.

Technical Specifications

Network Interfaces TJA1050T/V,112 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.075 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TJA1050T/V,112 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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