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TJA1052IT/1

NXP Semiconductors

TJA1052IT/1 by NXP Semiconductors

NXP Semiconductors' TJA1052IT/1 is a 16-terminal network interface IC with AEC-Q100 screening for automotive applications. It operates at 1 Mbps data rate, supports dual terminal position, and has a nominal voltage of 5V. The small outline package style measures 10.3mm x 7.5mm x 2.65mm and can withstand temperatures from -40°C to 125°C, making it ideal for automotive communication systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,988 parts In-Stock

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Anansix

USA . 2,539 parts In-Stock

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Digiode

USA . 2,110 parts In-Stock

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Nova Conductors

Japan . 19 parts In-Stock

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Aztec Data Supply Inc.

USA . 935 parts In-Stock

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$7.580

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$7.580

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AZTECH Wire

Italy . 13,131 parts In-Stock

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$8.890

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Corohmni

South Africa . 64 parts In-Stock

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Semicontronic

India . 1,397 parts In-Stock

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$384.000

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$374.400

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$372.480

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Ampacity Inc.

Singapore . 365 parts In-Stock

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$776.000

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One Stop Electronics

USA . 826 parts In-Stock

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Continental Prestige Electronics

USA . 4,692 parts In-Stock

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Corphita

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UNI Independent Distributors

Spain . 3,549 parts In-Stock

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Lixinc

USA . 2,347 parts In-Stock

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Argo Parts USA

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Bastille Electronics

Australia . 650 parts In-Stock

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Formix International (Excess)

India . 640 parts In-Stock

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Supply Digital

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Overview

Upgrade your network interfaces with the top-quality TJA1052IT/1 from NXP Semiconductors. Designed for automotive applications, this interface circuit offers unparalleled reliability and performance. With a wide operating temperature range and low power consumption, this small outline package provides a seamless integration solution for your automotive systems. Trust NXP Semiconductors for cutting-edge technology that delivers value and efficiency to your projects. Elevate your networks with the TJA1052IT/1 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, suitable for various applications.

Surface Mount: YES

With surface mount capability, this product is easy to install and saves space on PCBs.

Screening Level: AEC-Q100

Meeting AEC-Q100 screening level standards ensures reliability and high performance in automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient utilization of board space and easy integration into designs.

Power Supplies (V): 3.3/5,5

Supports multiple power supply options, providing flexibility and compatibility with different systems.

No. of Terminals: 16

The 16 terminals enable connectivity with other components, enhancing the product's functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for compact designs in various applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance in extreme cold conditions.

Terminal Position: DUAL

Dual terminal positions offer improved signal integrity and stability in connection.

Maximum Seated Height: 2.65 mm

The low seated height allows for a slim profile and easy integration into tight spaces.

Width: 7.5 mm

The compact width of the product saves space on the PCB and facilitates efficient board layout.

Length: 10.3 mm

The length of 10.3 mm makes this product suitable for applications where space is limited.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets industry standards for performance and reliability.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering during installation.

Maximum Supply Current: 0.07 mA

The low maximum supply current helps conserve energy and extends the product's battery life.

Telecom IC Type: INTERFACE CIRCUIT

Designed as an interface circuit, this product enables seamless communication between different systems.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures compatibility with a wide range of systems and devices.

Terminal Pitch: 1.27 mm

The standard terminal pitch of 1.27 mm facilitates easy connectivity and interfacing with other components.

Data Rate: 1 Mbps

With a data rate of 1 Mbps, this product is suitable for high-speed data transmission applications.

Technical Specifications

Network Interfaces TJA1052IT/1 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

No. of Functions:

1

No. of Terminals:

16

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3/5,5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

2.65 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.07 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TJA1052IT/1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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