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DP83865DVH/NOPB

Texas Instruments

DP83865DVH/NOPB by Texas Instruments

DP83865DVH/NOPB by Texas Instruments is an Ethernet transceiver with a data rate of 1000 Mbps. It operates at temperatures from 0 to 70°C and has a supply voltage of 1.8V. This network interface IC comes in a rectangular package style, suitable for surface mount applications.

Median Price

$20.710

Lifecycle Status

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29

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1k+

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Mouser Electronics

USA . 335 parts In-Stock

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Chip1Stop

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Rochester

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$17.440

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Digiode

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Nova Conductors

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Flex Direct, LLC

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Atlantic Semiconductor

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Rebound Electronics

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Electronics Depot

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Component Sense

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Connect4Technologies Inc.

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Prism Electronics

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PC Components Company LLC

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Corohmni

South Africa . 1,138 parts In-Stock

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$4.925

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Parana Technologies

USA . 1,752 parts In-Stock

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$9.535

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$10.133

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ChromeModa Solutions

Germany . 2,585 parts In-Stock

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$10.713

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$8.785

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IDEA Electronic Components Group

UK . 2,095 parts In-Stock

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$10.177

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$9.642

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Semicontronic

India . 228 parts In-Stock

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Ampacity Inc.

Singapore . 98 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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AZTECH Wire

Italy . 584 parts In-Stock

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Corphita

USA . 2,543 parts In-Stock

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Continental Prestige Electronics

USA . 4,556 parts In-Stock

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Netroflash

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QUARKTWIN TECHNOLOGY LTD

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GreenTree Electronics

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Epart123

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Glotronic Ltd.

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Argo Parts USA

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Futuretech Components

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DigiPath Technology Company

USA . 1,363 parts In-Stock

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Metaverse IC Inc.

Canada . 1,254 parts In-Stock

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iodParts Technologies Inc.

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Cyclops Electronics Ltd (Excess)

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Overview

Unlock seamless connectivity with the Texas Instruments DP83865DVH/NOPB Ethernet Transceiver. Crafted with precision and reliability, this network interface device offers unmatched performance in a variety of applications. From industrial automation to telecommunications, this innovative product ensures fast and secure data transfer. Experience the value of superior quality and cutting-edge technology with Texas Instruments, setting the standard for excellence in networking solutions. Elevate your connectivity experience with the DP83865DVH/NOPB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material ensures durability and reliability for long-term usage.

Surface Mount: YES

Being surface mountable makes the installation of this network interface easier and more space-efficient on circuit boards.

No. of Terminals: 128

Having a higher number of terminals allows for more connections and capabilities within the network interface.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures that the network interface can function effectively even under demanding environmental conditions.

Nominal Supply Voltage: 1.8 V

The low nominal supply voltage makes this network interface energy-efficient and cost-effective to operate.

Data Rate: 1000 Mbps

With a high data rate of 1000 Mbps, this network interface provides fast and reliable data transfer speeds for efficient network performance.

Technical Specifications

Network Interfaces DP83865DVH/NOPB attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1000 Mbps

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

128

No. of Transceivers:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.67X.93,20

Package Shape:

Package Style (Meter):

FLATPACK, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.8,2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

3.15 mm

Sub-Category:

Network Interfaces

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

DP83865DVH/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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