Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TLE9250VLEXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, small outline package style, and tin terminal finish. It operates at a nominal voltage of 5V and has a terminal pitch of 0.65mm. Ideal for automotive applications requiring network interfaces in compact spaces.
Median Price
$1.480
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13
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1k+
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Farnell
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Element14
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$0.892
Rochester
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RS (Exports)
$1.426
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Nova Conductors
$1.002
Digiode
$1.197
Vyrian
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$0.650
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Ampacity Inc.
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Corohmni
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Microchip USA
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Aztec Data Supply Inc.
$13.780
Continental Prestige Electronics
$0.877
Netroflash
$0.982
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This material offers good durability and protection for the network interface, making it suitable for various environments.
Allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.
Compliance with AEC-Q100 automotive quality standards ensures reliability and performance in automotive applications.
The square shape helps in maximizing space efficiency on the PCB, allowing for more components in a compact design.
Having 8 terminals provides flexibility in connecting the network interface to other components, enabling versatile connectivity options.
Tin terminal finish offers good solderability and conductivity, ensuring reliable electrical connections.
Low seated height helps in creating a slim profile for the network interface, ideal for space-constrained applications.
Compact width dimensions contribute to space-saving benefits and ease of integration into electronic systems.
The length of 3mm aids in overall compactness of the network interface, suitable for small form factor designs.
No lead terminals are environmentally friendly and offer better electrical performance and reliability compared to traditional leaded components.
Operating at a standard voltage of 5V makes it compatible with a wide range of electronic systems and power sources.
The fine terminal pitch of 0.65mm allows for high-density mounting on PCBs, enabling more functionality in limited space.
MSL 2A rating indicates good resistance to moisture, ensuring reliability in humid environments and during manufacturing processes.
Network Interfaces TLE9250VLEXUMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies
JESD-30 Code:
JESD-609 Code:
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TLE9250VLEXUMA1 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Mult Dev DS Chg 8/Nov/2019 TLE925yyy Datasheet Chg 9/Jul/2018
PCN Packaging - Mult Dev Pkg Box Chg 3/Jan/2018 Mult Dev Reel Design Chg 2/Dec/2019
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
BAV99
Electronic Devices
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Microsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Lite-on Semiconductor
LM317AEMP/NOPB
Texas Instruments
LM317AEMP/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and a max output current of 1.5A. It operates in temperatures ranging from -40°C to 125°C, making it suitable for various applications requiring precise voltage regulation in a compact package.
Shanghai Lunsure Electronic Technology
BSS138LT1G
Onsemi
BSS138LT1G by Onsemi is a N-CHANNEL FET with 50V DS Breakdown Voltage, 0.2A Drain Current, and 3.5 ohm On Resistance. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE. Operates b/w -55 to 150 °C with small outline package style for surface mount assembly.
BSS138LT3G
BSS138LT3G by Onsemi is a N-CHANNEL FET with a min DS breakdown voltage of 50V. It is used for switching applications and has a max drain current of 0.2A and max drain-source on resistance of 3.5 ohm.
LM358N
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LL4148
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
International Semiconductor
2N7002-7-F
Diodes Incorporated
Diodes Inc. 2N7002-7-F is a N-channel FET with 60V DS breakdown voltage, 0.115A max drain current, and 13.5 ohm RDS(on). Ideal for switching applications in enhancement mode operation. Features Gull Wing terminals, small outline package style, and operates up to 150°C.
Hy Electronic
RC0402FR-0710KL
Yageo
Yageo's RC0402FR-0710KL is a 10000 ohm SMT fixed resistor with 1% tolerance, suitable for applications requiring a rated power dissipation of 0.0625 W. With a temperature coefficient of 100 ppm/°C, it operates b/w -55 to 155 °C, making it ideal for various electronic circuits.
Baneasa S A
2N2222A
New Jersey Semiconductor Products
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
LM555CN
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
MBR0520LT3G
MBR0520LT3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, ideal for applications requiring high-speed switching and low power loss in compact electronic devices. The package style is small outline, making it suitable for surface mount designs in various electronics.
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Peak Reflow Temperature (C): 260; No. of Phases: 1; Diode Element Material: SILICON;
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .1 A;
SS14
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Non Repetitive Peak Forward Current: 40 A; Technology: SCHOTTKY; No. of Elements: 1;
KSZ8041NLI
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
AR8035-AL1B-R
Qualcomm
The Qualcomm AR8035-AL1B-R is a network interface chip with 48 terminals and a very thin profile. It operates at temperatures ranging from -40 to 85 °C and has a data rate of 1000 Mbps. It is commonly used as an Ethernet transceiver in industrial applications.
MCP2562-E/SNVAO
Microchip Technology
MCP2562-E/SNVAO by Microchip is an AEC-Q100, TS 16949 compliant CAN transceiver with 1Mbps data rate. Operating at -40 to 125°C, it has a nominal voltage of 5V and max supply current of 70mA. Ideal for automotive applications due to its small outline package and gull wing terminal form.
KSZ8851SNL-TR
KSZ8851SNL-TR by Microchip: Ethernet transceiver with 32 terminals, CMOS tech, 1.8V supply voltage. Square chip carrier for network interfaces, operates b/w 0-70°C. Ideal for telecom applications requiring a very thin profile and low power consumption.
LTC2875MPDD#PBF
Linear Technology
INTERFACE CIRCUIT; Temperature Grade: MILITARY; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE;
DP83848IVV/NOPB
National Semiconductor
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
MAX14882AWE+T
Maxim Integrated
INTERFACE CIRCUIT; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: MATTE TIN;
UJA1169ATK/X/FZ
UJA1169ATK/X/FZ by NXP Semiconductors is a CAN FD transceiver with 20 terminals, suitable for automotive applications. It operates at a nominal voltage of 13V and supports data rates up to 15 Mbps. This small outline package has a terminal pitch of 0.5mm and can handle a max supply current of 67mA.
MCP2562FDT-E/SNVAO
MCP2562FDT-E/SNVAO by Microchip: CAN FD transceiver with 8 Mbps data rate, operates at -40 to 125 °C, suitable for automotive applications. Features AEC-Q100 screening level, small outline package style, and matte tin terminal finish.
MAX13054ASA
MAX13054ASA by Maxim Integrated is a Network Interface with 8 terminals, operating at -40 to 125°C. It has a data rate of 1 Mbps and supports supply voltages of 3.3V and 5V. Ideal for automotive applications due to its BICMOS technology and small outline package style.
SN65HVD230DRG4
SN65HVD230DRG4 by Texas Instruments is a BICMOS technology interface circuit with 1Mbps data rate and 3.3V nominal voltage. It operates in industrial temperature range (-40 to 85°C) and has a small outline package suitable for network interfaces applications. With surface mount capability, it features dual terminals with Ni/Pd/Au finish.
KSZ9031RNXUB-VAO
Microchip Technology's KSZ9031RNXUB-VAO is an Ethernet transceiver with 1000 Mbps data rate, AEC-Q100 screening level, and operates at -40 to 85°C. It has a square chip carrier package style suitable for industrial applications requiring reliable network interfaces.
KSZ8041TL
ETHERNET TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: TFQFP; Package Shape: SQUARE;
TJA1028TK/5V0/20:1
NXP Semiconductors' TJA1028TK/5V0/20:1 is a LIN transceiver with 1 function, operating at -40 to 150°C. It has a supply voltage of 3.3V and draws a max current of 4.5mA. This small outline package with 8 terminals is ideal for automotive network interfaces.
MCP2542FD-E/MF
MCP2542FD-E/MF by Microchip is a CAN FD transceiver with 8 Mbps data rate, suitable for automotive applications. It operates at -40 to 125°C temperature range and requires 5V nominal voltage. The package style is small outline, heat sink/slug, very thin profile with matte tin terminal finish.
TCAN330GDCNR
TCAN330GDCNR by Texas Instruments is a Network Interface IC with 8 terminals, operating temperature range of -40 to 125°C, and data rate of 5 Mbps. It is designed for automotive applications requiring a small outline package with low profile and shrink pitch.
KSZ8081MNXCA
KSZ8081MNXCA by Microchip: Ethernet transceiver IC with 100 Mbps data rate, operates at 3.3V supply voltage. Ideal for network interfaces, features TS 16949 screening level and operates b/w 0-70°C.
TJA1042T/CM,118
NXP Semiconductors' TJA1042T/CM,118 is a network interface IC with 8 terminals and AEC-Q100 screening. Operating at 5V, it supports data rates up to 1 Mbps for automotive applications. The small outline package with dual terminal position makes it suitable for compact designs in harsh environments.
TCAN1044AVDDFRQ1
TCAN1044AVDDFRQ1 by Texas Instruments is a CAN FD transceiver with 8 Mbps data rate, operating at -40 to 150°C. It features a small outline package with dual terminals and nickel palladium gold finish, suitable for automotive applications meeting AEC-Q100 standards. The device has a nominal voltage of 5V and max supply current of 130mA, making it ideal for network interfaces in harsh environments.
PCA82C250T/N4,115
PCA82C250T/N4,115 by NXP Semiconductors is an 8-terminal interface circuit with a 5V supply voltage. It operates in automotive-grade temperatures (-40 to 125°C) and features BICMOS technology. Ideal for network interfaces, this small-outline package with gull wing terminals is suitable for surface-mount applications.
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TLE9251VSJXUMA1
Infineon Technologies
TLE9251VSJXUMA1 by Infineon Technologies is a network interface IC with 8 terminals and a small outline package style. It operates at a nominal voltage of 5V and has a max seated height of 1.73mm. This IC is commonly used in telecom applications for interface circuit purposes.
TLE9252VLCXUMA1
INTERFACE CIRCUIT; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 2A; JESD-609 Code: e3;
TLE9252VSKXUMA1
TLE9252VSKXUMA1 by Infineon is a CAN FD transceiver with 5 Mbps data rate, AEC-Q100 screening, and 5V supply voltage. Ideal for automotive applications due to its small outline package and operating temperature range of -40 to 150°C.
TLE9255WSKXUMA2
TLE9255WSKXUMA2 by Infineon Technologies is a small outline network interface IC with 14 terminals, GULL WING form, and 1.27mm pitch. It operates at 5V nominal voltage and AEC-Q100 screening level suitable for automotive applications. The package dimensions are 4mm x 8.75mm x 1.75mm, making it ideal for compact designs in the automotive industry.
TLE9251VLEXUMA1
TLE9251VLEXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, 5V supply voltage, and 0.65mm terminal pitch. It is designed for automotive applications requiring a small outline package with heat sink, suitable for surface mount assembly. The IC's compact size of 3x3mm and low seated height of 1.1mm make it ideal for space-constrained environments in vehicles.
TLE9255WLCXUMA1
TLE9255WLCXUMA1 by Infineon Technologies is a network interface IC with 14 terminals, AEC-Q100 screening level, and 5V nominal voltage. It is designed for automotive applications requiring a small outline package with surface mount capability and dual terminal position.
TLE9250XLEXUMA1
TLE9250XLEXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, 0.65mm pitch, and 5V supply voltage. Its small outline package makes it suitable for automotive applications requiring a compact design and high reliability in harsh environments. The no-lead terminal form and thin profile enhance space efficiency while ensuring robust performance.
TLE9250XSJXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: NICKEL GOLD PALLADIUM;
TLE9250VSJXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
TLE9250SJXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
TLE9250LEXUMA1
TLE9250LEXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, 5V supply voltage, and 0.65mm terminal pitch. It is a small outline package suitable for automotive applications requiring network interfaces. The IC features a square shape, tin finish, and thin profile design for space-constrained installations.
TLE9251VSJXUMA1/SAMPLE
INTERFACE CIRCUIT;
TLE92613BQXXUMA1
CAN FD TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Position: QUAD;
TLE9261BQXV33XUMA1
CAN FD TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
TLE9261BQXXUMA1
CAN FD TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Supply Current: 6.5 mA;
TLE94613ESV33XUMA1
CAN FD TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: HTSSOP; Package Shape: RECTANGULAR; Package Equivalence Code: TSSOP24,.25;
TLE9351VSJXTMA1
CAN FD TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G8;
TLE92613BQXV33XUMA1
CAN FD TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Pitch: .5 mm;
TLE9271QXV33XUMA1
CAN FD TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Package Equivalence Code: LCC48,.27SQ,20;
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