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TLE9261BQXXUMA1

Infineon Technologies

TLE9261BQXXUMA1 by Infineon Technologies

TLE9261BQXXUMA1 by Infineon is a CAN FD transceiver with 48 terminals in a chip carrier package. It operates at temperatures from -40 to 150°C, drawing a max of 6.5mA at 13.5V supply voltage. Ideal for automotive network interfaces due to AEC-Q100 screening and 5Mbps data rate support.

Median Price

$3.310

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 59 parts In-Stock

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$3.310

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59

$3.310

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AGACORP

USA . 7,500 parts In-Stock

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7,500

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Vyrian

USA . 3,788 parts In-Stock

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3,788

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Digiode

USA . 461 parts In-Stock

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461

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LIBRA Elektronik GmbH

Germany . 173 parts In-Stock

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173

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,913 parts In-Stock

1+ parts

$3.310

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$3.244

2,913

$3.310

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$3.244

Argo Parts USA

USA . 1,781 parts In-Stock

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$3.310

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1,781

$3.310

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Component Stockers USA

USA . 2,575 parts In-Stock

1+ parts

$3.740

100+ parts

$2.760

1k+ parts

$1.980

10k+ parts

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2,575

$3.740

$2.760

$1.980

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Aztec Data Supply Inc.

USA . 37,935 parts In-Stock

1+ parts

$4.860

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37,935

$4.860

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Corohmni

South Africa . 1,046 parts In-Stock

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$8.183

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1,046

$8.183

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Modulus Dynamics

Lithuania . 2,976 parts In-Stock

1+ parts

$12.195

100+ parts

$11.707

1k+ parts

$11.219

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2,976

$12.195

$11.707

$11.219

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AZTECH Wire

Italy . 764 parts In-Stock

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$18.605

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764

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Microchip USA

USA . 2,326 parts In-Stock

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$18.887

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$18.887

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Ampacity Inc.

Singapore . 664 parts In-Stock

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$423.000

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664

$423.000

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Perfect Parts

USA . 22,400 parts In-Stock

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22,400

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GreenTree Electronics

Israel . 5,000 parts In-Stock

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5,000

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Corphita

USA . 425 parts In-Stock

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425

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Netroflash

USA . 100 parts In-Stock

1+ parts

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100+ parts

$3.244

1k+ parts

$3.144

10k+ parts

$3.078

100

-

$3.244

$3.144

$3.078

Overview

Unlock a world of possibilities with the TLE9261BQXXUMA1 by Infineon Technologies. As a leading manufacturer in network interfaces, Infineon delivers top-quality products that redefine connectivity. With applications ranging from automotive to industrial, this CAN FD transceiver offers unparalleled performance and reliability. Experience seamless communication, enhanced efficiency, and innovative solutions with the TLE9261BQXXUMA1. Elevate your projects with the best in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy, the package body material ensures durability and reliability for long-term usage.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into various devices.

Screening Level: AEC-Q100

With AEC-Q100 screening level, this product is designed to meet automotive industry standards for quality and reliability.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C ensures stable performance even in harsh environments.

Maximum Supply Current: 6.5 mA

With a low maximum supply current of 6.5 mA, this product is energy-efficient and helps in reducing power consumption.

Technical Specifications

Network Interfaces TLE9261BQXXUMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

Data Rate:

5 Mbps

JESD-30 Code:

S-PQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

No. of Transceivers:

1

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Maximum Supply Current:

6.5 mA

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TLE9261BQXXUMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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