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BSS123,215

NXP Semiconductors

BSS123,215 by NXP Semiconductors

NXP Semiconductors' BSS123,215 is a N-CHANNEL FET for SWITCHING applications. Features include 100V DS Breakdown Voltage, 0.17A Drain Current, and 6 ohm On Resistance. With GULL WING terminals and ENHANCEMENT MODE operation, it's ideal for small outline packages in various electronic devices.

Median Price

$0.056

Lifecycle Status

Suppliers In-Stock

39

In-Stock Inventory

1k+

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Adafruit Industries

USA . 86 parts In-Stock

1+ parts

$1.017

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$0.925

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$0.834

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$1.017

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$0.834

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EBV Elektronik

Germany . 4,725,000 parts In-Stock

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Arrow

USA . 876,000 parts In-Stock

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Farnell

UK . 516,000 parts In-Stock

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Element14

Singapore . 516,000 parts In-Stock

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Verical

USA . 369,000 parts In-Stock

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TTI

USA . 297,000 parts In-Stock

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RS (Exports)

UK . 246,000 parts In-Stock

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Future Electronics

Canada . 45,000 parts In-Stock

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Elektronika Sales Private Limited

India . 30,000 parts In-Stock

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Chip1Stop

Japan . 2,667 parts In-Stock

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Rochester

USA . 3 parts In-Stock

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Digiode

USA . 524 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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Maritex

Poland . 3,897 parts In-Stock

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TME

Poland . 42,315 parts In-Stock

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IBS Electronics

USA . 549,000 parts In-Stock

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NAC Semi

USA . 114,000 parts In-Stock

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Sensible Micro Corp

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Schukat

Germany . 52,800 parts In-Stock

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Micros

Poland . 38,880 parts In-Stock

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Partservice

France . 37,730 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 22,978 parts In-Stock

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Component Sense

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SOS electronic

Slovakia . 10,000 parts In-Stock

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ACDS - Activité Composants Distribution Service

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ComSIT Distribution GmbH

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Bristol Electronics

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Vyrian

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Micros sp.j. W. Kędra i J. Lic

Poland . 6,000 parts In-Stock

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Chip Stock

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Semtec, LLC

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Semicontronic

India . 2,378,001 parts In-Stock

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Corphita

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Ampacity Inc.

Singapore . 530,877 parts In-Stock

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AZTECH Wire

Italy . 13,382 parts In-Stock

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Argo Parts USA

USA . 1,943 parts In-Stock

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Advanced Electronics

New Zealand . 344 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,018 parts In-Stock

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Modulus Dynamics

Lithuania . 14,465 parts In-Stock

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Perfect Parts

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Eastek

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Continental Prestige Electronics

USA . 438,000 parts In-Stock

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Lucentia Tech

USA . 43,472 parts In-Stock

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BidChips

USA . 19,665 parts In-Stock

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iBuyXS LLC

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Kepictronics

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Robosynatics

Brazil . 10,868 parts In-Stock

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$0.672

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$0.672

QUARKTWIN TECHNOLOGY LTD

USA . 7,389 parts In-Stock

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Authorized Procurement Solutions

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Infinite Electronics LLP (Excess)

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Supply Digital

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Overview

Unlock the power of cutting-edge technology with the BSS123,215 by NXP Semiconductors. Designed for high-performance switching applications, this N-CHANNEL FET offers unparalleled reliability and efficiency. With a maximum operating temperature of 150°C and a minimum DS breakdown voltage of 100V, this transistor is built to withstand even the most demanding environments. Whether you're looking to enhance your electronic projects or streamline your industrial processes, the BSS123,215 delivers unmatched value and performance. Experience the difference with NXP Semiconductors today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and provides good heat dissipation, making the product durable and reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher mobility and conductivity, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the transistor from reverse voltage spikes, enhancing overall performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and efficient operation in various electronic circuits.

Surface Mount: YES

Easily mountable on PCBs, saving space and facilitating automated assembly processes.

Minimum DS Breakdown Voltage: 100 V

Can handle high voltage applications safely, providing reliable performance in demanding conditions.

Package Shape: RECTANGULAR

The rectangular shape allows for easy placement and alignment on circuit boards, optimizing space utilization.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and ease of soldering during assembly, ensuring good electrical contact.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the transistor's conductivity and enable precise switching operations.

Maximum Drain Current (Abs) (ID): 0.17 A

Capable of handling high currents, making it suitable for power switching applications.

No. of Terminals: 3

The three terminals provide necessary connections for the FET to function effectively in a circuit.

Maximum Power Dissipation (Abs): 0.36 W

Can dissipate heat efficiently, ensuring stable operation under high power conditions.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on PCBs and allows for high-density circuit designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good performance characteristics, such as low input capacitance and high switching speeds.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without performance degradation, suitable for industrial applications.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its reliability and stability in electronic devices.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, enhancing the FET's reliability in different environments.

Maximum Drain-Source On Resistance: 6 ohm

Low on-resistance results in minimal power loss and improved efficiency in switching applications.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit design and allows for versatile connections in different applications.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified duration during soldering processes without compromising its performance.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures during assembly processes, ensuring reliability in manufacturing.

Maximum Feedback Capacitance (Crss): 10 pF

Low feedback capacitance results in minimal signal distortion and improved high-frequency performance in amplifying circuits.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS123,215 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

.17 A

Maximum Drain Current (ID):

.15 A

Maximum Drain-Source On Resistance:

6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

10 pF

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSS123,215 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.95

SB

8541.21.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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