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MGSF1N03LT1G

Onsemi

MGSF1N03LT1G by Onsemi

MGSF1N03LT1G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 1.6A, 0.1 ohm Drain-Source Resistance, and operates in ENHANCEMENT MODE. With GULL WING terminals and METAL-OXIDE SEMICONDUCTOR technology, it offers reliable performance in small outline packages at up to 150°C.

Median Price

$0.130

Lifecycle Status

Suppliers In-Stock

32

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1k+

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Newark

USA . 645 parts In-Stock

1+ parts

$0.780

100+ parts

$0.344

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$0.217

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645

$0.780

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Future Electronics

Canada . 2,211,000 parts In-Stock

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Chip1Stop

Japan . 285,000 parts In-Stock

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Arrow

USA . 192,000 parts In-Stock

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Verical

USA . 192,000 parts In-Stock

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Element14

Singapore . 5,358 parts In-Stock

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Farnell

UK . 4,949 parts In-Stock

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Adafruit Industries

USA . 35 parts In-Stock

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TME

Poland . 46 parts In-Stock

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$0.310

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$0.173

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$0.126

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$0.099

46

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Digiode

USA . 718 parts In-Stock

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$0.494

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Maritex

Poland . 45,179 parts In-Stock

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$0.142

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$0.077

Nova Conductors

Japan . 10 parts In-Stock

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$1.000

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NAC Semi

USA . 2,679,000 parts In-Stock

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IBS Electronics

USA . 173,000 parts In-Stock

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Chip Stock

USA . 122,385 parts In-Stock

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Component Sense

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Vyrian

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ComSIT Distribution GmbH

Germany . 2,485 parts In-Stock

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Velocity Electronics

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Sea View Technologies

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Sensible Micro Corp

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Connect4Technologies Inc.

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Microfarads

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ACDS - Activité Composants Distribution Service

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EPE Components Inc.

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Holdelec - ElecDif-Pro

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Prism Electronics

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Sunrise Surplus Inc.

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NPI Materials, Inc.

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North Shore Components

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Ampacity Inc.

Singapore . 92,418 parts In-Stock

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$0.056

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Semicontronic

India . 90,667 parts In-Stock

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Corohmni

South Africa . 192 parts In-Stock

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Continental Prestige Electronics

USA . 5,882 parts In-Stock

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Argo Parts USA

USA . 466 parts In-Stock

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Corphita

USA . 1,520 parts In-Stock

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$0.468

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Netroflash

USA . 2,000 parts In-Stock

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Aztec Data Supply Inc.

USA . 725 parts In-Stock

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$1.694

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Perfect Parts

USA . 273,802 parts In-Stock

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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RC Electronics

USA . 71,869 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 25,381 parts In-Stock

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Infinite Electronics LLP (Excess)

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Kulean Microsystems

USA . 8,169 parts In-Stock

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Kepictronics

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S.R.D Solutions

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Lixinc

USA . 4,729 parts In-Stock

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TANS Electronics

Latvia . 4,146 parts In-Stock

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Problanco Electronics

Mexico . 3,557 parts In-Stock

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Eastek

USA . 3,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,994 parts In-Stock

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iodParts Technologies Inc.

India . 2,485 parts In-Stock

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SupplyDigital Components

Austria . 1,682 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 1,380 parts In-Stock

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Authorized Procurement Solutions

USA . 1,280 parts In-Stock

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GreenTree Electronics

Israel . 873 parts In-Stock

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Modulus Dynamics

Lithuania . 870 parts In-Stock

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UHIMA Technologies

Türkiye . 627 parts In-Stock

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Robosynatics

Brazil . 150 parts In-Stock

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Lucentia Tech

USA . 150 parts In-Stock

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Advanced Electronics

New Zealand . 35 parts In-Stock

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Overview

Unleash the power of innovation with the MGSF1N03LT1G by Onsemi. This small signal field effect transistor is a game-changer in the world of switching applications, offering unmatched performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this N-channel transistor boasts a single configuration with a built-in diode, making it versatile and efficient. With a high DS breakdown voltage of 30V and a maximum drain current of 1.6A, this transistor is designed to exceed expectations. Say goodbye to limitations and hello to limitless possibilities with the MGSF1N03LT1G by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and cost-effective.

Polarity or Channel Type: N-CHANNEL

N-channel transistors offer high efficiency and fast switching speeds, making them ideal for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space on the PCB.

Transistor Application: SWITCHING

This transistor is specifically designed for switching applications, ensuring reliable performance.

Surface Mount: YES

Being surface mountable allows for easy assembly and saves space on the PCB.

Minimum DS Breakdown Voltage: 30 V

The high breakdown voltage provides extra protection and reliability in high voltage applications.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient placement on the PCB.

Terminal Form: GULL WING

The gull wing terminal form makes soldering easier and more reliable.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer low on-resistance and high current capacity, making them suitable for various applications.

Maximum Drain Current (Abs) (ID): 1.6 A

The high drain current rating ensures the transistor can handle high loads without overheating.

No. of Terminals: 3

The three terminals provide easy connectivity in the circuit.

Maximum Power Dissipation (Abs): 0.42 W

The low power dissipation helps in improving the efficiency and reliability of the transistor.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low power consumption.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this transistor is suitable for a variety of demanding environments.

Transistor Element Material: SILICON

Silicon transistors offer high performance, reliability, and efficiency.

Terminal Finish: MATTE TIN

The matte tin finish provides good conductivity and solderability.

Maximum Drain-Source On Resistance: 0.1 ohm

The low on-resistance ensures minimal power loss and high efficiency in operation.

Terminal Position: DUAL

Dual terminal positions provide flexibility in circuit design and connectivity options.

Maximum Time At Peak Reflow Temperature (s): 30

This transistor can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature tolerance, this transistor can be used in lead-free soldering processes.

Technical Specifications

Small Signal Field Effect Transistors (FET) MGSF1N03LT1G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

1.6 A

Maximum Drain Current (ID):

1.6 A

Maximum Drain-Source On Resistance:

.1 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MGSF1N03LT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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