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FDV304P-F169

Onsemi

FDV304P-F169 by Onsemi

Onsemi's FDV304P-F169 is a P-CHANNEL FET for switching applications. It features a 25V DS breakdown voltage, 0.46A max drain current, and 1.1 ohm max on resistance. With a small outline package style and GULL WING terminals, it operates in enhancement mode at -55 to 150 °C temperature range.

Median Price

$0.343

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 70 parts In-Stock

1+ parts

$0.343

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$0.326

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$0.326

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70

$0.343

$0.326

$0.326

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Flip Electronics (Authorized)

USA . 1,700 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 1,542 parts In-Stock

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$0.326

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1,542

$0.326

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Vyrian

USA . 5,596 parts In-Stock

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Flip Electronics

USA . 1,700 parts In-Stock

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DigiKey Marketplace

USA . 1,700 parts In-Stock

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$0.400

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1,700

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$0.400

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 454 parts In-Stock

1+ parts

$0.292

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454

$0.292

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Semicontronic

India . 394 parts In-Stock

1+ parts

$0.292

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$0.285

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$0.283

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394

$0.292

$0.285

$0.283

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Corphita

USA . 121 parts In-Stock

1+ parts

$0.309

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121

$0.309

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Advanced Electronics

New Zealand . 70 parts In-Stock

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$0.343

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$0.326

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$0.326

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70

$0.343

$0.326

$0.326

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Corohmni

South Africa . 449 parts In-Stock

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$0.343

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449

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Aztec Data Supply Inc.

USA . 1,000 parts In-Stock

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$0.874

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1,000

$0.874

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Microchip USA

USA . 216 parts In-Stock

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$2.600

100+ parts

$2.580

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$2.580

10k+ parts

$2.570

216

$2.600

$2.580

$2.580

$2.570

AZTECH Wire

Italy . 263 parts In-Stock

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$22.020

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Kepictronics

USA . 306,000 parts In-Stock

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TANS Electronics

Latvia . 6,759 parts In-Stock

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Problanco Electronics

Mexico . 6,429 parts In-Stock

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SupplyDigital Components

Austria . 3,241 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,968 parts In-Stock

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Kulean Microsystems

USA . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 695 parts In-Stock

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695

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Robosynatics

Brazil . 450 parts In-Stock

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$2.874

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$2.874

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$2.874

450

-

$2.874

$2.874

$2.874

Lucentia Tech

USA . 450 parts In-Stock

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$2.874

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$2.874

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$2.874

450

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$2.874

$2.874

$2.874

Argo Parts USA

USA . 173 parts In-Stock

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173

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Bastille Electronics

Australia . 100 parts In-Stock

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Modulus Dynamics

Lithuania . 56 parts In-Stock

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56

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Overview

Discover the FDV304P-F169 by Onsemi, a top-quality P-channel small signal FET with a single configuration and built-in diode. Ideal for switching applications, this transistor offers enhanced performance and reliability. With a maximum power dissipation of 0.35 W and a minimum DS breakdown voltage of 25 V, this surface-mount device is designed for optimal functionality. Experience the benefits of Onsemi's cutting-edge technology and elevate your projects with the FDV304P-F169.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the FET.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their high input impedance and low output impedance, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode allows for more efficient switching and protection against reverse polarity.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in on/off operations.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on printed circuit boards.

Minimum DS Breakdown Voltage: 25 V

The high breakdown voltage ensures reliable operation in various voltage conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and low power consumption.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, the FET can withstand high temperatures without performance degradation.

Maximum Drain Current (ID): 0.46 A

The high maximum drain current allows for handling larger loads with ease.

Maximum Drain-Source On Resistance: 1.1 ohm

The low drain-source on resistance minimizes power loss and improves efficiency.

Technical Specifications

Small Signal Field Effect Transistors (FET) FDV304P-F169 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (ID):

.46 A

Maximum Drain-Source On Resistance:

1.1 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

10 pF

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

.35 W

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDV304P-F169 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.95

SB

8541.21.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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