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FDV303N-F169

Onsemi

FDV303N-F169 by Onsemi

FDV303N-F169 by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 0.68A ID, and 0.45 ohm RDS. Ideal for SWITCHING applications in small outline packages with GULL WING terminals. Operating from -55 to 150 °C, it's an ENHANCEMENT MODE transistor with built-in diode.

Median Price

$123.600

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 1,402 parts In-Stock

1+ parts

$123.600

100+ parts

$117.420

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$117.420

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1,402

$123.600

$117.420

$117.420

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Distributors (In-Stock)

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Digiode

USA . 219 parts In-Stock

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$117.420

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219

$117.420

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Vyrian

USA . 6,065 parts In-Stock

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Nova Conductors

Japan . 32 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 1,888 parts In-Stock

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$0.758

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-

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1,888

$0.758

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AZTECH Wire

Italy . 102 parts In-Stock

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$21.490

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102

$21.490

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Semicontronic

India . 1,036 parts In-Stock

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$105.060

100+ parts

$102.434

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$101.908

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1,036

$105.060

$102.434

$101.908

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Corphita

USA . 1,127 parts In-Stock

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$111.240

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1,127

$111.240

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Corohmni

South Africa . 135 parts In-Stock

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$123.600

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135

$123.600

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Ampacity Inc.

Singapore . 1,207 parts In-Stock

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$228.660

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 9,462 parts In-Stock

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TANS Electronics

Latvia . 8,153 parts In-Stock

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Argo Parts USA

USA . 4,381 parts In-Stock

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Continental Prestige Electronics

USA . 2,403 parts In-Stock

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Problanco Electronics

Mexico . 2,374 parts In-Stock

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Kulean Microsystems

USA . 1,141 parts In-Stock

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UHIMA Technologies

Türkiye . 931 parts In-Stock

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SupplyDigital Components

Austria . 386 parts In-Stock

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Robosynatics

Brazil . 20 parts In-Stock

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$0.527

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$0.527

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$0.527

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$0.527

$0.527

$0.527

Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Discover the ultimate solution for your switching applications with the FDV303N-F169 by Onsemi. Crafted with precision and expertise, this small signal field effect transistor offers unparalleled quality and reliability. Its N-channel configuration and built-in diode simplify installation and enhance performance. Perfect for a wide range of applications, this transistor provides exceptional power dissipation and operates smoothly even in extreme conditions. Elevate your projects with the FDV303N-F169 and experience the superior value and benefits that only Onsemi can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring reliability in various applications.

Polarity or Channel Type: N-CHANNEL

Offers efficient current flow and low resistance, making it suitable for high-performance switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in such scenarios.

Minimum DS Breakdown Voltage: 25 V

Can handle voltages up to 25 V, making it suitable for a wide range of operating conditions.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and simplifying the manufacturing process.

Maximum Power Dissipation (Abs): 0.35 W

Can dissipate up to 0.35 W of power, ensuring reliable operation under varying load conditions.

Maximum Operating Temperature: 150 °C

Can operate at temperatures up to 150°C, making it suitable for high-temperature environments.

Maximum Drain Current (ID): 0.68 A

Capable of handling drain currents up to 0.68 A, making it suitable for applications requiring high current capabilities.

Maximum Drain-Source On Resistance: 0.45 ohm

With low on-resistance, the transistor minimizes power losses and heat generation, enhancing efficiency.

Technical Specifications

Small Signal Field Effect Transistors (FET) FDV303N-F169 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (ID):

.68 A

Maximum Drain-Source On Resistance:

.45 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

.35 W

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDV303N-F169 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.95

SB

8541.21.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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