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2N7002KT1G

Onsemi

2N7002KT1G by Onsemi

2N7002KT1G by Onsemi is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A max drain current. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.3W. This small outline transistor features a built-in diode and GULL WING terminals, suitable for surface mount configurations.

Median Price

$0.029

Lifecycle Status

Suppliers In-Stock

47

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 98,207 parts In-Stock

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$0.139

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$0.044

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$0.029

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$0.139

$0.044

$0.029

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Newark

USA . 638 parts In-Stock

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$0.208

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$0.082

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$0.056

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$0.208

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$0.056

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Mouser Electronics

USA . 175,818 parts In-Stock

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$0.210

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$0.080

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$0.051

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$0.080

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$0.034

Flip Electronics (Authorized)

USA . 7,893,000 parts In-Stock

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Canada . 315,000 parts In-Stock

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Rochester

USA . 217,475 parts In-Stock

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Avnet

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Arrow

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RS (Exports)

UK . 89,100 parts In-Stock

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Element14

Singapore . 81,794 parts In-Stock

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Master Electronics

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Verical

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Chip1Stop

Japan . 11,851 parts In-Stock

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Bürklin Elektronik

Germany . 1,373 parts In-Stock

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Digiode

USA . 1,052 parts In-Stock

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Nova Conductors

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Maritex

Poland . 21 parts In-Stock

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IBS Electronics

USA . 1,192,011 parts In-Stock

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Component Electronics Inc.

Canada . 4,575 parts In-Stock

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NAC Semi

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Chip Stock

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Component Sense

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ComSIT Distribution GmbH

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Semtec, LLC

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Rebound Electronics

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Semi Source

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ACDS - Activité Composants Distribution Service

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Pegasus Components GmbH

Germany . 1,782 parts In-Stock

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LIBRA Elektronik GmbH

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Microfarads

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Contempo Components LLC

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Prism Electronics

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Distributors (Availability)

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Ampacity Inc.

Singapore . 759,706 parts In-Stock

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Semicontronic

India . 758,325 parts In-Stock

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Decca Corp

Germany . 755,205 parts In-Stock

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Corohmni

South Africa . 333 parts In-Stock

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Corphita

USA . 1,803 parts In-Stock

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Benley Electronics

USA . 3,000 parts In-Stock

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Argo Parts USA

USA . 1,729 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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Continental Prestige Electronics

USA . 17,022 parts In-Stock

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Modulus Dynamics

Lithuania . 2,719 parts In-Stock

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Advanced Electronics

New Zealand . 10 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,368 parts In-Stock

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Perfect Parts

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Glotronic Ltd.

UK . 921,600 parts In-Stock

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Component Connect

USA . 762,510 parts In-Stock

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Metaverse IC Inc.

Canada . 279,000 parts In-Stock

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Infinite Electronics LLP (Excess)

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USA . 149,492 parts In-Stock

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GreenTree Electronics

Israel . 98,750 parts In-Stock

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Allen Electronics Distributors

USA . 95,100 parts In-Stock

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Epart123

USA . 60,000 parts In-Stock

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Eastek

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iodParts Technologies Inc.

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Authorized Procurement Solutions

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Brazil . 3,431 parts In-Stock

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Lucentia Tech

USA . 3,431 parts In-Stock

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Mexico . 2,982 parts In-Stock

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Latvia . 1,496 parts In-Stock

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SupplyDigital Components

Austria . 751 parts In-Stock

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Türkiye . 66 parts In-Stock

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Overview

Discover the unparalleled performance and reliability of the 2N7002KT1G by Onsemi, a leading manufacturer in the industry. This Small Signal Field Effect Transistor is perfect for switching applications, offering enhanced efficiency and power management. With a maximum drain current of 0.32A and a minimum DS breakdown voltage of 60V, this N-channel transistor delivers exceptional performance. Whether you're looking to optimize your circuit design or improve energy consumption, the 2N7002KT1G provides the value and benefits you need to succeed. Choose quality, choose Onsemi.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and protection for the transistor, making it a reliable choice for various applications.

Polarity or Channel Type:

N-CHANNEL - Offers efficient control of current flow, ensuring optimal performance in switching applications.

Configuration:

SINGLE WITH BUILT-IN DIODE - Simplifies circuit design and saves space, making it suitable for compact electronic devices.

Transistor Application:

SWITCHING - Designed specifically for switching applications, ensuring fast and reliable operation.

Surface Mount:

YES - Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Minimum DS Breakdown Voltage:

60 V - Provides a high level of protection against voltage spikes, increasing the reliability of the transistor.

Package Shape:

RECTANGULAR - Offers a versatile form factor that can easily fit into various electronic designs.

Terminal Form:

GULL WING - Facilitates soldering and ensures a secure connection to the circuit board.

Operating Mode:

ENHANCEMENT MODE - Enables precise control over the transistor's operation, making it suitable for a wide range of applications.

Maximum Drain Current (Abs) (ID):

0.32 A - Handles high current loads with ease, making it suitable for power-efficient devices.

No. of Terminals:

3 - Simplifies the circuit layout and reduces complexity in system design.

Maximum Power Dissipation (Abs):

0.3 W - Efficiently dissipates heat, ensuring reliable performance in various operating conditions.

Package Style (Meter):

SMALL OUTLINE - Offers a compact and space-saving design for applications with limited space constraints.

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR - Provides high performance and efficiency in switching applications.

Maximum Operating Temperature:

150 °C - Can withstand high temperatures, ensuring reliability in harsh environments.

Transistor Element Material:

SILICON - Provides high performance and reliability in a wide range of operating conditions.

Minimum Operating Temperature:

55 °C - Allows the transistor to operate in low-temperature environments without compromising performance.

Terminal Finish:

Matte Tin (Sn) - annealed - Ensures a durable and reliable terminal finish for long-term use.

Maximum Drain-Source On Resistance:

1.6 ohm - Offers low resistance for efficient current flow and minimal power loss.

Terminal Position:

DUAL - Provides flexibility in circuit layout and connection options.

Maximum Time At Peak Reflow Temperature (s):

40 - Can withstand peak reflow temperatures for efficient soldering during manufacturing.

Peak Reflow Temperature °C:

260 - Supports high-temperature assembly processes for reliable solder joints.

Maximum Feedback Capacitance (Crss):

5 pF - Provides low feedback capacitance for improved stability and performance in high-frequency applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) 2N7002KT1G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

.32 A

Maximum Drain Current (ID):

.32 A

Maximum Drain-Source On Resistance:

1.6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5 pF

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

2N7002KT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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