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NTR5103NT1G

Onsemi

NTR5103NT1G by Onsemi

NTR5103NT1G by Onsemi is a N-CHANNEL FET with 60V DS breakdown voltage, 0.26A drain current, and 2.5 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.42W at 150°C.

Median Price

$0.038

Lifecycle Status

Suppliers In-Stock

28

In-Stock Inventory

1k+

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Newark

USA . 24,000 parts In-Stock

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Mouser Electronics

USA . 25,416 parts In-Stock

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Rochester

USA . 211,860 parts In-Stock

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Verical

USA . 210,060 parts In-Stock

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Arrow

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Element14

Singapore . 133,532 parts In-Stock

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Future Electronics

Canada . 114,000 parts In-Stock

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DigiKey

USA . 113,674 parts In-Stock

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Master Electronics

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Germany . 21,000 parts In-Stock

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Chip1Stop

Japan . 18,625 parts In-Stock

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Farnell

UK . 15,002 parts In-Stock

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RS (Exports)

UK . 14,000 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 1,346 parts In-Stock

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Nova Conductors

Japan . 60 parts In-Stock

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NAC Semi

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IBS Electronics

USA . 480,000 parts In-Stock

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Cyclops Electronics Ltd

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Chip Stock

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Vyrian

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ComSIT Distribution GmbH

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Semtec, LLC

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Bristol Electronics

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Sensible Micro Corp

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Atlantic Semiconductor

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Ampacity Inc.

Singapore . 90,967 parts In-Stock

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Semicontronic

India . 84,176 parts In-Stock

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Corphita

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Corohmni

South Africa . 306 parts In-Stock

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Argo Parts USA

USA . 1,832 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 38,939 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,849 parts In-Stock

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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Perfect Parts

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GreenTree Electronics

Israel . 309,000 parts In-Stock

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ChipstoGo Electronic ltd

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USA . 117,652 parts In-Stock

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Infinite Electronics LLP (Excess)

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Eastek

USA . 45,000 parts In-Stock

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Lixinc

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SupplyDigital Components

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Mexico . 509 parts In-Stock

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UHIMA Technologies

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Overview

Discover the superior quality and performance of the NTR5103NT1G by Onsemi, a top-tier manufacturer in the field of small signal field-effect transistors. This N-channel transistor boasts a single configuration with a built-in diode, making it ideal for switching applications. With a high breakdown voltage of 60V and maximum drain current of 0.26A, this transistor offers reliable and efficient operation. Whether you're looking to enhance your electronics projects or upgrade your devices, the NTR5103NT1G delivers exceptional value and benefits that will exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides good protection and durability for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower ON-resistance and higher electron mobility, allowing for efficient switching.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse voltage protection and can simplify circuit design.

Transistor Application: SWITCHING

Designed for switching applications, making it ideal for use in power control circuits.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and increasing efficiency.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this transistor can withstand higher voltages without breakdown, making it suitable for various applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy placement and soldering onto circuit boards.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors are normally OFF devices, allowing for better control and efficiency in switching applications.

Maximum Drain Current (Abs) (ID): 0.26 A

Capable of handling a maximum drain current of 0.26 A, making it suitable for low to medium power applications.

No. of Terminals: 3

3 terminals for easy connection and integration into circuits.

Maximum Power Dissipation (Abs): 0.42 W

With a maximum power dissipation of 0.42 W, this transistor can handle moderate power levels without overheating.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and allows for high component density on circuit boards.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides good performance and reliability in various applications.

Maximum Operating Temperature: 150 °C

Capable of operating at temperatures up to 150°C, suitable for a wide range of operating conditions.

Transistor Element Material: SILICON

Silicon material ensures good performance, reliability, and durability for the transistor.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good solderability and connectivity with other components in the circuit.

Maximum Drain-Source On Resistance: 2.5 ohm

Low ON-resistance of 2.5 ohms allows for efficient switching and minimal power loss in the transistor.

Terminal Position: DUAL

Dual terminal position allows for flexible and convenient connection options.

Maximum Time At Peak Reflow Temperature (s): 30

Capable of withstanding peak reflow temperature for up to 30 seconds during soldering process.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures proper soldering and connectivity during manufacturing process.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTR5103NT1G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

.26 A

Maximum Drain Current (ID):

.26 A

Maximum Drain-Source On Resistance:

2.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTR5103NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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