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FDV305N

Onsemi

FDV305N by Onsemi

FDV305N by Onsemi is a N-CHANNEL FET with 20V DS Breakdown Voltage, 0.9A Drain Current, and 0.22ohm On Resistance. Ideal for SWITCHING applications in small outline packages with 3 terminals and operating up to 150°C.

Median Price

$0.101

Lifecycle Status

Suppliers In-Stock

48

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1k+

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Mouser Electronics

USA . 122,846 parts In-Stock

1+ parts

$0.520

100+ parts

$0.205

1k+ parts

$0.137

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$0.520

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$0.137

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DigiKey

USA . 116,220 parts In-Stock

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$0.520

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$0.204

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$0.137

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$0.098

116,220

$0.520

$0.204

$0.137

$0.098

Adafruit Industries

USA . 93 parts In-Stock

1+ parts

$1.211

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$1.102

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$0.993

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93

$1.211

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$0.993

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Future Electronics

Canada . 480,000 parts In-Stock

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Arrow

USA . 102,000 parts In-Stock

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Verical

USA . 102,000 parts In-Stock

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Element14

Singapore . 34,665 parts In-Stock

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Farnell

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Master Electronics

USA . 12,000 parts In-Stock

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Newark

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EBV Elektronik

Germany . 3,000 parts In-Stock

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UK . 2,780 parts In-Stock

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Chip1Stop

Japan . 1,966 parts In-Stock

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Rochester

USA . 187 parts In-Stock

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187

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Maritex

Poland . 3,362 parts In-Stock

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$0.130

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3,362

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$0.069

$0.066

$0.059

Mobius Materials

USA . 4,279 parts In-Stock

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Voyager Components

USA . 339 parts In-Stock

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339

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Digiode

USA . 2,288 parts In-Stock

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TME

Poland . 175 parts In-Stock

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Nova Conductors

Japan . 55 parts In-Stock

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IBS Electronics

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NAC Semi

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Cyclops Electronics Ltd

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Semtec, LLC

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Prism Electronics

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Atlantic Semiconductor

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Ampacity Inc.

Singapore . 79,512 parts In-Stock

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$0.054

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Corohmni

South Africa . 408 parts In-Stock

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Argo Parts USA

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Corphita

USA . 2,277 parts In-Stock

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Component Stockers USA

USA . 54,218 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$1.000

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$0.950

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$0.930

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Modulus Dynamics

Lithuania . 1,499 parts In-Stock

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$1.126

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$1.126

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Advanced Electronics

New Zealand . 93 parts In-Stock

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$1.211

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$1.102

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$0.993

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Aztec Data Supply Inc.

USA . 397 parts In-Stock

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$1.483

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RC Electronics

USA . 90,996 parts In-Stock

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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Perfect Parts

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Speed Components Ltd (Excess)

Israel . 34,115 parts In-Stock

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GreenTree Electronics

Israel . 33,000 parts In-Stock

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USA . 24,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 22,622 parts In-Stock

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Latvia . 8,017 parts In-Stock

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SupplyDigital Components

Austria . 7,275 parts In-Stock

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Infinite Electronics LLP (Excess)

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Robosynatics

Brazil . 3,574 parts In-Stock

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Lucentia Tech

USA . 3,574 parts In-Stock

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Problanco Electronics

Mexico . 3,318 parts In-Stock

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Türkiye . 700 parts In-Stock

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Overview

Enhance your electronic applications with the Onsemi FDV305N Small Signal Field Effect Transistor. Manufactured by industry leader Onsemi, this N-channel transistor offers reliable switching capabilities and a built-in diode for added convenience. Ideal for a wide range of applications, this transistor is perfect for enhancing the performance of your electronic projects. With a maximum drain current of 0.9A and a low on-resistance of 0.22 ohm, the FDV305N delivers exceptional value and performance to customers looking for high-quality components. Upgrade your circuits with the Onsemi FDV305N today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers good durability and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance and efficiency compared to P-channel transistors, making this product a good choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for better control and protection in switching applications, making this transistor a versatile choice for various uses.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor provides reliable performance and efficient operation in such scenarios.

Surface Mount: YES

Being surface mountable allows for easier and more compact integration of the transistor onto circuit boards, saving space and enhancing overall design flexibility.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this transistor can handle a wide range of voltage levels, providing a good margin of safety in various applications.

Maximum Drain Current (Abs): 0.9 A

The high maximum drain current rating of 0.9A allows for reliable performance in demanding applications, ensuring efficient power handling capabilities.

Maximum Power Dissipation (Abs): 0.35 W

With a maximum power dissipation of 0.35W, this transistor can handle heat dissipation effectively, reducing the risk of overheating and ensuring long-term reliability.

Maximum Drain-Source On Resistance: 0.22 ohm

The low drain-source on resistance of 0.22 ohms results in minimal power loss and efficient current flow, making this transistor suitable for high-speed switching applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C allows for reliable performance in a wide range of environmental conditions, making this transistor suitable for use in demanding industrial settings.

Technical Specifications

Small Signal Field Effect Transistors (FET) FDV305N attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

.9 A

Maximum Drain Current (ID):

.9 A

Maximum Drain-Source On Resistance:

.22 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDV305N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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