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IRLML2803GTRPBF

Infineon Technologies

IRLML2803GTRPBF by Infineon Technologies

Infineon's IRLML2803GTRPBF is a N-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 1.2A Drain Current, 0.25 ohm On Resistance, and 150°C Operating Temperature. Its GULL WING terminals and ENHANCEMENT MODE make it suitable for compact electronic devices requiring efficient power management.

Median Price

$0.133

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 35 parts In-Stock

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$0.110

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35

$0.110

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Chip Stock

USA . 120,640 parts In-Stock

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120,640

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Euro-Tech

UK . 7,250 parts In-Stock

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7,250

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ComSIT Distribution GmbH

Germany . 3,000 parts In-Stock

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3,000

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ComSIT USA

USA . 3,000 parts In-Stock

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3,000

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R&J Components

USA . 2,000 parts In-Stock

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2,000

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Vyrian

USA . 1,075 parts In-Stock

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1,075

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Connector Distribution Corp

USA . 978 parts In-Stock

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978

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Right Parts Inc.

USA . 978 parts In-Stock

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978

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Digiode

USA . 905 parts In-Stock

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905

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Sensible Micro Corp

USA . 640 parts In-Stock

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$0.156

1k+ parts

$0.144

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640

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$0.156

$0.144

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 4,523 parts In-Stock

1+ parts

$0.110

100+ parts

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1k+ parts

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$0.107

4,523

$0.110

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$0.107

Continental Prestige Electronics

USA . 2,429 parts In-Stock

1+ parts

$0.110

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$0.108

2,429

$0.110

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$0.108

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.110

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$0.108

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100

$0.110

$0.108

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Modulus Dynamics

Lithuania . 25,533 parts In-Stock

1+ parts

$0.327

100+ parts

$0.314

1k+ parts

$0.301

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25,533

$0.327

$0.314

$0.301

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$0.664

100+ parts

$0.604

1k+ parts

$0.544

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1,000

$0.664

$0.604

$0.544

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Aztec Data Supply Inc.

USA . 1,379 parts In-Stock

1+ parts

$0.730

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1,379

$0.730

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Corohmni

South Africa . 821 parts In-Stock

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$1.416

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821

$1.416

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Ampacity Inc.

Singapore . 1,125 parts In-Stock

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$4.050

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$4.050

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AZTECH Wire

Italy . 571 parts In-Stock

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$7.057

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571

$7.057

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Decca Corp

Germany . 1,132 parts In-Stock

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$17.050

100+ parts

$16.709

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$16.542

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1,132

$17.050

$16.709

$16.542

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Semicontronic

India . 375 parts In-Stock

1+ parts

$17.050

100+ parts

$16.624

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$16.538

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375

$17.050

$16.624

$16.538

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Andel Nordic

Denmark . 300 parts In-Stock

1+ parts

$29.020

100+ parts

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$20.311

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$20.311

300

$29.020

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$20.311

$20.311

Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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Assy Fe

Spain . 8,860 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,700 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,800 parts In-Stock

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Formix International (Excess)

India . 1,586 parts In-Stock

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Corphita

USA . 374 parts In-Stock

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374

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Robosynatics

Brazil . 150 parts In-Stock

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Lucentia Tech

USA . 150 parts In-Stock

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Overview

Unlock the power of efficient switching with the IRLML2803GTRPBF by Infineon Technologies. Crafted with precision and quality, this N-CHANNEL FET offers a single configuration with a built-in diode, making it perfect for a wide range of applications. With a maximum drain current of 1.2A and a low on-resistance of 0.25 ohms, this transistor ensures reliable performance and durability. Experience enhanced functionality and high performance in a compact package, designed to meet your needs and exceed your expectations. Choose Infineon Technologies for superior quality and innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs are commonly used in power electronics and provide efficient operation in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and helps protect against reverse voltage.

Transistor Application: SWITCHING

Designed for switching applications, this FET provides fast operation and efficient power management.

Surface Mount: YES

Surface mount capability allows for easy and space-saving integration onto circuit boards.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle higher voltages for reliable performance.

Package Shape: RECTANGULAR

The rectangular package shape is compact and allows for efficient placement on circuit boards.

Terminal Form: GULL WING

Gull wing terminals provide a secure connection and easy soldering onto circuit boards.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easy control of the FET and efficient switching performance.

Maximum Drain Current (ID): 1.2 A

The high maximum drain current rating of 1.2A enables the FET to handle higher loads in various applications.

No. of Terminals: 3

With 3 terminals, this FET provides easy connectivity in circuits and enables efficient current flow.

Maximum Power Dissipation (Abs): 0.54 W

The low power dissipation rating of 0.54W ensures efficient operation and prevents overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on circuit boards and allows for compact circuit designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance, reliability, and efficiency in switching applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can withstand high temperatures for reliable operation.

Transistor Element Material: SILICON

Silicon material in the transistor element ensures high performance and durability in various operating conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides a reliable and durable connection, ensuring long-term performance.

Maximum Drain-Source On Resistance: 0.25 ohm

Low drain-source on resistance of 0.25 ohm ensures efficient power handling and minimal voltage drop.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit board layout and easy integration into various designs.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds at peak temperature, this FET is easy to solder onto circuit boards.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures reliable and secure soldering of the FET onto circuit boards.

Technical Specifications

Small Signal Field Effect Transistors (FET) IRLML2803GTRPBF attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

HIGH RELIABILITY

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

1.2 A

Maximum Drain Current (ID):

1.2 A

Maximum Drain-Source On Resistance:

.25 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRLML2803GTRPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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