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MGSF1N03LT3G

Onsemi

MGSF1N03LT3G by Onsemi

MGSF1N03LT3G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage. It is ideal for SWITCHING applications, featuring a max Drain Current of 1.6A and 0.1 ohm Drain-Source Resistance. This small outline transistor operates in ENHANCEMENT MODE at up to 150°C, making it suitable for various electronic devices requiring efficient power management.

Median Price

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Lifecycle Status

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5

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1k+

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Chip Stock

USA . 408,500 parts In-Stock

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Vyrian

USA . 10,467 parts In-Stock

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Digiode

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Nova Conductors

Japan . 100 parts In-Stock

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Prism Electronics

USA . 96 parts In-Stock

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AZTECH Wire

Italy . 467 parts In-Stock

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$18.083

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Ampacity Inc.

Singapore . 1,537 parts In-Stock

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$41.050

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Component Stockers USA

USA . 742 parts In-Stock

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$99.990

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Kepictronics

USA . 51,000 parts In-Stock

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Problanco Electronics

Mexico . 7,926 parts In-Stock

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Continental Prestige Electronics

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Kulean Microsystems

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Argo Parts USA

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SupplyDigital Components

Austria . 1,394 parts In-Stock

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Corphita

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Speed Components Ltd (Excess)

Israel . 578 parts In-Stock

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UHIMA Technologies

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Corohmni

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Overview

Upgrade your electronics with the MGSF1N03LT3G by Onsemi. This small signal field effect transistor offers high-quality performance and reliability, perfect for switching applications. With a breakthrough metal-oxide semiconductor technology, this N-channel transistor delivers enhanced operation and a maximum drain current of 1.6A. The sleek gull wing design makes for easy surface mounting, while the built-in diode ensures seamless functionality. Experience the power of Onsemi's innovative technology and elevate your projects to new heights with the MGSF1N03LT3G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this FET lightweight and durable, ideal for portable and long-lasting electronic devices.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer better performance and efficiency compared to P-channel FETs, making this product a reliable choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy and efficient circuit design, reducing the need for additional components and simplifying the overall system.

Transistor Application: SWITCHING

Designed for switching applications, this FET provides fast and reliable performance, crucial for applications that require quick on/off switching.

Surface Mount: YES

The surface mount feature makes it easy to integrate this FET into compact electronic devices, saving space and allowing for more efficient circuit board layouts.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can withstand higher voltages, ensuring greater reliability and safety in high-power applications.

Package Shape: RECTANGULAR

The rectangular package shape offers versatility in mounting options, accommodating different design requirements and making it easy to integrate into various systems.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections, reducing the risk of connection failures and improving the overall performance of the FET.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers greater control and efficiency, making this FET suitable for a wide range of applications that require precise control of current flow.

Maximum Drain Current (Abs): 1.6 A

With a maximum drain current of 1.6A, this FET can handle high current loads, making it suitable for power-hungry applications that require robust performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) MGSF1N03LT3G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

1.6 A

Maximum Drain Current (ID):

1.6 A

Maximum Drain-Source On Resistance:

.1 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MGSF1N03LT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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