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BSS123L

Onsemi

BSS123L by Onsemi

BSS123L by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A ID, and 10 ohm RDS(on). Ideal for switching applications, it features a single configuration with built-in diode. This small outline transistor in gull wing package is designed for surface mount technology.

Median Price

$0.047

Lifecycle Status

Suppliers In-Stock

35

In-Stock Inventory

1k+

Distributors (Authorized)

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Distrelec

Netherlands . 2,786 parts In-Stock

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$0.232

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Newark

USA . 13,055 parts In-Stock

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Mouser Electronics

USA . 270,656 parts In-Stock

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Chip1Stop

Japan . 105,000 parts In-Stock

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Avnet

USA . 90,000 parts In-Stock

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Element14

Singapore . 72,168 parts In-Stock

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Farnell

UK . 67,498 parts In-Stock

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Arrow

USA . 42,000 parts In-Stock

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UK . 23,950 parts In-Stock

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DigiKey

USA . 18,000 parts In-Stock

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Verical

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Future Electronics

Canada . 3,000 parts In-Stock

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EBV Elektronik

Germany . 3,000 parts In-Stock

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Rochester

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Distributors (In-Stock)

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Digiode

USA . 1,906 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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TME

Poland . 5,635 parts In-Stock

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$0.036

NAC Semi

USA . 540,000 parts In-Stock

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Vyrian

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Component Sense

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IBS Electronics

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Sensible Micro Corp

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ComSIT Distribution GmbH

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ComSIT USA

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Flip Electronics

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Chip Stock

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Bristol Electronics

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Mil-Aero Solutions, Inc.

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Semi Source

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VNN

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Germany . 96 parts In-Stock

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Cyclops Electronics Ltd

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Semicontronic

India . 168,163 parts In-Stock

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Ampacity Inc.

Singapore . 168,124 parts In-Stock

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Corphita

USA . 619 parts In-Stock

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Argo Parts USA

USA . 1,412 parts In-Stock

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Bastille Electronics

Australia . 25 parts In-Stock

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$0.057

Modulus Dynamics

Lithuania . 7,287 parts In-Stock

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Corohmni

South Africa . 172 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,815 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$2.009

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Continental Prestige Electronics

USA . 539,376 parts In-Stock

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Perfect Parts

USA . 177,180 parts In-Stock

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Kepictronics

USA . 65,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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India . 16,382 parts In-Stock

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Lixinc

USA . 12,931 parts In-Stock

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TANS Electronics

Latvia . 6,221 parts In-Stock

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Problanco Electronics

Mexico . 3,578 parts In-Stock

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SupplyDigital Components

Austria . 2,428 parts In-Stock

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Supply Digital

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Kulean Microsystems

USA . 1,032 parts In-Stock

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Robosynatics

Brazil . 500 parts In-Stock

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$0.433

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Lucentia Tech

USA . 500 parts In-Stock

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$0.433

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UHIMA Technologies

Türkiye . 399 parts In-Stock

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Overview

Experience seamless and reliable performance with the BSS123L by Onsemi, a top-tier manufacturer known for their quality products. This N-CHANNEL Small Signal Field Effect Transistor offers enhanced switching capabilities in a compact package, making it ideal for a wide range of applications. With a built-in diode and a high minimum DS breakdown voltage of 100V, this FET delivers outstanding value and efficiency to customers looking for superior performance in their electronic devices. Trust Onsemi's expertise and choose the BSS123L for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the component lightweight and durable, perfect for use in a variety of electronic applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally have higher mobility and conductivity, making this transistor efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides reverse bias protection, enhancing overall reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and efficient performance.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing overall component size.

Minimum DS Breakdown Voltage: 100 V

The high breakdown voltage ensures reliability and protection against voltage spikes in the circuit.

Package Shape: RECTANGULAR

The rectangular shape allows for easy placement and soldering on circuit boards, optimizing space usage.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering during assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for precise control of the transistor, improving efficiency and performance in switching applications.

No. of Terminals: 3

The three terminals provide easy connections and versatility for different circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and allows for high-density mounting of components.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and low power consumption, making this transistor suitable for a wide range of applications.

Transistor Element Material: SILICON

Silicon is a common and reliable material for transistor elements, ensuring stable performance and longevity.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good conductivity and corrosion resistance, ensuring reliable connections in various environments.

Maximum Drain Current (ID): 0.17 A

With a maximum drain current of 0.17 A, this transistor can handle moderate current loads in switching applications.

Maximum Drain-Source On Resistance: 10 ohm

The low drain-source on resistance of 10 ohms ensures minimal power loss and efficient operation in switching circuits.

Terminal Position: DUAL

The dual terminal position provides flexibility in circuit design and allows for easy integration into various applications.

Maximum Time At Peak Reflow Temperature (s): 30

The transistor can withstand up to 30 seconds at peak reflow temperature during assembly, ensuring reliable soldering and bonding.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the transistor can be safely soldered onto circuit boards without risk of damage.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS123L attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

.17 A

Maximum Drain-Source On Resistance:

10 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSS123L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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