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BSS84PWL6327

Infineon Technologies

BSS84PWL6327 by Infineon Technologies

BSS84PWL6327 by Infineon is a P-CHANNEL FET with 60V DS breakdown voltage and 0.15A max drain current. Ideal for small outline applications, it features a built-in diode, 8 ohm max on resistance, and operates in enhancement mode at up to 150°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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VNN

France . 4,453 parts In-Stock

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Vyrian

USA . 2,840 parts In-Stock

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2,840

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PC Components Company LLC

USA . 1,769 parts In-Stock

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1,769

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Bristol Electronics

USA . 1,769 parts In-Stock

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Digiode

USA . 639 parts In-Stock

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639

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Modulus Dynamics

Lithuania . 5,897 parts In-Stock

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$0.912

100+ parts

$0.876

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$0.839

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5,897

$0.912

$0.876

$0.839

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Corohmni

South Africa . 136 parts In-Stock

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$1.806

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Aztec Data Supply Inc.

USA . 196 parts In-Stock

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$1.890

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$1.890

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Semicontronic

India . 577 parts In-Stock

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$5.050

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$4.924

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$4.898

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577

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$4.898

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AZTECH Wire

Italy . 488 parts In-Stock

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$16.152

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488

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Andel Nordic

Denmark . 4,129 parts In-Stock

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$20.760

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$14.533

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$14.533

Ampacity Inc.

Singapore . 919 parts In-Stock

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$41.050

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QUARKTWIN TECHNOLOGY LTD

USA . 16,863 parts In-Stock

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Metaverse IC Inc.

Canada . 7,369 parts In-Stock

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Continental Prestige Electronics

USA . 4,884 parts In-Stock

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Microchip USA

USA . 4,377 parts In-Stock

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Lixinc

USA . 4,349 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Argo Parts USA

USA . 3,603 parts In-Stock

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Corphita

USA . 994 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Robosynatics

Brazil . 100 parts In-Stock

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$8.776

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$8.776

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$8.776

100

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$8.776

$8.776

Overview

Discover the power of the BSS84PWL6327 by Infineon Technologies, a high-quality P-Channel Small Signal Field Effect Transistor that offers reliability and efficiency. With a maximum drain current of 0.15A and a breakdown voltage of 60V, this transistor is perfect for a wide range of applications. From consumer electronics to automotive systems, this transistor provides superior performance and value. Trust Infineon Technologies to deliver cutting-edge technology that meets your needs. Elevate your products with the BSS84PWL6327 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the FET, making it suitable for a wide range of applications.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their lower ON-state resistance and higher current carrying capacity compared to N-channel FETs, making them a good choice for certain circuit designs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and prevents reverse current flow, enhancing the overall reliability of the FET.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easy control of the ON/OFF state, providing efficiency and precision in switching applications.

Maximum Drain Current: 0.15 A

With a maximum drain current of 0.15 A, this FET can handle moderate current loads, making it suitable for a variety of low-power applications.

Maximum Power Dissipation: 0.3 W

The high power dissipation capability ensures stable operation and prevents overheating, making the FET reliable under different operating conditions.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can withstand high temperatures, making it suitable for industrial applications where heat dissipation is critical.

Maximum Drain-Source On Resistance: 8 ohm

The low drain-source ON resistance results in minimal power loss and efficient performance, making the FET suitable for low-power applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS84PWL6327 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

.15 A

Maximum Drain Current (ID):

.15 A

Maximum Drain-Source On Resistance:

8 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

3.8 pF

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Element Material:

SILICON

Trade Compliance

BSS84PWL6327 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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