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TLE9252VLCXUMA1

Infineon Technologies

TLE9252VLCXUMA1 by Infineon Technologies

INTERFACE CIRCUIT; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 2A; JESD-609 Code: e3;

Median Price

$1.740

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3,648 parts In-Stock

1+ parts

$0.667

100+ parts

$0.637

1k+ parts

$0.606

10k+ parts

$0.596

3,648

$0.667

$0.637

$0.606

$0.596

Chip1Stop

Japan . 4,770 parts In-Stock

1+ parts

$1.190

100+ parts

-

1k+ parts

-

10k+ parts

-

4,770

$1.190

-

-

-

Newark

USA . 46,612 parts In-Stock

1+ parts

$2.120

100+ parts

$1.290

1k+ parts

$1.130

10k+ parts

-

46,612

$2.120

$1.290

$1.130

-

Mouser Electronics

USA . 9,664 parts In-Stock

1+ parts

$2.210

100+ parts

$1.290

1k+ parts

$1.120

10k+ parts

$1.000

9,664

$2.210

$1.290

$1.120

$1.000

Farnell

UK . 29,860 parts In-Stock

1+ parts

$2.353

100+ parts

$1.658

1k+ parts

$1.240

10k+ parts

$0.974

29,860

$2.353

$1.658

$1.240

$0.974

DigiKey

USA . 1,298 parts In-Stock

1+ parts

$2.500

100+ parts

$1.502

1k+ parts

$1.322

10k+ parts

$1.277

1,298

$2.500

$1.502

$1.322

$1.277

Element14

Singapore . 46,614 parts In-Stock

1+ parts

$2.990

100+ parts

$1.800

1k+ parts

$1.590

10k+ parts

$1.520

46,614

$2.990

$1.800

$1.590

$1.520

Verical

USA . 49,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.337

10k+ parts

$1.193

49,500

-

-

$1.337

$1.193

Rochester

USA . 49,500 parts In-Stock

1+ parts

-

100+ parts

$1.290

1k+ parts

$1.070

10k+ parts

$0.955

49,500

-

$1.290

$1.070

$0.955

RS (Exports)

UK . 5,000 parts In-Stock

1+ parts

-

100+ parts

$1.360

1k+ parts

$1.265

10k+ parts

-

5,000

-

$1.360

$1.265

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 998 parts In-Stock

1+ parts

$0.946

100+ parts

-

1k+ parts

-

10k+ parts

-

998

$0.946

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$1.242

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$1.242

-

-

-

Mobius Materials

USA . 289 parts In-Stock

1+ parts

$1.790

100+ parts

$1.440

1k+ parts

-

10k+ parts

-

289

$1.790

$1.440

-

-

Vyrian

USA . 18,956 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18,956

-

-

-

-

Chip Stock

USA . 11,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,500

-

-

-

-

Bristol Electronics

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

ComSIT Distribution GmbH

Germany . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 33 parts In-Stock

1+ parts

$0.896

100+ parts

-

1k+ parts

-

10k+ parts

-

33

$0.896

-

-

-

Semicontronic

India . 20,366 parts In-Stock

1+ parts

$1.040

100+ parts

$1.014

1k+ parts

$1.009

10k+ parts

-

20,366

$1.040

$1.014

$1.009

-

Modulus Dynamics

Lithuania . 3,665 parts In-Stock

1+ parts

$1.191

100+ parts

$1.143

1k+ parts

$1.096

10k+ parts

-

3,665

$1.191

$1.143

$1.096

-

Corohmni

South Africa . 345 parts In-Stock

1+ parts

$1.191

100+ parts

-

1k+ parts

-

10k+ parts

-

345

$1.191

-

-

-

Argo Parts USA

USA . 3,621 parts In-Stock

1+ parts

$1.200

100+ parts

-

1k+ parts

-

10k+ parts

-

3,621

$1.200

-

-

-

Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$1.227

100+ parts

$1.165

1k+ parts

$1.165

10k+ parts

-

10

$1.227

$1.165

$1.165

-

Ampacity Inc.

Singapore . 18,628 parts In-Stock

1+ parts

$2.260

100+ parts

-

1k+ parts

-

10k+ parts

-

18,628

$2.260

-

-

-

Microchip USA

USA . 10,568 parts In-Stock

1+ parts

$7.800

100+ parts

$7.752

1k+ parts

$7.752

10k+ parts

$7.752

10,568

$7.800

$7.752

$7.752

$7.752

Aztec Data Supply Inc.

USA . 8,066 parts In-Stock

1+ parts

$13.440

100+ parts

-

1k+ parts

-

10k+ parts

-

8,066

$13.440

-

-

-

Continental Prestige Electronics

USA . 29,970 parts In-Stock

1+ parts

-

100+ parts

$1.980

1k+ parts

$1.130

10k+ parts

-

29,970

-

$1.980

$1.130

-

RC Electronics

USA . 25,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

25,000

-

-

-

-

Infinite Electronics LLP (Excess)

. 10,004 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,004

-

-

-

-

Technical Specifications

Network Interfaces TLE9252VLCXUMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

2A

Telecom IC Type:

Terminal Finish:

TIN

Trade Compliance

TLE9252VLCXUMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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