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TJA1055T/C,512

NXP Semiconductors

TJA1055T/C,512 by NXP Semiconductors

NXP Semiconductors' TJA1055T/C,512 is a Network Interface IC with 14 terminals in a small outline package. It operates at 5V nominal voltage and has a peak reflow temperature of 260°C. Ideal for telecom applications due to its interface circuit design and compact dimensions.

Median Price

$1.060

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 28 parts In-Stock

1+ parts

-

100+ parts

$1.060

1k+ parts

$0.880

10k+ parts

$0.784

28

-

$1.060

$0.880

$0.784

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,569 parts In-Stock

1+ parts

$0.824

100+ parts

-

1k+ parts

-

10k+ parts

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3,569

$0.824

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.829

100+ parts

-

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-

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10

$0.829

-

-

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Vyrian

USA . 3,618 parts In-Stock

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3,618

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Anansix

USA . 1,572 parts In-Stock

1+ parts

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1,572

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ComSIT Distribution GmbH

Germany . 171 parts In-Stock

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171

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ComSIT USA

USA . 171 parts In-Stock

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171

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Distributors (Availability)

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Ampacity Inc.

Singapore . 28 parts In-Stock

1+ parts

$0.740

100+ parts

-

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-

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-

28

$0.740

-

-

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Semicontronic

India . 28 parts In-Stock

1+ parts

$0.740

100+ parts

$0.722

1k+ parts

$0.718

10k+ parts

-

28

$0.740

$0.722

$0.718

-

Corphita

USA . 3,573 parts In-Stock

1+ parts

$0.780

100+ parts

-

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3,573

$0.780

-

-

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Continental Prestige Electronics

USA . 6,309 parts In-Stock

1+ parts

$0.829

100+ parts

-

1k+ parts

-

10k+ parts

$0.812

6,309

$0.829

-

-

$0.812

Argo Parts USA

USA . 3,222 parts In-Stock

1+ parts

$0.829

100+ parts

-

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3,222

$0.829

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Netroflash

USA . 100 parts In-Stock

1+ parts

$0.829

100+ parts

$0.812

1k+ parts

-

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100

$0.829

$0.812

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Vigor

Singapore . 1,079 parts In-Stock

1+ parts

$0.830

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1,079

$0.830

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Microchip USA

USA . 2,812 parts In-Stock

1+ parts

$6.650

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2,812

$6.650

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Advanced Electronics

New Zealand . 59 parts In-Stock

1+ parts

$6.944

100+ parts

$6.597

1k+ parts

$6.597

10k+ parts

-

59

$6.944

$6.597

$6.597

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Corohmni

South Africa . 93 parts In-Stock

1+ parts

$13.748

100+ parts

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93

$13.748

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Aztec Data Supply Inc.

USA . 300 parts In-Stock

1+ parts

$13.890

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300

$13.890

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AZTECH Wire

Italy . 773 parts In-Stock

1+ parts

$18.470

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773

$18.470

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UNI Independent Distributors

Spain . 7,327 parts In-Stock

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7,327

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Perfect Parts

USA . 818 parts In-Stock

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818

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Overview

Elevate your network interface solutions with the TJA1055T/C,512 from NXP Semiconductors. With a reputation for excellence in manufacturing, this small outline package boasts 14 terminals and nickel palladium gold terminal finish for optimal performance. Ideal for a variety of applications, this interface circuit offers customers unparalleled value and benefits. Trust NXP Semiconductors to deliver quality products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy installation and efficient use of space on a circuit board.

Package Shape: RECTANGULAR

The rectangular package shape ensures compatibility with standard PCB layouts and facilitates easy integration.

No. of Terminals: 14

Having 14 terminals provides versatility in connectivity options and allows for multiple connections.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold as the terminal finish ensures excellent conductivity and corrosion resistance.

Maximum Seated Height: 1.75 mm

The low maximum seated height enables a compact design and efficient use of space in electronic devices.

Width: 3.9 mm

The narrow width of 3.9 mm allows for space-saving integration in tight layouts or small devices.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable soldering and performance under challenging operating conditions.

Length: 8.65 mm

The length of 8.65 mm provides a compact footprint while offering sufficient space for terminal placement and connections.

Terminal Form: GULL WING

The gull wing terminal form allows for secure solder joints and easy handling during assembly.

Telecom IC Type: INTERFACE CIRCUIT

The telecom IC type of interface circuit ensures compatibility with communication systems and seamless data transfer.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is a common standard in electronics, enabling easy integration with various devices and systems.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm allows for precise and secure connections, ensuring reliable performance in high-speed data applications.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that the product can withstand moderate exposure to moisture without compromising its performance.

Technical Specifications

Network Interfaces TJA1055T/C,512 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

14

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TJA1055T/C,512 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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