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73M2901CE-IM

Analog Devices

73M2901CE-IM by Analog Devices

73M2901CE-IM by Analog Devices is a modem IC with 32 terminals, operating at -40 to 85 °C. It has a power supply of 3/3.3V and max current of 15.5mA. This chip carrier package is surface mountable and suitable for industrial telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,505 parts In-Stock

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6,505

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Digiode

USA . 2,000 parts In-Stock

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2,000

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Anansix

USA . 647 parts In-Stock

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647

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Distributors (Availability)

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Native Components

USA . 1,554 parts In-Stock

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$0.461

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$0.443

1,554

$0.461

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$0.443

Northwest PG Solutions

USA . 3,068 parts In-Stock

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$0.548

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$0.484

3,068

$0.548

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$0.484

AZTECH Wire

Italy . 693 parts In-Stock

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$10.405

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693

$10.405

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MARBEL Systems

Belgium . 111 parts In-Stock

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$10.519

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111

$10.519

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Texas Native Microelectronics

USA . 2,962 parts In-Stock

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$12.091

100+ parts

$11.607

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$11.245

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$10.640

2,962

$12.091

$11.607

$11.245

$10.640

Kenton Components

USA . 1,794 parts In-Stock

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$14.509

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$12.768

1,794

$14.509

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$12.768

Qasali Group International

UK . 11,242 parts In-Stock

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$32.646

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$30.361

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$28.728

11,242

$32.646

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$30.361

$28.728

Semicontronic

India . 1,166 parts In-Stock

1+ parts

$486.000

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$473.850

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$471.420

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1,166

$486.000

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$471.420

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One Stop Electronics

USA . 2,681 parts In-Stock

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$531.000

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2,681

$531.000

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Corphita

USA . 2,363 parts In-Stock

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2,363

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Overview

Elevate your communication capabilities with the 73M2901CE-IM by Analog Devices. Crafted with precision and expertise, this modem offers unparalleled performance and reliability. Ideal for a wide range of applications, this modem is designed to meet the needs of modern technology. With Analog Devices' reputation for quality and innovation, you can trust that this product will exceed your expectations. Experience seamless connectivity and efficiency with the 73M2901CE-IM, providing value and benefits that will enhance your operations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the modem light weight and durable. It also helps in reducing manufacturing costs.

Surface Mount: YES

Surface mount technology makes the modem easy to install and saves space on the PCB, making it suitable for compact designs.

Power Supplies (V): 3/3.3

Support for multiple power supply options allows flexibility in usage and compatibility with different systems.

No. of Terminals: 32

The high number of terminals allows for a wide range of connectivity options and enhanced functionality.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides good heat dissipation and protection for the modem, ensuring reliability in operation.

Maximum Operating Temperature: 85 °C

High maximum operating temperature makes the modem suitable for industrial environments and ensures stable performance in challenging conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the modem to function reliably in cold environments without any issues.

Terminal Position: QUAD

Quad terminal position facilitates easy and secure connection of the modem, minimizing the risk of signal interference or loose connections.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures the modem can withstand harsh temperature conditions typically found in industrial settings.

Terminal Form: NO LEAD

Use of no lead terminal form is environmentally friendly and complies with regulations, making the modem a sustainable choice.

Maximum Supply Current: 15.5 mA

Low maximum supply current helps in minimizing power consumption and reducing operating costs over the long term.

Telecom IC Type: MODEM

Designed specifically for modem functionality, the telecom IC type ensures optimal performance and compatibility with telecommunication systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm enables high-density mounting and provides efficiency in PCB design, making the modem suitable for compact devices.

Technical Specifications

Modems 73M2901CE-IM attributes and parameters. Explore more Modems devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N32

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Sub-Category:

Modems

Maximum Supply Current:

15.5 mA

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

73M2901CE-IM Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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