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73K222L-IP

Texas Instruments

73K222L-IP by Texas Instruments

73K222L-IP by Texas Instruments is an industrial-grade modem IC with a data rate of 0.0012 Mbps. It operates b/w -40 to 85°C, has 28 terminals in an in-line package style, and requires a nominal voltage of 5V. Ideal for telecom applications requiring reliable communication within specified temperature ranges.

Median Price

$7.514

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,271 parts In-Stock

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Digiode

USA . 4,725 parts In-Stock

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PC Components Company LLC

USA . 261 parts In-Stock

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Bristol Electronics

USA . 261 parts In-Stock

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Component Sense

UK . 51 parts In-Stock

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$7.514

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$7.514

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$7.514

51

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$7.514

$7.514

ECAB

Sweden . 50 parts In-Stock

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MRC Electronics

USA . 26 parts In-Stock

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Prism Electronics

USA . 11 parts In-Stock

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Elcom Components

USA . 5 parts In-Stock

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ComSIT Distribution GmbH

Germany . 5 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 5 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 654 parts In-Stock

1+ parts

$5.492

100+ parts

$510.033

1k+ parts

$4.943

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654

$5.492

$510.033

$4.943

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DigiPath Technology Company

USA . 810 parts In-Stock

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$6.048

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ChromeModa Solutions

Germany . 3,280 parts In-Stock

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$6.171

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$5.060

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IDEA Electronic Components Group

UK . 1,735 parts In-Stock

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$6.171

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$5.554

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AZTECH Wire

Italy . 565 parts In-Stock

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$17.990

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$17.990

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One Stop Electronics

USA . 1,013 parts In-Stock

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$24.000

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Corphita

USA . 4,727 parts In-Stock

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Northwest PG Solutions

USA . 2,282 parts In-Stock

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Native Components

USA . 525 parts In-Stock

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525

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Infinite Electronics LLP (Excess)

. 149 parts In-Stock

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Assy Fe

Spain . 11 parts In-Stock

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Overview

Transform your communication experience with the 73K222L-IP by Texas Instruments. Crafted with precision and expertise, this modem offers unparalleled reliability and performance. Whether you're in need of high-speed data transmission or seamless connectivity, this product is designed to meet your needs. Elevate your projects with the innovative technology and quality that only Texas Instruments can provide. Experience the difference today and unlock a world of possibilities with the 73K222L-IP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the modem lightweight and durable, perfect for portable or long-term use.

Maximum Operating Temperature: 85 °C

The modem can operate efficiently in a wide range of temperature environments, making it suitable for various applications.

Nominal Supply Voltage: 5 V

The low supply voltage requirement of 5V makes the modem energy-efficient and ideal for use in power-constrained environments.

Data Rate: 0.0012 Mbps

The high data rate of 0.0012 Mbps ensures fast and reliable data transmission, making the modem suitable for high-speed internet connections or data-intensive tasks.

Technical Specifications

Modems 73K222L-IP attributes and parameters. Explore more Modems devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Data Rate:

.0012 Mbps

JESD-30 Code:

R-PDIP-T28

Length:

35.941 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.588 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

73K222L-IP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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