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12197-508-XTD

Onsemi

12197-508-XTD by Onsemi

12197-508-XTD by Onsemi is a modem chip carrier with 28 terminals, CMOS technology, and 3.3V supply voltage. It operates b/w -40 to 85 °C and has a data rate of 0.0012 Mbps. Ideal for industrial telecom applications due to its compact square shape and surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,990 parts In-Stock

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Vyrian

USA . 1,584 parts In-Stock

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Kulean Microsystems

USA . 7,073 parts In-Stock

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TANS Electronics

Latvia . 5,981 parts In-Stock

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Problanco Electronics

Mexico . 5,026 parts In-Stock

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SupplyDigital Components

Austria . 4,853 parts In-Stock

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Northwest PG Solutions

USA . 1,404 parts In-Stock

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UHIMA Technologies

Türkiye . 813 parts In-Stock

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Native Components

USA . 238 parts In-Stock

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Corohmni

South Africa . 216 parts In-Stock

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Corphita

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Overview

Looking for a reliable and high-quality modem for your telecommunications needs? Look no further than the Onsemi 12197-508-XTD. Manufactured by industry leader Onsemi, this modem offers unmatched performance and durability. Perfect for a wide range of applications, this modem is a must-have for any customer looking for top-of-the-line technology at an affordable price. Say goodbye to slow connections and hello to seamless communication with the Onsemi 12197-508-XTD.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and lightweight design, making the modem easy to handle and transport.

Surface Mount: YES

Surface mount technology allows for easy installation and removal of the modem from circuit boards, saving time and effort in maintenance.

Package Shape: SQUARE

Square package shape provides compatibility with a wide range of circuit board layouts, making it versatile for different system designs.

No. of Terminals: 28

With 28 terminals, the modem offers a higher level of connectivity and compatibility with various devices, enhancing system functionality.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85 °C ensures reliable performance under challenging environmental conditions, making it suitable for industrial applications.

Nominal Supply Voltage: 3.3 V

Operating at a nominal voltage of 3.3V ensures energy efficiency and compatibility with standard power sources, saving on power consumption costs.

Data Rate: 0.0012 Mbps

Offering a data rate of 0.0012 Mbps, the modem provides efficient data transmission capabilities for fast and reliable communication processes.

Technical Specifications

Modems 12197-508-XTD attributes and parameters. Explore more Modems devices from Onsemi

Specs

Data Rate:

.0012 Mbps

JESD-30 Code:

S-PQCC-J28

Length:

11.4808 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.572 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.4808 mm

Trade Compliance

12197-508-XTD Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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