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12197-504

Onsemi

12197-504 by Onsemi

12197-504 by Onsemi is a modem IC with 28 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial use. With a data rate of 0.0012 Mbps and nominal voltage of 3.3V, it's ideal for telecom applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Digiode

USA . 303 parts In-Stock

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Vyrian

USA . 114 parts In-Stock

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SupplyDigital Components

Austria . 7,740 parts In-Stock

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7,740

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Problanco Electronics

Mexico . 4,050 parts In-Stock

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TANS Electronics

Latvia . 3,261 parts In-Stock

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Northwest PG Solutions

USA . 1,913 parts In-Stock

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Corphita

USA . 1,476 parts In-Stock

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Native Components

USA . 416 parts In-Stock

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Kulean Microsystems

USA . 211 parts In-Stock

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UHIMA Technologies

Türkiye . 158 parts In-Stock

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Corohmni

South Africa . 125 parts In-Stock

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Overview

Enhance your communication capabilities with the 12197-504 by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their modem products. This versatile chip carrier is perfect for various applications, offering customers the value of seamless data transmission at a nominal supply voltage of 3.3V. Say goodbye to connectivity issues and hello to smooth operations with this modem that guarantees optimal performance even in industrial temperature settings. Trust Onsemi to deliver the perfect solution for your communication needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the modem lightweight and durable, perfect for portable or stationary use.

Surface Mount: YES

Surface mount design allows for easy installation on circuit boards, reducing assembly time and cost.

Package Shape: SQUARE

Square package shape helps optimize space on the circuit board, making the modem suitable for compact designs.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options and enhances the functionality of the modem.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers excellent heat dissipation and electrical performance, ensuring reliable operation.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows the modem to function efficiently in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the modem can withstand cold temperatures without compromising performance.

Terminal Position: QUAD

Quad terminal position simplifies the installation process and improves connection stability.

Maximum Seated Height: 4.572 mm

Low maximum seated height minimizes the overall profile of the modem, making it suitable for slim devices.

Width: 11.4808 mm

Narrow width allows for efficient space utilization on the circuit board, enabling a compact modem design.

Length: 11.4808 mm

Short length helps in fitting the modem into tight spaces, ideal for products with limited space constraints.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures the modem can withstand harsh industrial environments without any issues.

Technology: CMOS

CMOS technology offers low power consumption and high reliability, making the modem energy-efficient and durable.

Terminal Form: J BEND

J Bend terminal form simplifies the soldering process, ensuring secure and stable connections for reliable performance.

Telecom IC Type: MODEM

Designed specifically as a modem telecom IC type, this product provides high-speed data transmission and reliable connectivity.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources and efficient power usage.

Terminal Pitch: 1.27 mm

Close terminal pitch provides high-density connections, maximizing the functionality and performance of the modem.

Data Rate: 0.0012 Mbps

High data rate of 0.0012 Mbps allows for quick and efficient data transmission, making this modem ideal for high-speed applications.

Technical Specifications

Modems 12197-504 attributes and parameters. Explore more Modems devices from Onsemi

Specs

Data Rate:

.0012 Mbps

JESD-30 Code:

S-PQCC-J28

Length:

11.4808 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.572 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.4808 mm

Trade Compliance

12197-504 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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