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NCN49597C5972MNRG

Onsemi

NCN49597C5972MNRG by Onsemi

The Onsemi NCN49597C5972MNRG is a programmable modem with 52 terminals, operating at -40 to 115 °C. It has a supply voltage of 3.3V and comes in a square chip carrier package for industrial applications. This modem is surface mountable and suitable for telecom systems requiring high temperature tolerance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,663 parts In-Stock

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Digiode

USA . 1,349 parts In-Stock

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1,349

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TANS Electronics

Latvia . 7,607 parts In-Stock

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7,607

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Problanco Electronics

Mexico . 3,318 parts In-Stock

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SupplyDigital Components

Austria . 1,566 parts In-Stock

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Corphita

USA . 1,203 parts In-Stock

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Kulean Microsystems

USA . 900 parts In-Stock

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900

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Corohmni

South Africa . 279 parts In-Stock

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UHIMA Technologies

Türkiye . 117 parts In-Stock

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Overview

Discover the cutting-edge NCN49597C5972MNRG by Onsemi, a high-quality programmable modem that offers unparalleled reliability and performance. Manufactured by Onsemi, a trusted industry leader, this modem is ideal for a wide range of applications. From industrial automation to telecommunications, this versatile product provides customers with exceptional value and benefits. Say goodbye to connectivity issues and hello to seamless communication with the NCN49597C5972MNRG. Elevate your projects with this top-of-the-line modem today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy as the package body material ensures durability and resistance against environmental factors, making this modem a reliable choice.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and simplifying the manufacturing process.

Package Shape: SQUARE

The square package shape contributes to efficient space utilization on the PCB, making it suitable for compact electronic devices.

Power Supplies (V): 3.3

Operates at a low voltage of 3.3V, making it energy-efficient and suitable for a wide range of applications.

No. of Terminals: 52

Having 52 terminals allows for versatile connectivity options and the ability to interface with various components in a system.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers a compact form factor and good thermal performance, ideal for high-density PCB designs.

Maximum Operating Temperature: 115 °C

With a high maximum operating temperature of 115 °C, this modem can withstand demanding environmental conditions and ensures reliable performance.

Minimum Operating Temperature: -40 °C

The modem can operate effectively even in extreme cold temperatures down to -40 °C, making it suitable for a wide range of industrial applications.

Terminal Position: QUAD

The quad terminal position offers easy access and secure connections, contributing to the overall reliability and stability of the modem.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, this modem is built to withstand harsh conditions and ensure consistent performance in demanding applications.

Terminal Form: NO LEAD

The lead-free terminal form complies with environmental regulations and industry standards, making this modem an environmentally friendly choice.

Telecom IC Type: PROGRAMMABLE MODEM

Featuring a programmable modem allows for customization and flexibility in communication protocols, making it a versatile and adaptable solution for different applications.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage ensures compatibility with standard power sources and enables efficient power management in the system.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch provides good connectivity and high-density integration on the PCB, enhancing the overall performance and reliability of the modem.

Technical Specifications

Modems NCN49597C5972MNRG attributes and parameters. Explore more Modems devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-N52

No. of Terminals:

52

Maximum Operating Temperature:

115 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC52,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Modems

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

NCN49597C5972MNRG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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