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NE5080N

NXP Semiconductors

NE5080N by NXP Semiconductors

MODEM-MODULATOR; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

$12.250

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

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Forefront Electronics and Design

USA . 35 parts In-Stock

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Digiode

USA . 2,169 parts In-Stock

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Vyrian

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Anansix

USA . 483 parts In-Stock

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Prism Electronics

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R&J Components

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QIE Inc.

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Sogenti Electronics

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LWI Electronics Inc

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ACDS - Activité Composants Distribution Service

France . 10 parts In-Stock

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Manotoh

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Distributors (Availability)

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One Stop Electronics

USA . 597 parts In-Stock

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$953.000

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Kepictronics

USA . 7,500 parts In-Stock

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UNI Independent Distributors

Spain . 7,197 parts In-Stock

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Corphita

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Assy Fe

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Metaverse IC Inc.

Canada . 787 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 10 parts In-Stock

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Technical Specifications

Modems NE5080N attributes and parameters. Explore more Modems devices from NXP Semiconductors

Specs

Additional Features:

HALF DUPLEX; FULL DUPLEX

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3/e4

Length:

19.025 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Supply Current:

100 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

NE5080N Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-334-9828, 5962013349828

NIIN

013349828

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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