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SX061J

Onsemi

SX061J by Onsemi

SX061J by Onsemi is a modem-demodulator IC with 1 Mbps data rate. It features 28 terminals in a square chip carrier package, with J bend terminal form and quad position. Suitable for telecom applications, it offers surface mount capability and compact dimensions of 11.5062mm x 11.5062mm x 4.57mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,370 parts In-Stock

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2,370

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Digiode

USA . 575 parts In-Stock

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575

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LWI Electronics Inc

India . 3 parts In-Stock

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3

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SupplyDigital Components

Austria . 5,268 parts In-Stock

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5,268

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Kulean Microsystems

USA . 4,432 parts In-Stock

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4,432

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Problanco Electronics

Mexico . 3,402 parts In-Stock

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3,402

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Corphita

USA . 2,294 parts In-Stock

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TANS Electronics

Latvia . 1,777 parts In-Stock

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1,777

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Corohmni

South Africa . 243 parts In-Stock

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UHIMA Technologies

Türkiye . 153 parts In-Stock

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153

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Overview

Upgrade your communication systems with the SX061J by Onsemi, a high-quality modem that delivers reliable performance and seamless connectivity. Manufactured by Onsemi, a trusted name in the industry, this modem is designed to meet the demands of modern telecommunications. With its compact design and advanced features, the SX061J is perfect for a wide range of applications, from data transfer to voice communications. Experience the value and benefits of this innovative product and revolutionize the way you connect with others.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the modem lightweight and durable, ideal for transportation and long-term use.

Surface Mount: YES

Being surface mountable simplifies the installation process and allows for a more compact design, saving space in electronic devices.

Package Shape: SQUARE

The square package shape offers efficiency in storage and stacking, making it easy to integrate into various electronic systems.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options, allowing for flexible installation and compatibility with different devices or systems.

Package Style (Meter): CHIP CARRIER

The chip carrier style offers a low profile design, saving space and enabling a more streamlined layout in electronic applications.

Terminal Position: QUAD

The quad terminal position allows for efficient signal transmission and connectivity, enhancing performance and reliability.

Maximum Seated Height: 4.57 mm

With a low seated height, this modem can be easily integrated into slim devices or tight spaces without compromising on performance.

Width: 11.5062 mm

The compact width of the modem enables it to be installed in narrow electronic systems, making it a versatile choice for various applications.

Length: 11.5062 mm

The short length of the modem allows for easy integration into compact devices, ensuring a space-saving and efficient solution.

Terminal Form: J BEND

The J bend terminal form offers a secure and reliable connection, minimizing the risk of signal loss or disconnection during operation.

Telecom IC Type: MODEM-DEMODULATOR

The modem-demodulator type ensures efficient data transmission and reception, making it suitable for telecommunications and data transfer applications.

Terminal Pitch: 1.27 mm

The tight terminal pitch allows for high-density mounting, maximizing connectivity options and enabling a more compact and efficient design.

Data Rate: 1 Mbps

The high data rate of 1 Mbps ensures fast and reliable data transfer, making this modem suitable for applications that require high-speed connectivity.

Technical Specifications

Modems SX061J attributes and parameters. Explore more Modems devices from Onsemi

Specs

Data Rate:

1 Mbps

JESD-30 Code:

S-PQCC-J28

Length:

11.5062 mm

No. of Functions:

1

No. of Terminals:

28

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.5062 mm

Trade Compliance

SX061J Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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