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TMS99532NL

Texas Instruments

TMS99532NL by Texas Instruments

TMS99532NL by Texas Instruments is a modem IC with 18 terminals in an in-line package. It operates b/w 0°C to 70°C, suitable for commercial applications. Utilizes MOS technology and through-hole terminal form, ideal for telecom systems requiring reliable data transmission.

Median Price

$15.600

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TEDSS.com

USA . 514 parts In-Stock

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$15.600

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514

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Vyrian

USA . 7,317 parts In-Stock

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Bristol Electronics

USA . 2,843 parts In-Stock

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2,843

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Electronic Expediters

USA . 2,183 parts In-Stock

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Atlantic Semiconductor

USA . 1,916 parts In-Stock

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MRC Electronics

USA . 1,125 parts In-Stock

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Inland Empire Components Inc.

USA . 1,076 parts In-Stock

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Digiode

USA . 955 parts In-Stock

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M&R Communications

USA . 740 parts In-Stock

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740

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R&J Components

USA . 447 parts In-Stock

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Sogenti Electronics

Canada . 148 parts In-Stock

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MISTER SPROCKETS

USA . 42 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 29 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 4 parts In-Stock

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Electronics Depot

USA . 3 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 629 parts In-Stock

1+ parts

$10.874

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$11.350

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629

$10.874

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$11.350

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DigiPath Technology Company

USA . 1,292 parts In-Stock

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$11.974

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$11.016

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1,292

$11.974

$11.016

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ChromeModa Solutions

Germany . 4,221 parts In-Stock

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$12.218

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$10.019

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4,221

$12.218

$10.019

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IDEA Electronic Components Group

UK . 1,279 parts In-Stock

1+ parts

$12.218

100+ parts

$11.607

1k+ parts

$10.996

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1,279

$12.218

$11.607

$10.996

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AZTECH Wire

Italy . 352 parts In-Stock

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$14.610

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352

$14.610

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One Stop Electronics

USA . 1,407 parts In-Stock

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$725.000

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Corphita

USA . 2,678 parts In-Stock

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Perfect Parts

USA . 252 parts In-Stock

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252

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Assy Fe

Spain . 4 parts In-Stock

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A-Plus Industry Inc.

USA . 2 parts In-Stock

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Overview

Upgrade your communication systems with the TMS99532NL by Texas Instruments, a leading manufacturer known for top-quality products. This modem is perfect for a variety of applications, offering reliable connectivity and seamless data transmission. Experience the value and benefits of this high-performance device, designed to meet your needs and exceed your expectations. Stay ahead of the game with Texas Instruments and revolutionize your communication solutions today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body material makes this modem lightweight and durable, ideal for easy installation and long-term use.

No. of Terminals: 18

Having 18 terminals allows for a sufficient number of connections and functionality, enabling the modem to support various devices and networks.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this modem can operate efficiently in a wide range of environmental conditions, ensuring reliability and performance.

Technology: MOS

Utilizing MOS technology ensures high performance, efficiency, and reliability in data transmission and processing, making this modem a top choice for fast and stable internet connections.

Telecom IC Type: MODEM

Being specifically designed as a modem telecom IC type ensures compatibility and optimized performance for telecommunication applications, making it a reliable choice for communication needs.

Technical Specifications

Modems TMS99532NL attributes and parameters. Explore more Modems devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T18

No. of Terminals:

18

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Modems

Surface Mount:

NO

Technology:

MOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TMS99532NL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-223-3032, 5962012233032

NIIN

012233032

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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