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TCM3105DWE

Texas Instruments

TCM3105DWE by Texas Instruments

Texas Instruments TCM3105DWE is a 24-terminal modem IC with 5V supply voltage, operating b/w -40 to 85°C. It features CMOS technology, GULL WING terminals, and consumes max 16mA current. Ideal for industrial telecom applications due to its small outline package and surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,670 parts In-Stock

1+ parts

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6,670

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Digiode

USA . 4,765 parts In-Stock

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4,765

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 336 parts In-Stock

1+ parts

$9.106

100+ parts

-

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336

$9.106

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Parana Technologies

USA . 1,042 parts In-Stock

1+ parts

$13.169

100+ parts

-

1k+ parts

$13.674

10k+ parts

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1,042

$13.169

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$13.674

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DigiPath Technology Company

USA . 1,537 parts In-Stock

1+ parts

$14.501

100+ parts

$13.341

1k+ parts

-

10k+ parts

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1,537

$14.501

$13.341

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ChromeModa Solutions

Germany . 527 parts In-Stock

1+ parts

$14.797

100+ parts

$12.134

1k+ parts

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527

$14.797

$12.134

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IDEA Electronic Components Group

UK . 502 parts In-Stock

1+ parts

$14.797

100+ parts

$14.057

1k+ parts

$13.317

10k+ parts

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502

$14.797

$14.057

$13.317

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Semicontronic

India . 398 parts In-Stock

1+ parts

$750.000

100+ parts

$731.250

1k+ parts

$727.500

10k+ parts

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398

$750.000

$731.250

$727.500

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One Stop Electronics

USA . 591 parts In-Stock

1+ parts

$788.000

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591

$788.000

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Corphita

USA . 511 parts In-Stock

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511

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Corohmni

South Africa . 90 parts In-Stock

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90

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Overview

Unlock seamless communication with the TCM3105DWE from Texas Instruments, a leading manufacturer known for its high-quality products. This modem is designed to provide reliable connectivity in various applications, making it a versatile and indispensable tool for your projects. With its compact size and industrial-grade temperature range, this modem offers exceptional value and performance. Stay connected with ease using the TCM3105DWE and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the modem easy to handle and suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and facilitating mass production.

Package Shape: RECTANGULAR

Rectangular shape is commonly used and fits well in electronic assemblies, providing compatibility with existing designs.

Power Supplies (V): 5

Operates on a standard voltage of 5V, making it compatible with most power sources and reducing the need for additional components.

No. of Terminals: 24

Having 24 terminals allows for multiple connections and functionalities, enhancing the modem's performance and versatility.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making it ideal for compact electronic devices and applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the modem can withstand challenging environmental conditions and maintain stable performance.

Minimum Operating Temperature: -40 °C

The modem can operate in cold temperatures as low as -40°C, making it suitable for various industrial and outdoor applications.

Terminal Position: DUAL

Dual terminal position allows for secure connections and reliable signal transmission, ensuring stable and efficient operation.

Maximum Seated Height: 2.65 mm

Low maximum seated height helps reduce the overall profile of the modem, making it suitable for slim and compact devices.

Width: 7.5 mm

Narrow width of the modem saves space on the PCB and allows for efficient placement in electronic assemblies.

Length: 15.4 mm

Compact length of the modem contributes to its space-saving design, making it suitable for applications where size is a critical factor.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments, enhancing the modem's durability and longevity.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the modem energy-efficient and stable in various operating conditions.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder connections and enhances the modem's mechanical strength, ensuring long-term reliability.

Maximum Supply Current: 16 mA

Low maximum supply current consumption helps conserve energy and reduce operating costs, making the modem an efficient choice for long-term use.

Telecom IC Type: MODEM

Specifically designed as a modem, this product offers reliable and high-speed data communication, making it ideal for telecommunications applications.

Nominal Supply Voltage: 5 V

Operates at a standard nominal supply voltage of 5V, ensuring compatibility with typical power sources and simplifying integration into electronic systems.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for compact and efficient PCB layout, enabling high-density mounting and optimizing signal routing within the modem.

Technical Specifications

Modems TCM3105DWE attributes and parameters. Explore more Modems devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Modems

Maximum Supply Current:

16 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

TCM3105DWE Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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