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73K324L-IG

Texas Instruments

73K324L-IG by Texas Instruments

73K324L-IG by Texas Instruments is a modem IC with data rate of 0.0024 Mbps. It operates in industrial temperature range (-40 to 85 °C) and has 52 terminals in a square flatpack package style. Ideal for telecom applications, it features gull wing terminal form and requires nominal voltage of 5 V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,857 parts In-Stock

1+ parts

-

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1k+ parts

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3,857

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Vyrian

USA . 3,779 parts In-Stock

1+ parts

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100+ parts

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3,779

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 88 parts In-Stock

1+ parts

$0.096

100+ parts

-

1k+ parts

-

10k+ parts

$0.092

88

$0.096

-

-

$0.092

Northwest PG Solutions

USA . 78 parts In-Stock

1+ parts

$0.106

100+ parts

-

1k+ parts

-

10k+ parts

$0.093

78

$0.106

-

-

$0.093

Parana Technologies

USA . 1,770 parts In-Stock

1+ parts

$12.083

100+ parts

-

1k+ parts

$12.494

10k+ parts

-

1,770

$12.083

-

$12.494

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AZTECH Wire

Italy . 298 parts In-Stock

1+ parts

$13.542

100+ parts

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298

$13.542

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IDEA Electronic Components Group

UK . 1,974 parts In-Stock

1+ parts

$13.576

100+ parts

$12.897

1k+ parts

$12.218

10k+ parts

-

1,974

$13.576

$12.897

$12.218

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ChromeModa Solutions

Germany . 951 parts In-Stock

1+ parts

$13.576

100+ parts

$11.132

1k+ parts

-

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951

$13.576

$11.132

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One Stop Electronics

USA . 972 parts In-Stock

1+ parts

$505.000

100+ parts

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972

$505.000

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Corphita

USA . 4,003 parts In-Stock

1+ parts

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4,003

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DigiPath Technology Company

USA . 1,336 parts In-Stock

1+ parts

-

100+ parts

$12.240

1k+ parts

-

10k+ parts

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1,336

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$12.240

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Overview

Unlock the power of seamless connectivity with the 73K324L-IG by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality modems that guarantee reliability and efficiency. Ideal for various applications, this modem offers unparalleled value with its high performance and versatile capabilities. Experience the advantages of fast data transmission and robust communication with the 73K324L-IG, setting new standards for connectivity solutions. Trust Texas Instruments for cutting-edge technology that elevates your connectivity experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the modem lightweight and durable, ideal for portable or stationary use.

Surface Mount: YES

Being surface mountable allows for easy integration into circuit boards, saving space and making installation more convenient.

Package Shape: SQUARE

The square package shape provides a compact design, making it easy to fit into tight spaces within electronic devices.

No. of Terminals: 52

With a high number of terminals, the modem can support complex connectivity requirements, allowing for versatile use in diverse applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the modem can withstand heat and operate reliably in various environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the modem to function in cold conditions without any issues, making it suitable for a wide range of environments.

Terminal Position: QUAD

Having terminals in a quad position facilitates easy connections and helps in ensuring proper alignment during installation, enhancing overall reliability.

Maximum Seated Height: 2.43 mm

The low maximum seated height allows for a sleek and compact design, making the modem suitable for space-constrained installations.

Width: 10 mm

The slim width of the modem enables it to be easily incorporated into electronic setups with limited space, enhancing flexibility in placement.

Length: 10 mm

The short length of the modem contributes to a space-efficient design, making it compatible with compact devices without sacrificing performance.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperatures ensures the modem can operate reliably in harsh industrial environments, making it a dependable choice for industrial applications.

Terminal Form: GULL WING

The gull wing terminal form provides a secure connection and facilitates easy soldering during installation, ensuring robust electrical connections.

Telecom IC Type: MODEM

Designed specifically as a modem, this product is optimized for data transmission over telecom networks, ensuring reliable and efficient communication capabilities.

Nominal Supply Voltage: 5 V

With a standard nominal supply voltage of 5V, the modem can be easily powered using common power sources, offering compatibility and ease of integration.

Terminal Pitch: 0.65 mm

The small terminal pitch enables high-density mounting on circuit boards, allowing for more compact and efficient electronic designs.

Data Rate: 0.0024 Mbps

The high data rate of 0.0024 Mbps ensures fast and reliable data transmission, making the modem suitable for applications requiring high-speed communication.

Technical Specifications

Modems 73K324L-IG attributes and parameters. Explore more Modems devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Data Rate:

.0024 Mbps

JESD-30 Code:

S-PQFP-G52

Length:

10 mm

No. of Functions:

1

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

2.43 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

73K324L-IG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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