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73K324L-IH

Texas Instruments

73K324L-IH by Texas Instruments

73K324L-IH by Texas Instruments is a modem IC with data rate of 0.0024 Mbps. It operates in industrial temperature range (-40 to 85 °C) and requires nominal voltage of 5 V. This chip carrier package has 44 terminals, measures 16.5862 mm in width and length, and is suitable for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,100 parts In-Stock

1+ parts

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6,100

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Digiode

USA . 588 parts In-Stock

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588

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,188 parts In-Stock

1+ parts

$13.735

100+ parts

-

1k+ parts

$14.225

10k+ parts

-

2,188

$13.735

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$14.225

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IDEA Electronic Components Group

UK . 2,104 parts In-Stock

1+ parts

$15.433

100+ parts

$14.661

1k+ parts

$13.890

10k+ parts

-

2,104

$15.433

$14.661

$13.890

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ChromeModa Solutions

Germany . 1,517 parts In-Stock

1+ parts

$15.433

100+ parts

$12.655

1k+ parts

-

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1,517

$15.433

$12.655

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AZTECH Wire

Italy . 752 parts In-Stock

1+ parts

$17.843

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752

$17.843

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One Stop Electronics

USA . 1,484 parts In-Stock

1+ parts

$984.000

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1,484

$984.000

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DigiPath Technology Company

USA . 1,618 parts In-Stock

1+ parts

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100+ parts

$13.914

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1,618

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$13.914

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Corphita

USA . 514 parts In-Stock

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514

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Northwest PG Solutions

USA . 506 parts In-Stock

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506

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Native Components

USA . 488 parts In-Stock

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488

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Overview

Unleash the power of connectivity with the 73K324L-IH by Texas Instruments. Crafted with precision and expertise, this modem exemplifies quality and reliability that only a manufacturer like Texas Instruments can deliver. From industrial applications to telecommunications, this versatile chip carrier offers seamless integration and efficient performance. Elevate your projects with the unparalleled value and benefits that the 73K324L-IH brings, setting you apart from the competition in the ever-evolving world of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the modem, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable makes the modem easy to incorporate into electronic devices, simplifying the manufacturing process and saving space on PCBs.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this modem can operate effectively in harsh environmental conditions, making it suitable for industrial applications where temperature fluctuations are common.

Nominal Supply Voltage: 5 V

The 5V supply voltage requirement is a common standard in many electronic systems, ensuring compatibility and ease of integration with existing setups.

Data Rate: 0.0024 Mbps

While the data rate may not be the highest, for basic data transfer needs, such as remote monitoring or control applications, this modem provides reliable communication at a suitable speed.

Technical Specifications

Modems 73K324L-IH attributes and parameters. Explore more Modems devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Data Rate:

.0024 Mbps

JESD-30 Code:

S-PQCC-J44

Length:

16.5862 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.5862 mm

Trade Compliance

73K324L-IH Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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