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73K321SL-IP

Texas Instruments

73K321SL-IP by Texas Instruments

73K321SL-IP by Texas Instruments is an industrial-grade modem IC with a data rate of 0.0012 Mbps. It operates b/w -40°C to 85°C, has 22 terminals in an in-line package style, and requires a nominal voltage of 5V. Ideal for telecom applications requiring reliable communication within specified temperature ranges.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,857 parts In-Stock

1+ parts

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6,857

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Digiode

USA . 4,566 parts In-Stock

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4,566

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 181 parts In-Stock

1+ parts

$0.099

100+ parts

-

1k+ parts

-

10k+ parts

$0.095

181

$0.099

-

-

$0.095

Northwest PG Solutions

USA . 220 parts In-Stock

1+ parts

$0.109

100+ parts

-

1k+ parts

-

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$0.096

220

$0.109

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-

$0.096

Parana Technologies

USA . 2,078 parts In-Stock

1+ parts

$10.004

100+ parts

-

1k+ parts

$10.565

10k+ parts

-

2,078

$10.004

-

$10.565

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DigiPath Technology Company

USA . 1,307 parts In-Stock

1+ parts

$11.016

100+ parts

$10.135

1k+ parts

-

10k+ parts

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1,307

$11.016

$10.135

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ChromeModa Solutions

Germany . 5,932 parts In-Stock

1+ parts

$11.241

100+ parts

$9.218

1k+ parts

-

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5,932

$11.241

$9.218

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IDEA Electronic Components Group

UK . 1,747 parts In-Stock

1+ parts

$11.241

100+ parts

$10.679

1k+ parts

$10.117

10k+ parts

-

1,747

$11.241

$10.679

$10.117

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AZTECH Wire

Italy . 832 parts In-Stock

1+ parts

$15.039

100+ parts

-

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832

$15.039

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One Stop Electronics

USA . 815 parts In-Stock

1+ parts

$929.000

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815

$929.000

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Corphita

USA . 3,273 parts In-Stock

1+ parts

-

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3,273

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Overview

Elevate your connectivity with the 73K321SL-IP by Texas Instruments, a cutting-edge modem designed for industrial-grade applications. Crafted with precision and expertise by the renowned manufacturer, this modem offers reliable performance and seamless integration for a wide range of telecom solutions. Whether you're looking to enhance your communication systems or streamline your data transfer processes, this modem delivers unparalleled value and efficiency. Upgrade your technology today with the 73K321SL-IP and experience the difference in quality and reliability that Texas Instruments is known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the modem easy to handle and long-lasting.

No. of Terminals: 22

Having a sufficient number of terminals allows for better connectivity options and flexibility in setting up the modem.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the modem can function reliably even in challenging environmental conditions.

Nominal Supply Voltage: 5 V

The moderate supply voltage required for this modem makes it compatible with a wide range of power sources.

Data Rate: 0.0012 Mbps

Although not the fastest data rate, it is suitable for basic internet browsing and email usage, making this modem a good choice for simple applications.

Technical Specifications

Modems 73K321SL-IP attributes and parameters. Explore more Modems devices from Texas Instruments

Specs

Additional Features:

HALF DUPLEX; FULL DUPLEX

Data Rate:

.0012 Mbps

JESD-30 Code:

R-PDIP-T22

Length:

27.686 mm

No. of Functions:

1

No. of Terminals:

22

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

73K321SL-IP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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