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73K321L-IP

Texas Instruments

73K321L-IP by Texas Instruments

73K321L-IP by Texas Instruments is an industrial-grade modem IC with a data rate of 0.0012 Mbps. It features a rectangular package style with 28 terminals and operates b/w -40°C to 85°C. Ideal for telecom applications requiring reliable communication at a nominal voltage of 5V.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,123 parts In-Stock

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5,123

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Component Sense

UK . 2,000 parts In-Stock

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2,000

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ComSIT Distribution GmbH

Germany . 1,320 parts In-Stock

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1,320

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Digiode

USA . 874 parts In-Stock

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874

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Electronic Expediters

USA . 15 parts In-Stock

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15

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ECAB

Sweden . 1 parts In-Stock

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1

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Distributors (Availability)

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Native Components

USA . 658 parts In-Stock

1+ parts

$0.243

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$0.233

658

$0.243

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$0.233

Northwest PG Solutions

USA . 3 parts In-Stock

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$0.267

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$0.236

3

$0.267

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$0.236

AZTECH Wire

Italy . 869 parts In-Stock

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$7.689

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869

$7.689

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Parana Technologies

USA . 632 parts In-Stock

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$11.349

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$11.777

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632

$11.349

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$11.777

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DigiPath Technology Company

USA . 1,529 parts In-Stock

1+ parts

$12.497

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1,529

$12.497

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ChromeModa Solutions

Germany . 1,596 parts In-Stock

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$12.752

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$10.457

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1,596

$12.752

$10.457

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IDEA Electronic Components Group

UK . 505 parts In-Stock

1+ parts

$12.752

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$12.114

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$11.477

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505

$12.752

$12.114

$11.477

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One Stop Electronics

USA . 457 parts In-Stock

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$509.000

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457

$509.000

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 1,654 parts In-Stock

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Assy Fe

Spain . 73 parts In-Stock

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73

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Overview

Discover the cutting-edge technology of the 73K321L-IP by Texas Instruments, a top-of-the-line modem designed to exceed your expectations. With Texas Instruments' reputation for quality and innovation, this modem delivers unmatched performance in various applications. Experience seamless connectivity and reliable data transmission with this modem, providing value and efficiency for all your communication needs. Trust in Texas Instruments to bring you the best in telecom IC technology with the 73K321L-IP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and provides protection to the internal components of the modem.

No. of Terminals: 28

Having 28 terminals allows for connectivity to multiple devices, making this modem versatile and suitable for various networking setups.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this modem can perform reliably in a wide range of environments without overheating.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate this modem into existing systems.

Data Rate: 0.0012 Mbps

While the data rate of 0.0012 Mbps may not be the fastest, it is suitable for basic internet browsing and light networking tasks, making this modem ideal for small scale applications.

Technical Specifications

Modems 73K321L-IP attributes and parameters. Explore more Modems devices from Texas Instruments

Specs

Additional Features:

HALF DUPLEX; FULL DUPLEX

Data Rate:

.0012 Mbps

JESD-30 Code:

R-PDIP-T28

Length:

35.941 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.588 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

73K321L-IP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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