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A5191HRTLG-XTP

Onsemi

A5191HRTLG-XTP by Onsemi

A5191HRTLG-XTP by Onsemi is a modem IC with 32 terminals, operating at 3.3V/5V. It features a flatpack, low profile package style suitable for industrial applications. With a data rate of 0.0012 Mbps and terminal pitch of 0.8mm, it is ideal for telecom systems requiring reliable performance in a compact form factor.

Median Price

$8.460

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 5,710 parts In-Stock

1+ parts

$8.460

100+ parts

$6.412

1k+ parts

$5.676

10k+ parts

$5.390

5,710

$8.460

$6.412

$5.676

$5.390

Mouser Electronics

USA . 99 parts In-Stock

1+ parts

$8.460

100+ parts

$6.420

1k+ parts

$5.270

10k+ parts

$5.120

99

$8.460

$6.420

$5.270

$5.120

Rochester

USA . 978 parts In-Stock

1+ parts

$9.030

100+ parts

$8.850

1k+ parts

$8.670

10k+ parts

-

978

$9.030

$8.850

$8.670

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Verical

USA . 12,500 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$5.474

12,500

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-

-

$5.474

Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$7.727

100+ parts

-

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300

$7.727

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Digiode

USA . 2,072 parts In-Stock

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$8.578

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2,072

$8.578

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Maritex

Poland . 2,695 parts In-Stock

1+ parts

$12.896

100+ parts

$7.056

1k+ parts

$5.547

10k+ parts

-

2,695

$12.896

$7.056

$5.547

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Chip Stock

USA . 11,500 parts In-Stock

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Vyrian

USA . 6,125 parts In-Stock

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6,125

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Cyclops Electronics Ltd

UK . 2,550 parts In-Stock

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2,550

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Bristol Electronics

USA . 127 parts In-Stock

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127

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Prism Electronics

USA . 4 parts In-Stock

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4

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Distributors (Availability)

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AZTECH Wire

Italy . 755 parts In-Stock

1+ parts

$5.779

100+ parts

-

1k+ parts

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755

$5.779

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Corohmni

South Africa . 82 parts In-Stock

1+ parts

$7.572

100+ parts

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82

$7.572

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Semicontronic

India . 765 parts In-Stock

1+ parts

$7.680

100+ parts

$7.488

1k+ parts

$7.450

10k+ parts

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765

$7.680

$7.488

$7.450

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Continental Prestige Electronics

USA . 2,436 parts In-Stock

1+ parts

$7.727

100+ parts

-

1k+ parts

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10k+ parts

$7.572

2,436

$7.727

-

-

$7.572

Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

$7.727

100+ parts

$7.341

1k+ parts

-

10k+ parts

$6.877

450

$7.727

$7.341

-

$6.877

Corphita

USA . 1,046 parts In-Stock

1+ parts

$8.127

100+ parts

-

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1,046

$8.127

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-

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$8.963

100+ parts

$8.246

1k+ parts

$7.727

10k+ parts

-

350

$8.963

$8.246

$7.727

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Aztec Data Supply Inc.

USA . 17 parts In-Stock

1+ parts

$11.960

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17

$11.960

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Component Stockers USA

USA . 10,283 parts In-Stock

1+ parts

$12.670

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10,283

$12.670

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Microchip USA

USA . 5,111 parts In-Stock

1+ parts

$16.560

100+ parts

$16.320

1k+ parts

$16.210

10k+ parts

$16.090

5,111

$16.560

$16.320

$16.210

$16.090

Perfect Parts

USA . 43,998 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 20,923 parts In-Stock

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Kepictronics

USA . 12,384 parts In-Stock

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GreenTree Electronics

Israel . 5,138 parts In-Stock

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Metaverse IC Inc.

Canada . 3,000 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Kulean Microsystems

USA . 2,879 parts In-Stock

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2,879

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RC Electronics

USA . 2,500 parts In-Stock

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$69.800

1k+ parts

$68.500

10k+ parts

$66.980

2,500

-

$69.800

$68.500

$66.980

Authorized Procurement Solutions

USA . 2,390 parts In-Stock

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2,390

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A-Z Elektronik GmbH

Germany . 2,250 parts In-Stock

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2,250

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SupplyDigital Components

Austria . 2,124 parts In-Stock

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Problanco Electronics

Mexico . 2,106 parts In-Stock

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Argo Parts USA

USA . 2,002 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,500 parts In-Stock

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TANS Electronics

Latvia . 828 parts In-Stock

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828

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Lixinc

USA . 395 parts In-Stock

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395

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UHIMA Technologies

Türkiye . 313 parts In-Stock

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313

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Overview

Elevate your communication network with the A5191HRTLG-XTP modem by Onsemi. Crafted with precision and expertise, this modem offers unparalleled reliability and performance. Ideal for industrial applications, this modem boasts a sleek design and advanced technology, ensuring seamless connectivity and efficiency. Experience the value and benefits of this top-of-the-line product, designed to enhance your communication systems and propel your business forward. Trust in Onsemi to deliver quality and innovation with every modem they create.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this modem lightweight and durable, perfect for portable use.

Surface Mount: YES

This modem can easily be mounted on a circuit board, saving space and simplifying installation.

Package Shape: SQUARE

The square shape of this modem allows for efficient placement on a PCB, maximizing board space.

Power Supplies (V): 3.3/5

With dual power supply options of 3.3V and 5V, this modem is versatile and compatible with various systems.

No. of Terminals: 32

With 32 terminals, this modem provides ample connection points for interfacing with other devices or components.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low profile design of this modem facilitates easy integration into compact electronic devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows this modem to function effectively in cold conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: QUAD

The quad terminal position offers stability and secure connections for enhanced reliability.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6mm allows for a slim and compact design, ideal for space-constrained applications.

Width: 7 mm

The narrow width of 7mm makes this modem suitable for use in tight spaces or densely populated PCBs.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds reduces the risk of heat damage during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper soldering and joint integrity during manufacturing processes.

Length: 7 mm

The compact length of 7mm enables this modem to fit seamlessly into space-constrained electronic designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in demanding industrial environments.

Technology: CMOS

The CMOS technology used in this modem allows for low power consumption and high-speed data processing.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and secure solder joints for robust connectivity.

Maximum Supply Current: 0.0006 mA

The low maximum supply current requirement of 0.0006mA minimizes power consumption, making this modem energy-efficient.

Telecom IC Type: MODEM

Specifically designed as a modem, this product offers reliable and efficient data communication capabilities.

Nominal Supply Voltage: 3.3V

The nominal supply voltage of 3.3V ensures compatibility with standard power sources for easy integration.

Terminal Pitch: 0.8 mm

The tight terminal pitch of 0.8mm allows for high-density mounting and space-saving configurations on a PCB.

Data Rate: 0.0012 Mbps

The high data rate of 0.0012Mbps enables fast and efficient transmission of data over communication networks.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates moderate moisture sensitivity, suitable for storage and operation in typical environmental conditions.

Technical Specifications

Modems A5191HRTLG-XTP attributes and parameters. Explore more Modems devices from Onsemi

Specs

Data Rate:

.0012 Mbps

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Modems

Maximum Supply Current:

.0006 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

A5191HRTLG-XTP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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