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TDA5051T

NXP Semiconductors

TDA5051T by NXP Semiconductors

NXP Semiconductors' TDA5051T modem operates at 5V with a data rate of 0.0012 Mbps. This CMOS technology device has 16 terminals, GULL WING form, and is ideal for telecom applications due to its small outline package and low supply current of 0.068 mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,180 parts In-Stock

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Anansix

USA . 1,988 parts In-Stock

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Vyrian

USA . 162 parts In-Stock

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162

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Nova Conductors

Japan . 90 parts In-Stock

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90

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AZTECH Wire

Italy . 212 parts In-Stock

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$5.576

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Aztec Data Supply Inc.

USA . 509 parts In-Stock

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$14.490

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509

$14.490

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Corohmni

South Africa . 106 parts In-Stock

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$15.462

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One Stop Electronics

USA . 894 parts In-Stock

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$228.000

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Ampacity Inc.

Singapore . 1,271 parts In-Stock

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$610.000

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Semicontronic

India . 1,597 parts In-Stock

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$764.000

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$744.900

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$741.080

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Argo Parts USA

USA . 4,985 parts In-Stock

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Continental Prestige Electronics

USA . 4,838 parts In-Stock

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Corphita

USA . 1,780 parts In-Stock

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UNI Independent Distributors

Spain . 1,413 parts In-Stock

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Bastille Electronics

Australia . 85 parts In-Stock

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Perfect Parts

USA . 17 parts In-Stock

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Overview

Enhance your communication devices with the TDA5051T modem by NXP Semiconductors. This innovative product boasts top-quality manufacturing, ensuring reliable performance and durability. Perfect for a wide range of applications, the TDA5051T offers customers unparalleled value and benefits. Stay connected with confidence using this cutting-edge modem, designed to exceed expectations and elevate your electronics to the next level. Trust NXP Semiconductors for all your modem needs and experience the advantage of superior technology in every device.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the modem lightweight and durable, ideal for portable devices or products that may experience some rough handling.

Power Supplies (V): 5

Having a power supply of 5V ensures compatibility with standard power sources, making it easy to integrate this modem into various systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this modem can operate reliably in a wide range of environments without overheating.

Data Rate: 0.0012 Mbps

The high data rate of 0.0012 Mbps allows for fast and efficient data transmission, making this modem suitable for applications that require quick data transfer.

Technical Specifications

Modems TDA5051T attributes and parameters. Explore more Modems devices from NXP Semiconductors

Specs

Data Rate:

.0012 Mbps

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Modems

Maximum Supply Current:

.068 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TDA5051T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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