Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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ST70136B by STMicroelectronics is a low-profile modem IC designed for commercial applications. It operates at 3.3V and 5V, features a compact 8mm x 8mm grid array with 64 terminals, and withstands temperatures from 0 °C to 70°C. Ideal for telecom support circuits, it ensures reliable performance in various devices.
Median Price
-
Lifecycle Status
Suppliers In-Stock
3
In-Stock Inventory
1k+
Vyrian
1+ parts
100+ parts
1k+ parts
10k+ parts
Digiode
Anansix
IDEA Electronic Components Group
$9.363
$8.427
MKK Technologies
$17.606
DigiPath Technology Company
Corphita
Parana Technologies
$11.195
Utilizing durable plastic and epoxy materials ensures longevity and reliable performance in various environments.
Surface mount technology allows for compact designs, enabling efficient use of PCB space and simpler assembly.
The square package shape aids in uniform placement on circuit boards, optimizing space and improving thermal performance.
Flexible voltage options facilitate integration into diverse systems and applications, catering to different operational needs.
With 64 terminals, this modem provides ample connectivity options for enhanced functionality and performance.
The grid array style enhances heat dissipation and provides a low-profile design ideal for space-constrained applications.
A maximum operating temperature of 70 °C ensures reliability in various environments, preventing overheating issues.
With a low minimum operating temperature, this product is suitable for use in colder climates without performance degradation.
The high-quality terminal finish improves solderability and enhances electrical performance, reducing the risk of corrosion.
Bottom terminal positioning allows for efficient routing on PCBs, contributing to a lower overall profile and space-saving designs.
A maximum seated height of just 1.7 mm ensures a low-profile setup, making it easier to fit into compact electronic designs.
The compact width of 8 mm supports space-efficient designs and enhances the flexibility of PCB layouts.
An 8 mm length contributes to a square design, allowing for consistent placement and easier thermal management.
Being rated for commercial temperature ranges ensures suitability for everyday consumer electronics applications.
BICMOS technology provides high speed and low power consumption, making it ideal for modern modem applications.
Ball terminal form enhances solder joint reliability and provides better electrical connections, crucial for performance.
As a modem-support circuit, this product is specifically designed for communication applications, ensuring optimized connectivity.
The 0.8 mm terminal pitch offers a balance between compactness and ease of assembly, suitable for modern low-profile designs.
Modems ST70136B attributes and parameters. Explore more Modems devices from STMicroelectronics
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ST70136B Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
BSS138
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Terminals: 3; Maximum Drain Current (ID): .2 A; Operating Mode: ENHANCEMENT MODE;
LM358ADR
Texas Instruments
LM358ADR by Texas Instruments is an operational amplifier with 2 functions, featuring a max input offset voltage of 5000 uV and nominal voltage of 5V. Widely used in applications requiring high voltage gain, it operates within a temperature range of 0-70°C and offers frequency compensation for stability.
LL4148
Rectron
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
SMBJ18CA
Pulse Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358AN
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BSS138BK,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Peak Reflow Temperature (C): 260; Additional Features: LOGIC LEVEL COMPATIBLE; Maximum Operating Temperature: 150 Cel;
1N4148W-T
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
PAP-06V-S
J S T Mfg
PAP-06V-S by J S T Mfg is a 6-contact BOARD CONNECTOR with 94V-0 UL Flammability Code. It has FEMALE contacts, CRIMP termination, and comes WITH CABLE ASSEMBLY for CABLE mounting applications.
2N7002
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JEDEC-95 Code: TO-236AB; Qualification: Not Qualified; Package Style (Meter): SMALL OUTLINE;
CRCW040210K0FKED
Vishay Intertechnology
Vishay Intertechnology's CRCW040210K0FKED is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.063 W power dissipation. Ideal for surface mount applications in electronics due to its compact SMT package style and high operating temperature range of -55 to 155 °C.
ERJ3EKF1002V
Panasonic
Panasonic's ERJ3EKF1002V is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. It operates b/w -55 to 155 °C and is ideal for surface mount applications in automotive electronics due to AEC-Q200 compliance.
ULN2803A
YOUTAI SEMICONDUCTOR CO LTD
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 18; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G18;
1552200253
Molex
WIRE AND CABLE;
LP2950CDT-3.3G
Onsemi
LP2950CDT-3.3G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 0.1A. It has a small outline package style, operates at temperatures ranging from -40 to 125 °C, and is suitable for applications requiring low dropout voltage and precise voltage regulation in electronic circuits.
BAV99
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CN
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Yangzhou Yangjie Electronics
L-CV90L-T48B-DB
Broadcom
Modems;
TCM3105NE
TCM3105NE by Texas Instruments is a 16-terminal modem IC with 5V supply voltage. It operates in industrial temperature range (-40 to 85°C) and draws max 16mA current. Suitable for telecom applications, it features CMOS technology and through-hole terminal form.
L-CV22-T48B-DT
73K212L-IP
73K212L-IP by Texas Instruments is an industrial-grade modem IC with a data rate of 0.0012 Mbps. It operates b/w -40 to 85 °C, has 28 terminals in an in-line package style, and uses through-hole terminal form. Ideal for telecom applications requiring reliable communication at low speeds.
CSP1037
MODEM-SUPPORT CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; JESD-609 Code: e0;
73K224L-28IH/F
Maxim Integrated
MODEM; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE; Terminal Position: QUAD;
MAX2982GCD/V+W
MODEM;
ADSP-21MOD970-000
Analog Devices
ADSP-21MOD970-000 by Analog Devices is a 304-terminal modem IC with 3.3V supply voltage, operating at 0.056 Mbps data rate. It features CMOS technology, TIN LEAD finish, and is suitable for telecom applications requiring a commercial temperature grade.
73M2901CE-IGV/F
TDK
MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE;
DAC8740HRGER
DAC8740HRGER by Texas Instruments is a 24-terminal modem chip carrier with a temperature range of -55 to 125°C. It features a data rate of 0.03125 Mbps and is ideal for military telecom applications due to its no-lead terminal form and programmable modem type. The package style includes heat sink/slug in a square shape, making it suitable for surface mount assembly with a low seated height of 1 mm.
TDA5051
Philips Semiconductors
MODEM; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
AD9867BCPZRL
Analog Devices' AD9867BCPZRL is a CMOS modem IC with 64 terminals in a chip carrier package. It operates b/w -40°C to 85°C, suitable for industrial use. With a nominal voltage of 3.3V, it's ideal for telecom applications requiring high-performance modems.
TMX99532NL
TMX99532NL by Texas Instruments is a modem IC with 18 terminals in an in-line package. Operating temperature range of 0-70°C, suitable for commercial applications. Utilizes MOS technology and through-hole terminal form, ideal for telecom modem designs.
TS68951CFN013TR
STMicroelectronics
TS68951CFN013TR by STMicroelectronics is a CMOS modem with a compact chip carrier design, featuring 28 terminals. It operates b/w 0 °C to 70°C and requires ±5V power supply. Ideal for telecom applications, it supports efficient data communication in commercial environments.
DS6122
MODEM; Terminal Form: THROUGH-HOLE; No. of Terminals: 42; Package Code: DIP; Package Shape: RECTANGULAR; JESD-609 Code: e0;
73M1822-IMR
MAX2990ECB+
MODEM; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30;
TDA8262HN
MODEM-DEMODULATOR; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
IBB110PTR
Littelfuse
MODEM-SUPPORT CIRCUIT;
CYG2021
Ixys Integrated Circuits Division
MODEM-SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: PIN/PEG; No. of Terminals: 10; Package Code: DIP; Package Shape: RECTANGULAR;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
ST70135A
MODEM; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE;
ST70136G
MODEM-SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;
ST70137TQFP
MODEM-SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
Supply Digital Components
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