Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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FK24413DPAK by Fischer Elektronik & Kg is a 10x13x23 mm copper heat sink weighing 3.3g, designed for ICs. It efficiently dissipates heat in electronic devices, ensuring optimal performance and reliability in various applications.
Median Price
$2.048
Lifecycle Status
Suppliers In-Stock
18
In-Stock Inventory
1k+
Arrow
1+ parts
$0.826
100+ parts
$0.738
1k+ parts
$0.733
10k+ parts
-
Element14
$1.049
$0.967
Farnell
$3.047
$1.723
Newark
$4.080
Chip1Stop
$4.510
$1.080
$0.701
$0.695
Adafruit Industries
$6.850
$6.507
Verical
$0.973
$0.953
DigiKey
$0.990
TME
$1.170
$0.870
$0.800
Nova Conductors
$1.190
Rebound Electronics
Vyrian
Schukat
$0.755
$0.595
IBS Electronics
$1.282
$0.904
$0.780
Martec Srl
ComSIT Distribution GmbH
Component Sense
Prism Electronics
Continental Prestige Electronics
$1.166
Argo Parts USA
Perfect Parts
Authorized Procurement Solutions
Aztec Data Supply Inc.
Bastille Electronics
GreenTree Electronics
$1.137
The heat sink is specifically designed to efficiently dissipate heat and improve the thermal performance of the device it is used on.
The compact height of 10mm allows for easy integration into tight spaces without compromising on heat dissipation capabilities.
The moderate width of 13mm provides a balance between heat dissipation efficiency and space utilization.
Being packed in bulk allows for cost-effective packaging and transportation, making it a convenient choice for bulk orders and manufacturing processes.
The lightweight design of 3.3g makes it easy to handle and install without adding unnecessary weight to the overall device.
Copper is known for its excellent thermal conductivity, making it an ideal material choice for heat sinks to effectively transfer heat away from the device.
The length of 23mm provides ample surface area for heat dissipation, ensuring efficient cooling of the device.
Intended for use on integrated circuits (ICs), this heat sink is designed to efficiently dissipate heat generated by the ICs, improving their overall performance and longevity.
Heat Sinks FK24413DPAK attributes and parameters. Explore more Heat Sinks devices from Fischer Elektronik & Kg
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Compatible Device:
FK24413DPAK Thermal Devices trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
7415.29.00.00
SB
FDC5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.6 W; Transistor Application: SWITCHING; Maximum Drain Current (ID): 3 A;
1N4148
Digitron Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
L7805CV
STMicroelectronics
L7805CV by STMicroelectronics is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1.5A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring stable voltage regulation in electronic circuits.
2N7002
Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain Current (ID): .115 A; Operating Mode: ENHANCEMENT MODE;
NUP2105LT1G
Onsemi
NUP2105LT1G by Onsemi is a Transient Suppression Device with 350W power dissipation, 29.1V breakdown voltage, and 44V clamping voltage. Commonly used in electronic circuits for surge protection due to its bidirectional polarity and silicon diode element material.
LL4148
Semtech Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM317LMX/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 8; Package Code: SOP; Terminal Form: GULL WING; Maximum Seated Height: 1.75 mm; Nominal Dropout Voltage-1: 3 V;
M24308/2-1F
TE Connectivity
TE Connectivity's M24308/2-1F D-Sub Connector features 9 contacts, 2 rows, and a shell size of 1/E. With a rated current of 7.5A, it operates b/w -55°C to 125°C. Ideal for cable mounting applications, this connector has a steel shell with cadmium finish and uses crimp termination for female contact pins.
LM7805CT
Silicon Group
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Package Body Material: PLASTIC/EPOXY; Maximum Load Regulation: .05 %;
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Operating Temperature (TJ-Min): 0 Cel; Technology: BIPOLAR;
ULN2803A
YOUTAI SEMICONDUCTOR CO LTD
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 18; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G18;
SS14
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Grande Electronics
BSS138
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Terminals: 3; Maximum Drain Current (ID): .2 A; Operating Mode: ENHANCEMENT MODE;
M85049/85-08W02
Amphenol
CIRCULAR CONN ACCESSORY; Shell Sizes: 8; 9; IEC Conformity: NO; MIL-Connector Accessory Name: BAND LOCK ADAPTER; MIL Conformity: YES; DIN Conformity: NO;
FDN306P
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Maximum Drain Current (Abs) (ID): 2.6 A; Operating Mode: ENHANCEMENT MODE;
M39029/58-360
Molex
CONNECTOR ACCESSORY; Alternate Contact Sources: MILITARY; Removal Tool Sources: MILITARY; Material: COPPER ALLOY; National Stock Number (NSN): 5999004733551; Mating Contacts: M39029/56-348, M39029/57-354;
DS18B20
Maxim Integrated
DS18B20 by Maxim Integrated is a 12-bit digital temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Commonly used in applications requiring precise temperature monitoring like HVAC systems and industrial automation.
Samsung
N-CHANNEL AND P-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 5 ohm; No. of Terminals: 3;
Dc Components
507002B00000G
Aavid Thermalloy
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: LONGITUDINAL; Length: 44.45 mm;
581002B02500G
HEAT SINK; Body Material: ALUMINUM; Device Used On: IC; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL; Color: BLACK;
EV-T220-38E
Ohmite Manufacturing
Ohmite Manufacturing's EV-T220-38E heat sink has thermal resistance of 11.4 ohm, height 38.1mm, and width 12.7mm. Ideal for transistors, this aluminum alloy device weighs 18g and is used to dissipate heat efficiently in electronic applications.
FA-T220-51E
The Ohmite FA-T220-51E is a black anodized aluminum heat sink measuring 41.6mm x 25mm x 50.8mm and weighing 37g. With omnidirectional fin orientation, it efficiently dissipates heat in various applications like electronics cooling systems. Ideal for compact spaces requiring effective thermal management.
374424B00035G
HEAT SINK; Profile: PIN FIN ARRAY; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: OMNIDIRECT; Width: 27 mm;
V7477Z2
Assmann Wsw Components
Heat Sinks;
V5618C
HEAT SINK;
374324B00035G
HEAT SINK; Profile: PIN FIN ARRAY; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: OMNIDIRECT; Height: 10 mm;
V7236A1
242-125ABE-22
WAKEFIELD-VETTE INC
242-125ABE-22 by Wakefield-vette is a black anodized aluminum heat sink with staggered fins, measuring 32.6mm in height, 6.4mm in width, and 22.2mm in length. Ideal for cooling electronic components in compact spaces like PCBs due to its efficient fin construction.
HF20G
Boyd
Boyd's HF20G heat sink boasts a low thermal resistance of 13.1 ohm, ideal for dissipating heat efficiently. With a height of 27.94mm and extruded aluminum construction, it is suitable for compact electronic devices requiring effective cooling. The anodized finish and black color add to its aesthetic appeal in various applications.
508700B00000G
Boyd's 508700B00000G Heat Sink has a Thermal Resistance of 27.2 ohm, Height of 4.83mm, and Length of 50.8mm. Ideal for cooling electronic components in compact spaces with its extruded aluminum construction and anodized finish.
WF151200
Celduc Relais
ICKS10X10X6.5
Fischer Elektronik & Kg
C247-050-2AE
30182
Vicor
Vicor 30182 Heat Sink, made of aluminum alloy, measures 23.1mm (H) x 56.4mm (W) x 57.9mm (L). Ideal for thermal management in electronic devices due to its extruded construction. Ensures efficient heat dissipation in compact spaces like PCBs or power supplies.
321527B00000G
Boyd 321527B00000G Heat Sink has Thermal Resistance of 35.2Ω, Height of 12.7mm, and Radial Fin Orientation. Ideal for cooling electronic components in compact spaces with high thermal demands.
HAF-15T
TDK
The TDK HAF-15T Heat Sink features a thermal resistance of 1.5Ω, with dimensions of 38.1mm x 61mm x 116.8mm and weight of 250g. Designed for converters, it utilizes fin pin construction with omnidirectional fin orientation for efficient heat dissipation in electronic devices.
ICKBGA40X40X10
ICKBGA40X40X10 by Fischer Elektronik & Kg is a 10mm high, 40mm wide, and 40mm long black anodized heat sink with fin construction. Specifically designed for ICs, it efficiently dissipates heat to prevent overheating in electronic devices.
The Boyd 374324B00035G heat sink features a pin fin array design with a height of 10mm and width of 27mm. Constructed from black anodized aluminum, it is ideal for applications requiring efficient heat dissipation in compact spaces. The omnidirectional fin orientation enhances thermal performance, making it suitable for various electronic devices.
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FK24413D2PAK
FK24413D2PAK by Fischer Elektronik & Kg is a copper heat sink measuring 26x13x10mm and weighing 3.6g. Primarily used on ICs, it efficiently dissipates heat in electronic devices, ensuring optimal performance and reliability.
FK24413D2PAKTR
FK24413D2PAKTR by Fischer Elektronik & Kg is a copper heat sink measuring 26x13x10 mm and weighing 3.6g. Designed for ICs, it comes in tape and reel packaging, making it ideal for thermal management in electronic devices.
FK24413D3PAK
FK24413D3PAK by Fischer Elektronik & Kg is a 10mm tall, 31mm wide, and 13mm long heat sink made of copper. Weighing 3.9g with a TIN LEAD finish, it is designed for use on ICs to dissipate heat efficiently in electronic devices.
FK24408D2PAK
FK24408D2PAK by Fischer Elektronik & Kg is a copper heat sink measuring 26x8x10mm and weighing 2.2g. Primarily used on ICs, it efficiently dissipates heat to prevent overheating in electronic devices. Ideal for bulk packaging applications due to its compact size and lightweight design.
FK24413DPAKTR
FK24413DPAKTR by Fischer Elektronik & Kg is a 10x13x23mm copper heat sink weighing 3.3g, suitable for ICs. It comes in tape and reel packaging, ideal for thermal management applications due to its compact size and efficient heat dissipation capabilities.
FK24408D3PAK
FK24408D3PAK by Fischer Elektronik & Kg is a copper heat sink measuring 31x8x10mm and weighing 2.5g. Primarily used on ICs, it comes in bulk packaging and offers efficient thermal dissipation for electronic components.
FK24413D3PAKTR
HEAT SINK; Body Material: COPPER; Device Used On: IC; Height: 10 mm; Width: 13 mm; Length: 31 mm;
FK24408D2PAKTR
HEAT SINK; Body Material: COPPER; Device Used On: IC; Width: 8 mm; Weight: 2.2 g; Height: 10 mm;
FK24408DPAK
HEAT SINK; Body Material: COPPER; Device Used On: IC; Length: 23 mm; Packing Method: BULK; Height: 10 mm;
FK24408DPAKTR
HEAT SINK; Body Material: COPPER; Device Used On: IC; Weight: 2 g; Width: 8 mm; Packing Method: TAPE AND REEL;
FK245MI247V
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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