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321527B00000G

Boyd

321527B00000G by Boyd

Boyd 321527B00000G Heat Sink has Thermal Resistance of 35.2Ω, Height of 12.7mm, and Radial Fin Orientation. Ideal for cooling electronic components in compact spaces with high thermal demands.

Median Price

$21.275

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

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Interstate Connecting

USA . 15 parts In-Stock

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$13.602

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$11.189

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Arrow

USA . 3 parts In-Stock

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$14.910

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$13.030

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DigiKey

USA . 209 parts In-Stock

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$21.830

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$17.090

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$16.275

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209

$21.830

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RS Americas

USA . 197 parts In-Stock

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$22.520

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$17.520

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Heilind Electronics

USA . 75 parts In-Stock

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$33.496

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$25.808

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Avnet

USA . 1,000 parts In-Stock

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$21.275

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$9.750

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Master Electronics

USA . 724 parts In-Stock

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$16.670

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$15.720

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Verical

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IBS Electronics

USA . 724 parts In-Stock

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$23.380

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$22.047

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Electro Sonic

Canada . 657 parts In-Stock

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$9.110

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$8.130

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Nova Conductors

Japan . 300 parts In-Stock

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Vyrian

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North Shore Components

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 1,500 parts In-Stock

1+ parts

$15.700

100+ parts

$8.490

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$16.980

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$15.700

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Allen Electronics Distributors

USA . 197 parts In-Stock

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$21.880

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Argo Parts USA

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Aranea Global

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,255 parts In-Stock

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Aztec Data Supply Inc.

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Perfect Parts

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Authorized Procurement Solutions

USA . 100 parts In-Stock

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Overview

Discover the ultimate solution for heat dissipation with Boyd's 321527B00000G Heat Sink. Crafted with precision and expertise, this heat sink boasts superior quality and reliable performance. Ideal for a wide range of applications, this product ensures optimal thermal management to keep your devices cool and functioning at their best. Say goodbye to overheating worries and hello to enhanced efficiency with Boyd's innovative heat sink technology. Trust Boyd to deliver top-notch products that exceed expectations.

Feature Benefit Bullets

Thermal Resistance: 35.2 ohm

Low thermal resistance ensures efficient heat dissipation, keeping the electronic components cool and functioning optimally.

Thermal Device Type: HEAT SINK

As a heat sink, this product is specifically designed to dissipate heat and maintain thermal equilibrium in electronic devices.

Height: 12.7 mm

The compact height of 12.7 mm allows for easy integration into various electronic devices without taking up too much space.

Finish: ANODIZED

Anodized finish provides protection against corrosion and enhances durability, ensuring a longer lifespan for the heat sink.

Color: BLACK

Black color offers a sleek and professional look, suitable for various applications and enhancing the aesthetic appeal of the product.

Fin Orientation: RADIAL

Radial fin orientation improves heat dissipation efficiency by maximizing the surface area for better thermal performance.

Technical Specifications

Heat Sinks 321527B00000G attributes and parameters. Explore more Heat Sinks devices from Boyd

Device Specifications

Fin Orientation:

Physical Specifications

Height:

0.5 in (12.7 mm)

Material and Finish

Finish:

Anodized

Color:

Black

Thermal Specifications

Thermal Resistance:

35.2 Ω

Usage and Compatibility

Device Type:

Manufacturer Highlights

Boyd

Boyd is the world's leading innovator in sustainable engineered material and thermal solutions that make our customers’ products better, safer, faster, and more reliable. We develop and combine technologies to solve ambitious performance targets in our customers’ most critical applications. By implementing technologies and material science in novel ways to seal, protect, cool, and interface, Boyd has continually redefined the possible and championed customer success for over 90 years. Innovation demands for smaller, lighter, and faster technologies with intuitive new features compete with the need for more sustainable solutions. More smart functionality operating faster in tighter spaces with more sophisticated interfaces mean increased power density and more heat, electrical, and mechanical challenges. Adding further complexity, devices are used in unpredictable environments with harsh conditions and must be contaminant and waterproof, insulated against temperature extremes, and ruggedized. Not only are we determined to find solutions to these challenges, Boyd strives to simplify where possible and create the most wholistic, effective, and sustainable solutions.

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