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374724B60024G

Boyd

374724B60024G by Boyd

374724B60024G by Boyd is a PIN FIN ARRAY HEAT SINK with dimensions of 35mm x 35mm x 18mm. Constructed from black anodized aluminum, it features omnidirectional fin orientation. Ideal for applications requiring efficient heat dissipation in compact spaces.

Median Price

$2.980

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,644 parts In-Stock

1+ parts

$1.813

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$0.830

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2,644

$1.813

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$0.830

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Heilind Electronics

USA . 1,481 parts In-Stock

1+ parts

$2.569

100+ parts

$2.141

1k+ parts

$2.007

10k+ parts

$2.007

1,481

$2.569

$2.141

$2.007

$2.007

Interstate Connecting

USA . 1,481 parts In-Stock

1+ parts

$2.569

100+ parts

$2.141

1k+ parts

$2.007

10k+ parts

$2.007

1,481

$2.569

$2.141

$2.007

$2.007

Farnell

UK . 451 parts In-Stock

1+ parts

$5.630

100+ parts

$4.560

1k+ parts

$4.250

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451

$5.630

$4.560

$4.250

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Mouser Electronics

USA . 41 parts In-Stock

1+ parts

$6.610

100+ parts

$4.750

1k+ parts

$4.280

10k+ parts

$2.520

41

$6.610

$4.750

$4.280

$2.520

DigiKey

USA . 681 parts In-Stock

1+ parts

$7.300

100+ parts

$5.931

1k+ parts

$5.245

10k+ parts

$5.054

681

$7.300

$5.931

$5.245

$5.054

Element14

Singapore . 451 parts In-Stock

1+ parts

$9.500

100+ parts

$7.700

1k+ parts

$7.190

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451

$9.500

$7.700

$7.190

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Verical

USA . 2,644 parts In-Stock

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$1.813

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2,644

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$1.813

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Master Electronics

USA . 1,412 parts In-Stock

1+ parts

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100+ parts

$3.390

1k+ parts

$2.970

10k+ parts

$2.570

1,412

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$3.390

$2.970

$2.570

Future Electronics

Canada . 144 parts In-Stock

1+ parts

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100+ parts

$2.380

1k+ parts

$2.210

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144

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$2.380

$2.210

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Electro Sonic

Canada . 1,850 parts In-Stock

1+ parts

-

100+ parts

$3.250

1k+ parts

$2.880

10k+ parts

$2.560

1,850

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$3.250

$2.880

$2.560

Vyrian

USA . 1,602 parts In-Stock

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1,602

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IBS Electronics

USA . 1,412 parts In-Stock

1+ parts

-

100+ parts

$8.219

1k+ parts

$7.181

10k+ parts

$6.886

1,412

-

$8.219

$7.181

$6.886

NAC Semi

USA . 1,176 parts In-Stock

1+ parts

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$4.170

10k+ parts

$3.850

1,176

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$4.170

$3.850

Bristol Electronics

USA . 207 parts In-Stock

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207

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A&K Electronics

USA . 120 parts In-Stock

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120

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Rotakorn

Sweden . 120 parts In-Stock

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120

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Flex Direct, LLC

USA . 70 parts In-Stock

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70

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Nova Conductors

Japan . 57 parts In-Stock

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57

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ACDS - Activité Composants Distribution Service

France . 20 parts In-Stock

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Inventory MP

USA . 17 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Continental Prestige Electronics

USA . 5,344 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,722 parts In-Stock

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Argo Parts USA

USA . 3,579 parts In-Stock

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Glotronic Ltd.

UK . 1,970 parts In-Stock

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Perfect Parts

USA . 1,693 parts In-Stock

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1,693

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GreenTree Electronics

Israel . 1,344 parts In-Stock

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Eastek

USA . 672 parts In-Stock

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672

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Advanced Electronics

New Zealand . 350 parts In-Stock

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350

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Abacus Technologies

USA . 336 parts In-Stock

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336

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Boyd's 374724B60024G Heat Sink is a game-changer in thermal management technology, offering superior quality and performance. Crafted with precision using high-grade aluminum, this heat sink provides optimal cooling for various applications. Whether you're looking to boost the efficiency of your electronics or prolong their lifespan, this sleek black pin fin array design guarantees excellent heat dissipation. Say goodbye to overheating issues and hello to improved performance with Boyd's top-of-the-line heat sink solution.

Feature Benefit Bullets

Thermal Device Type: HEAT SINK

This product is specifically designed as a heat sink, ensuring efficient heat dissipation and temperature management in electronic devices.

Profile: PIN FIN ARRAY

The pin fin array profile provides increased surface area for better heat transfer, making this heat sink highly effective in cooling applications.

Height: 18 mm

The 18mm height allows for a compact design while still providing effective heat dissipation, making it suitable for space-constrained environments.

Finish: ANODIZED

The anodized finish provides corrosion resistance and enhanced durability, ensuring a longer lifespan for the heat sink.

Width: 35 mm

The 35mm width offers a balanced ratio of surface area to volume, optimizing heat dissipation performance in the heat sink.

Construction: FIN

The fin construction allows for efficient airflow through the heat sink, facilitating rapid heat transfer and cooling of electronic components.

Color: BLACK

The black color not only gives a sleek appearance but also aids in heat absorption, improving the overall cooling efficiency of the heat sink.

Fin Orientation: OMNIDIRECT

The omnidirectional fin orientation ensures uniform heat distribution and dissipation, making this heat sink suitable for a variety of mounting positions.

Body Material: ALUMINUM

Aluminum is lightweight, cost-effective, and has high thermal conductivity, making it an ideal material choice for efficient heat sinks.

Length: 35 mm

The 35mm length provides a sufficient surface area for heat dissipation while maintaining a compact footprint, ideal for various electronic applications.

Technical Specifications

Heat Sinks 374724B60024G attributes and parameters. Explore more Heat Sinks devices from Boyd

Device Specifications

Construction:

Fin

Profile:

Fin Orientation:

Physical Specifications

Height:

0.709 in (18 mm)

Width:

1.378 in (35 mm)

Length:

1.378 in (35 mm)

Material and Finish

Finish:

Anodized

Body Material Composition:

Color:

Black

Usage and Compatibility

Device Type:

Manufacturer Highlights

Boyd

Boyd is the world's leading innovator in sustainable engineered material and thermal solutions that make our customers’ products better, safer, faster, and more reliable. We develop and combine technologies to solve ambitious performance targets in our customers’ most critical applications. By implementing technologies and material science in novel ways to seal, protect, cool, and interface, Boyd has continually redefined the possible and championed customer success for over 90 years. Innovation demands for smaller, lighter, and faster technologies with intuitive new features compete with the need for more sustainable solutions. More smart functionality operating faster in tighter spaces with more sophisticated interfaces mean increased power density and more heat, electrical, and mechanical challenges. Adding further complexity, devices are used in unpredictable environments with harsh conditions and must be contaminant and waterproof, insulated against temperature extremes, and ruggedized. Not only are we determined to find solutions to these challenges, Boyd strives to simplify where possible and create the most wholistic, effective, and sustainable solutions.

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