Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Boyd 507302B00000G Heat Sink has Thermal Resistance of 24 ohm, Height 9.65mm, and Width 19.05mm. Ideal for TRANSISTOR cooling applications due to FIN construction and ALUMINUM body material with ANODIZED finish.
Median Price
$0.690
Lifecycle Status
Suppliers In-Stock
36
In-Stock Inventory
1k+
Interstate Connecting
1+ parts
$0.286
100+ parts
-
1k+ parts
$0.247
10k+ parts
$0.221
Heilind Electronics
$0.311
$0.256
$0.477
DigiKey
$0.340
$0.264
$0.234
$0.215
Mouser Electronics
$0.263
$0.233
$0.213
RS Americas
$0.350
Element14
$0.626
Sager
$0.808
$0.746
$0.655
Distrelec
$0.943
$0.740
$0.697
Newark
$0.973
Farnell
$2.562
$1.473
Adafruit Industries
$5.150
$4.893
$4.892
Arrow
$0.754
Verical
Avnet
$0.431
Future Electronics
$0.325
$0.310
$0.300
RS (Exports)
$0.920
Component Electronics Inc.
$0.380
$0.290
$0.250
Nova Conductors
$0.629
Vyrian
IBS Electronics
$0.456
$0.276
$0.799
Electro Sonic
$0.195
$0.188
NAC Semi
$1.040
Diverse Electronics
Semtec, LLC
ACDS - Activité Composants Distribution Service
Jameco Electronics
Elcom Components
ComSIT Distribution GmbH
Connector Distribution Corp
Right Parts Inc.
Bristol Electronics
Prism Electronics
Technoshack Inc.
Bisco
Mil-Aero Solutions, Inc.
PC Components Company LLC
Component Stockers USA
$0.180
$0.160
Argo Parts USA
$0.437
$0.424
Netroflash
$0.598
$0.585
Allen Electronics Distributors
$0.770
Continental Prestige Electronics
$2.020
$1.160
Advanced Electronics
Perfect Parts
Glotronic Ltd.
Cyclops Electronics Ltd (Excess)
Robosynatics
Lucentia Tech
ChipTracer
Authorized Procurement Solutions
Aztec Data Supply Inc.
Low thermal resistance ensures efficient heat dissipation, keeping the temperature of the device in check.
Specifically designed as a heat sink, ensuring optimal heat transfer and dissipation.
Screw profile allows for easy installation and secure attachment to the device.
Compact height makes it suitable for small spaces and can be used in various electronic devices.
Anodized finish provides corrosion resistance and durability, ensuring a longer lifespan.
Optimal width for efficient heat dissipation while still being compact in size.
Fin construction enhances surface area for better heat dissipation, making it more effective.
Black color gives a sleek and professional look, suitable for various electronic devices.
Transverse fin orientation provides better airflow and heat dissipation, improving overall performance.
Aluminum construction offers lightweight yet durable material for effective heat transfer.
Optimal length for efficient heat dissipation while still remaining compact in size.
Designed to be used specifically on transistors, ensuring compatibility and efficient heat dissipation.
Heat Sinks 507302B00000G attributes and parameters. Explore more Heat Sinks devices from Boyd
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Boyd is the world's leading innovator in sustainable engineered material and thermal solutions that make our customers’ products better, safer, faster, and more reliable. We develop and combine technologies to solve ambitious performance targets in our customers’ most critical applications. By implementing technologies and material science in novel ways to seal, protect, cool, and interface, Boyd has continually redefined the possible and championed customer success for over 90 years. Innovation demands for smaller, lighter, and faster technologies with intuitive new features compete with the need for more sustainable solutions. More smart functionality operating faster in tighter spaces with more sophisticated interfaces mean increased power density and more heat, electrical, and mechanical challenges. Adding further complexity, devices are used in unpredictable environments with harsh conditions and must be contaminant and waterproof, insulated against temperature extremes, and ruggedized. Not only are we determined to find solutions to these challenges, Boyd strives to simplify where possible and create the most wholistic, effective, and sustainable solutions.
LL4148-GS08
Vishay Intertechnology
The Vishay Intertechnology LL4148-GS08 is a glass diode with fast recovery time of 0.008 us and max reverse current of 5 uA. Ideal for applications requiring rectification, it has a breakdown voltage of 100 V and can handle a peak forward current of 2 A.
LM317BD2TG
Onsemi
LM317BD2TG by Onsemi is an adjustable positive single output standard regulator with a max output current of 1.5A and a max load regulation of 5.8%. Operating temperature ranges from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact designs.
1N4148
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Tt Electronics Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
LL4148
Kec
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
PIC18F4550T-I/PT
Microchip Technology
The Microchip Technology PIC18F4550T-I/PT microcontroller operates at a max clock frequency of 48 MHz with 8-bit architecture. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it suitable for industrial applications requiring high-speed data processing and analog-to-digital conversion. With low power mode and flash ROM programmability, this device offers efficient performance in compact designs.
M24308/2-1F
Cinch Connectivity Solutions
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Body Depth: .375 inch;
SMBJ18CA
Changzhou Galaxy Century Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBR1560CT
General Instrument
MBR1560CT by General Instrument is a common cathode rectifier diode with a max forward voltage of 0.75V and max output current of 15A. It is used for efficiency applications, has a package shape of rectangular, and can operate in temperatures ranging from -65 to 150 °C.
1N4148W-T
Micro Commercial Components
1N4148W-T by Micro Commercial Components is a single rectifier diode with a max reverse recovery time of 0.004 us. It operates b/w -55 to 150 °C and has a max output current of 0.15 A. Ideal for applications requiring fast switching speeds in small outline packages.
2N7002
Central Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .115 A; Maximum Drain Current (Abs) (ID): .115 A;
LM555CN
Rca Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
1N4148WS
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Gec Plessey Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1554216002
Molex
WIRE AND CABLE;
Continental Device India
MBR0520LT3G
MBR0520LT3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, ideal for applications requiring high-speed switching and low power loss in compact electronic devices. The package style is small outline, making it suitable for surface mount designs in various electronics.
Calogic
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): NOT SPECIFIED; Terminal Position: DUAL;
Formosa Microsemi
LM555CM
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
7106PD/TR
Boyd
Boyd's 7106PD/TR Heat Sink has Thermal Resistance of 15Ω, Height 9.52mm, and Width 14.99mm. Ideal for electronic devices requiring efficient heat dissipation in compact spaces like laptops or LED lighting systems.
578622B03200G
Boyd 578622B03200G Heat Sink has Thermal Resistance of 13.2 ohm, U Profile, and Aluminum Body Material. Ideal for TRANSISTOR devices due to its efficient heat dissipation capabilities in a compact size (37.59mm x 12.7mm x 25.4mm).
ICKS14X14X10
Fischer Elektronik & Kg
ICKS14X14X10 by Fischer Elektronik & Kg is a 10mm adhesive heat sink with thermal resistance of 4.2 ohm. Featuring pin fin orientation, it is made of aluminum and measures 14mm in width and length. Ideal for applications requiring efficient heat dissipation in compact spaces.
906-31-2-23-2-B-0
Wakefield Thermal Solutions
Wakefield Thermal Solutions' 906-31-2-23-2-B-0 heat sink features a thermal resistance of 12.02 ohm, aluminum alloy construction with black anodized finish, and pin fin orientation. This clip-profiled device, measuring 31mm in width and length, is designed for IC applications.
577002B00000G
Aavid Thermalloy
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: LONGITUDINAL; Height: 19.05 mm;
507002B00000G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: LONGITUDINAL; Length: 44.45 mm;
FA-T220-64E
Ohmite Manufacturing
The Ohmite FA-T220-64E is a black anodized aluminum heat sink measuring 41.6mm x 25mm x 63.5mm and weighing 46g. With omnidirectional fin orientation, it efficiently dissipates heat in various applications like power electronics and LED lighting systems. Ideal for thermal management due to its compact size and lightweight design.
7106DG/TR
Boyd's 7106DG/TR heat sink has a thermal resistance of 15 ohm, made of copper with solder profile. It is 9.52mm high, 14.99mm wide, and 25.91mm long, finished with tin plating. Designed for ICs to efficiently dissipate heat in electronic devices.
568303B00000G
HEAT SINK; Height: 31.75 mm; Finish: ANODIZED; Length: 45.97 mm; Thermal Resistance: 5.4 ohm; Width: 45.97 mm;
401K
The Ohmite Manufacturing 401K is an extruded heat sink with dimensions of 31.8mm x 120.7mm x 38.1mm and a weight of 68.04g. It is designed for thermal management applications in various industries, providing efficient heat dissipation capabilities.
PF750G
HEAT SINK; Profile: U; Body Material: COPPER; Thermal Resistance: 20.3 ohm; Width: 11 mm; Finish: TIN;
528-45AB
The Ohmite Manufacturing 528-45AB Heat Sink is an extruded aluminum device with dimensions of 61x57.9x11.4mm (LxWxH). It features an anodized black finish and is designed for thermal management in electronic applications. Ideal for dissipating heat efficiently while maintaining a compact form factor.
DA-T263-201E-TR
HEAT SINK;
FK24413DPAKTR
FK24413DPAKTR by Fischer Elektronik & Kg is a 10x13x23mm copper heat sink weighing 3.3g, suitable for ICs. It comes in tape and reel packaging, ideal for thermal management applications due to its compact size and efficient heat dissipation capabilities.
PF527G
Boyd PF527G Heat Sink has 7.4 ohm Thermal Resistance, 25mm Height, and Anodized Black Finish. Ideal for cooling electronic components in various applications due to its aluminum body material and efficient heat dissipation capabilities.
ICKBGA40X40X10
ICKBGA40X40X10 by Fischer Elektronik & Kg is a 10mm high, 40mm wide, and 40mm long black anodized heat sink with fin construction. Specifically designed for ICs, it efficiently dissipates heat to prevent overheating in electronic devices.
508700B00000G
Boyd's 508700B00000G Heat Sink has a Thermal Resistance of 27.2 ohm, Height of 4.83mm, and Length of 50.8mm. Ideal for cooling electronic components in compact spaces with its extruded aluminum construction and anodized finish.
3-1542003-4
TE Connectivity
TE Connectivity 3-1542003-4 Heat Sink, UL approved with 15W power rating. Aluminum body, radial fin orientation for IC devices. Clip profile for efficient heat dissipation in various applications.
573100D00000G
Boyd 573100D00000G Heat Sink has Thermal Resistance of 15Ω, Height 10.16mm, and Width 8mm. Ideal for cooling electronic components in compact spaces like PCBs.
FK24413D2PAKTR
FK24413D2PAKTR by Fischer Elektronik & Kg is a copper heat sink measuring 26x13x10 mm and weighing 3.6g. Designed for ICs, it comes in tape and reel packaging, making it ideal for thermal management in electronic devices.
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507302B00000G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Construction: FIN; Fin Orientation: TRANSVERSE;
507302B00000
HEAT SINK; Profile: U; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Fin Orientation: TRANSVERSE; Finish: ANODIZED;
507302B00009G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: TRANSVERSE; Thermal Resistance: 24 ohm;
507302B10000G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: TRANSVERSE; Finish: ANODIZED;
507302U00000G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: TRANSVERSE; Width: 9.65 mm;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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