Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
573100D00010G by Boyd is a U-profile heat sink with dimensions of 22.86mm x 8mm x 10.16mm (LxWxH). It has a thermal resistance of 15 ohm and is made of copper, making it suitable for applications requiring efficient heat dissipation.
Median Price
$0.944
Lifecycle Status
Suppliers In-Stock
26
In-Stock Inventory
1k+
DigiKey
1+ parts
$0.610
100+ parts
$0.482
1k+ parts
-
10k+ parts
Mouser Electronics
$1.200
Future Electronics
$0.945
Arrow
$0.761
Sager
Master Electronics
$0.943
$0.908
Verical
$1.405
$1.143
$1.075
DF Sales Co.
$0.650
Nova Conductors
$1.020
NAC Semi
$1.960
IBS Electronics
$0.582
$0.561
Vyrian
Electro Sonic
$1.051
$0.963
Bristol Electronics
Connector Distribution Corp
Right Parts Inc.
Atlantic Semiconductor
ComSIT Distribution GmbH
QIE Inc.
LIBRA Elektronik GmbH
Inventory MP
Ashlea Components Ltd
Prism Electronics
Holdelec - ElecDif-Pro
Astute Electronics Inc
Argo Parts USA
$1.010
Continental Prestige Electronics
$0.990
Netroflash
$0.969
$0.949
GreenTree Electronics
Perfect Parts
Glotronic Ltd.
Abacus Technologies
Eastek
Speed Components Ltd (Excess)
Authorized Procurement Solutions
Aztec Data Supply Inc.
This low thermal resistance value ensures efficient heat dissipation, making it an excellent choice for effectively cooling electronic components.
The use of a heat sink as the thermal device type ensures effective heat transfer and dissipation, making this product suitable for applications requiring excellent thermal management.
The U-shaped profile of this heat sink allows for effective airflow and heat dissipation, enhancing the cooling performance and making it an ideal choice for applications with limited space.
With a compact height of 10.16 mm, this heat sink can be easily integrated into space-constrained devices without compromising its cooling capabilities.
The TIN finish on this heat sink provides enhanced durability and corrosion resistance, ensuring a longer lifespan and making it a reliable choice for various applications.
The narrow width of 8 mm allows for efficient thermal transfer and heat dissipation in tight spaces, making it suitable for cooling small electronic components.
The fin construction of this heat sink provides increased surface area, enabling better heat dissipation and making it an optimal choice for applications with high heat loads.
The gray color of this heat sink offers a neutral and aesthetically pleasing appearance, making it suitable for various electronic devices and assemblies.
This heat sink is packed using the TR (Tape and Reel) method, with a length of 13 inch reels, ensuring convenient handling, transportation, and automated assembly processes.
The longitudinal fin orientation of this heat sink allows for efficient airflow and heat dissipation, maximizing its cooling performance and making it an excellent choice for thermal management.
Constructed with copper, this heat sink offers excellent thermal conductivity properties, ensuring efficient heat transfer and making it a reliable choice for high-performance cooling applications.
With a length of 22.86 mm, this heat sink provides ample surface area for effective heat dissipation, making it suitable for various electronic devices and thermal management needs.
Heat Sinks 573100D00010G attributes and parameters. Explore more Heat Sinks devices from Boyd
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Boyd is the world's leading innovator in sustainable engineered material and thermal solutions that make our customers’ products better, safer, faster, and more reliable. We develop and combine technologies to solve ambitious performance targets in our customers’ most critical applications. By implementing technologies and material science in novel ways to seal, protect, cool, and interface, Boyd has continually redefined the possible and championed customer success for over 90 years. Innovation demands for smaller, lighter, and faster technologies with intuitive new features compete with the need for more sustainable solutions. More smart functionality operating faster in tighter spaces with more sophisticated interfaces mean increased power density and more heat, electrical, and mechanical challenges. Adding further complexity, devices are used in unpredictable environments with harsh conditions and must be contaminant and waterproof, insulated against temperature extremes, and ruggedized. Not only are we determined to find solutions to these challenges, Boyd strives to simplify where possible and create the most wholistic, effective, and sustainable solutions.
2N2222A
Secos
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .6 A; JEDEC-95 Code: TO-92;
LM317T
Integrated Power Semiconductors
Other Regulators; No. of Terminals: 3; Operating Temperature (TJ-Min): 0 Cel; Terminal Pitch: 2.54 mm; Maximum Load Regulation (%): 1.5 %; Nominal Dropout Voltage-1: 3 V;
FDV303N
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Transistor Application: SWITCHING; JESD-609 Code: e3;
1N4148WS
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Rochester Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
CRG0805F10R
TE Connectivity
TE Connectivity's CRG0805F10R is a 10 ohm fixed resistor with 1% tolerance and 0.125 W power dissipation. It features thick film technology, SMT package style, and matte tin over nickel terminal finish. Ideal for surface mount applications in electronics, offering a temperature coefficient of 200 ppm/°C and operating voltage of 150 V.
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Time At Peak Reflow Temperature (s): 30; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
LM358N
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
SMBJ18CA
Pro-an Electronic
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Polarity: BIDIRECTIONAL; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
SS14
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Silicon Standard
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
08055C104KAT2A
KYOCERA AVX
08055C104KAT2A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
Samsung
N-CHANNEL AND P-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 5 ohm; No. of Terminals: 3;
DS18B20Z/T&R
Maxim Integrated
DS18B20Z/T&R by Maxim Integrated is a 12-bit digital temperature sensor with a max supply voltage of 5.5V and an accuracy of 0.50°C. It features a 1-Wire interface, operates b/w -55°C to 125°C, and is ideal for applications requiring precise temperature monitoring in compact spaces.
NC7WZ17P6X
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
Inchange Semiconductor
Other Regulators; No. of Terminals: 3; Surface Mount: NO; Technology: BIPOLAR; Minimum Output Voltage-1: 1.2 V; No. of Outputs: 1;
Good-ark Electronics
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V; No. of Phases: 1;
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; No. of Elements: 1; Transistor Application: SWITCHING;
Comchip Technology
Kec
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
DA-T263-201E-TR
Ohmite Manufacturing
HEAT SINK;
V8511X
Assmann Wsw Components
7G0011A
TDK
The TDK 7G0011A heat sink has a thermal resistance of 8.24Ω, with dimensions of 5.7mm x 37.4mm x 50mm and weight of 14.6g. It is designed for converters, featuring an omnidirectional fin orientation for efficient heat dissipation in various applications.
SK46375SA
Fischer Elektronik & Kg
574502B03300G
Boyd
Boyd's 574502B03300G is a black anodized aluminum heat sink with dimensions of 20.57mm x 9.9mm x 19.05mm (LxWxH). It has a thermal resistance of 21.2 ohm and features a slide-on construction, making it suitable for various applications requiring efficient heat dissipation.
DV-T263-301E-TR
WA-T247-101E
Ohmite's WA-T247-101E heat sink has thermal resistance of 11Ω, height 30.5mm, and length 23.1mm. Ideal for transistors, this extruded aluminum alloy clip-on heat sink with longitudinal fin orientation is anodized black and weighs 12g.
281-2AB
The Ohmite Manufacturing 281-2AB Heat Sink is 12.7mm in height, 13.2mm in width, and 19.1mm in length with an anodized black aluminum body. Ideal for thermal management in electronic devices, it efficiently dissipates heat to prevent overheating, ensuring optimal performance and longevity.
529802B02500G
Aavid Thermalloy
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: RADIAL; Width: 25.4 mm; Color: BLACK;
658-60AB-T3
WAKEFIELD-VETTE INC
Wakefield-vette's 658-60AB-T3 is a PIN FIN ARRAY HEAT SINK with dimensions 27.9mm x 27.9mm x 15.2mm and weight of 14.17g, featuring anodized finish and omnidirectional fin orientation. Ideal for cooling electronic components in compact spaces due to its efficient heat dissipation capabilities.
FA-T220-64E
The Ohmite FA-T220-64E is a black anodized aluminum heat sink measuring 41.6mm x 25mm x 63.5mm and weighing 46g. With omnidirectional fin orientation, it efficiently dissipates heat in various applications like power electronics and LED lighting systems. Ideal for thermal management due to its compact size and lightweight design.
SW50-4G
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: RADIAL; Color: BLACK; Height: 50 mm;
RA-T2X-51E
The Ohmite RA-T2X-51E heat sink, made of aluminum, measures 42x25x50.8 mm and weighs 51g. With an anodized black finish and omnidirectional fin orientation, it efficiently dissipates heat in various electronic applications.
V-1100-SMD/A
Heat Sinks;
ATS-1178-C1-R0
Advanced Thermal Solutions
507302B00000G
Boyd 507302B00000G Heat Sink has Thermal Resistance of 24 ohm, Height 9.65mm, and Width 19.05mm. Ideal for TRANSISTOR cooling applications due to FIN construction and ALUMINUM body material with ANODIZED finish.
HS202DR
Crydom
374324B00035G
HEAT SINK; Profile: PIN FIN ARRAY; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: OMNIDIRECT; Height: 10 mm;
SK89100SA
SK89100SA by Fischer Elektronik & Kg is a black anodized heat sink measuring 100x80x78.6mm (LxWxH). It is extruded for efficient thermal dissipation, ideal for electronic devices requiring cooling solutions in various applications.
ATS-1042-C2-R0
ATS-1042-C2-R0 by Advanced Thermal Solutions is a 15mm high, 41mm wide, and 64mm long heat sink with pin fin array profile. It features anodized finish, flared construction, and omnidirectional fin orientation. Ideal for cooling applications in electronics to dissipate heat efficiently.
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573100D00010G
HEAT SINK; Profile: U; Body Material: COPPER; Construction: FIN; Fin Orientation: LONGITUDINAL; Packing Method: TAPE AND REEL;
573100D00000G
HEAT SINK; Body Material: COPPER; Height: 10.16 mm; Width: 8 mm; Thermal Resistance: 15 ohm; Finish: TIN;
HEAT SINK; Body Material: COPPER; Height: 10.16 mm; Finish: TIN; Length: 22.86 mm; Thermal Resistance: 15 ohm;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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