Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
Boyd 573100D00000G Heat Sink has Thermal Resistance of 15Ω, Height 10.16mm, and Width 8mm. Ideal for cooling electronic components in compact spaces like PCBs.
Median Price
$0.719
Lifecycle Status
Suppliers In-Stock
24
In-Stock Inventory
1k+
RS (Exports)
1+ parts
$0.340
100+ parts
-
1k+ parts
10k+ parts
Heilind Electronics
$0.580
$0.562
Interstate Connecting
Mouser Electronics
$2.910
$2.300
$2.140
$0.684
Avnet
$4.673
RS Americas
$5.130
$4.670
$4.520
DigiKey
$5.330
$4.172
$3.829
Newark
$5.760
$5.350
$5.210
Arrow
$0.667
Verical
$0.689
Master Electronics
$2.750
$1.540
Future Electronics
$0.575
$0.530
NEP Electronics
$0.600
DF Sales Co.
$0.400
Nova Conductors
$1.078
Bristol Electronics
$1.125
$0.416
IBS Electronics
$0.826
$0.767
NAC Semi
$6.260
Electro Sonic
$0.711
$0.670
$0.608
Vyrian
Bisco
Inventory MP
Prism Electronics
Argo Parts USA
$1.075
Netroflash
$1.024
$1.003
Continental Prestige Electronics
$2.770
Allen Electronics Distributors
$4.240
Perfect Parts
Kepictronics
Authorized Procurement Solutions
S.R.D Solutions
Advanced Electronics
Low thermal resistance ensures efficient heat dissipation, leading to better performance and longevity of the device.
Designed specifically as a heat sink, this product is optimized for heat dissipation, making it a reliable choice for cooling applications.
Compact height allows for versatile installation options in various electronic devices or systems with space constraints.
Tin finish provides corrosion resistance and enhances the overall durability of the heat sink, ensuring a longer lifespan.
Narrow width design enables efficient heat transfer across the surface area, improving the cooling performance of the heat sink.
Copper is an excellent thermal conductor, ensuring effective heat dissipation from the device to the surrounding environment, enhancing cooling efficiency.
Optimal length provides a balance between compactness and surface area for effective heat dissipation, making it suitable for various cooling applications.
Heat Sinks 573100D00000G attributes and parameters. Explore more Heat Sinks devices from Boyd
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Boyd is the world's leading innovator in sustainable engineered material and thermal solutions that make our customers’ products better, safer, faster, and more reliable. We develop and combine technologies to solve ambitious performance targets in our customers’ most critical applications. By implementing technologies and material science in novel ways to seal, protect, cool, and interface, Boyd has continually redefined the possible and championed customer success for over 90 years. Innovation demands for smaller, lighter, and faster technologies with intuitive new features compete with the need for more sustainable solutions. More smart functionality operating faster in tighter spaces with more sophisticated interfaces mean increased power density and more heat, electrical, and mechanical challenges. Adding further complexity, devices are used in unpredictable environments with harsh conditions and must be contaminant and waterproof, insulated against temperature extremes, and ruggedized. Not only are we determined to find solutions to these challenges, Boyd strives to simplify where possible and create the most wholistic, effective, and sustainable solutions.
2N7002
Formosa Microsemi
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
LAN8720AI-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
NE555DR
Texas Instruments
NE555DR by Texas Instruments is an Analog Waveform Generation IC with 8 terminals, operating voltage of 5V, and power supplies ranging from 5-15V. It is a versatile component for pulse generation applications due to its small outline package and commercial temperature grade suitability.
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Time At Peak Reflow Temperature (s): 30; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
BSS138
Good-ark Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 6 ohm; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
LM107H/883C
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Wideband: NO;
MBR0540T1G
Onsemi
MBR0540T1G by Onsemi is a Schottky rectifier diode with max. forward voltage of 0.62V and max. output current of 0.5A, ideal for applications requiring high efficiency power conversion in small outline packages. Operating temp range: -55 to 150°C, with peak reflow temp at 260°C, making it suitable for various electronic devices needing reliable rectification performance in compact designs.
BAV99
Weitronic Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Yangzhou Yangjie Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
RC0805FR-0710KL
Yageo
Yageo's RC0805FR-0710KL is a 10000 ohm SMT fixed resistor with 1% tolerance and 0.125 W power dissipation. Ideal for applications requiring resistance to operate b/w -55°C to 155°C, such as in automotive electronics or industrial control systems. Features metal glaze/thick film technology and matte tin finish with nickel barrier.
1N4148WS
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 30 A; Maximum Forward Voltage (VF): .55 V; No. of Phases: 1;
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Cheng-yi Electronic
LM358MX
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Capar Components
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Forward Voltage (VF): 1 V; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Output Current: .15 A;
Forward International Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Nominal Breakdown Voltage: 21.05 V; Maximum Clamping Voltage: 29.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
LL4148
Microsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Vishay Intertechnology
Vishay Intertechnology's SMBJ18CA is a bidirectional TRANS VOLTAGE SUPPRESSOR DIODE with a max clamping voltage of 29.2 V and a breakdown voltage of 21.05 V. It is surface mountable and commonly used in transient suppression applications.
647-10ABEP
WAKEFIELD-VETTE INC
Wakefield-vette's 647-10ABEP heat sink, with dimensions of 25.4mm x 25.4mm x 41.9mm and weight of 24.95g, is an extruded thermal device ideal for cooling applications in electronics and machinery.
HAF-15T
TDK
The TDK HAF-15T Heat Sink features a thermal resistance of 1.5Ω, with dimensions of 38.1mm x 61mm x 116.8mm and weight of 250g. Designed for converters, it utilizes fin pin construction with omnidirectional fin orientation for efficient heat dissipation in electronic devices.
ATSEU-077D-C3-R0
Advanced Thermal Solutions
HEAT SINK;
281-1AB
Ohmite Manufacturing
The Ohmite Manufacturing 281-1AB Heat Sink is 9.5mm tall, 13.2mm wide, and 19.1mm long with an anodized black aluminum body. Ideal for thermal management in electronic devices due to its compact size and efficient heat dissipation capabilities.
908-35-2-23-2-B-0
Wakefield Thermal Solutions
Wakefield Thermal Solutions' 908-35-2-23-2-B-0 heat sink features a thermal resistance of 10.03 ohm, aluminum alloy construction with black anodized finish, and pin fin orientation. This clip-profiled device is 35mm wide, 12mm high, and used on ICs for effective heat dissipation in various electronic applications.
7136DG
Boyd
Boyd's 7136DG Heat Sink features a Thermal Resistance of 19.7 ohm, U Profile, and Copper Body Material. Ideal for applications requiring efficient heat dissipation in compact spaces with its dimensions of 13.08mm W x 21.54mm H x 13.21mm L and transverse fin orientation.
573300D00010G
Boyd's 573300D00010G Heat Sink, with U profile, is 10.16mm high and 12.7mm wide. Constructed through extrusion, it has a SN/NI finish and comes in gray color. Ideal for applications requiring efficient heat dissipation in compact spaces due to its small dimensions and effective thermal properties.
PF433G
Boyd's PF433G heat sink, 19.5mm height, 13mm width, and 12.7mm length, is ideal for transistors with a clip profile and anodized finish. Its aluminum body and transverse fin orientation ensure efficient heat dissipation in electronic devices.
HS151DR
Crydom
302NN
302NN by Wakefield-vette is a black anodized heat sink made of aluminum, with dimensions of 50.8mm x 50.8mm x 38.1mm and weighing 60.33g. Ideal for cooling electronic components in various applications due to its efficient thermal dissipation capabilities and durable construction.
ATS-1178-C1-R0
ATS-61300W-C1-R0
Y92B-N100
Omron
281-2AB
The Ohmite Manufacturing 281-2AB Heat Sink is 12.7mm in height, 13.2mm in width, and 19.1mm in length with an anodized black aluminum body. Ideal for thermal management in electronic devices, it efficiently dissipates heat to prevent overheating, ensuring optimal performance and longevity.
EA-T220-38E
Ohmite Manufacturing's EA-T220-38E Heat Sink has a thermal resistance of 9.5 ohm, height of 38.1mm, and aluminum body material. Ideal for cooling electronic components in various applications due to its black anodized finish and compact dimensions.
573300D00000G
Aavid Thermalloy
HEAT SINK; Profile: U; Body Material: COPPER; Construction: FIN; Finish: TIN; Thermal Resistance: 18 ohm;
FA-T220-25E
The Ohmite FA-T220-25E heat sink, made of aluminum, measures 25.4mm in height, 25mm in width, and 41.6mm in length. With an anodized finish and weighing 17.5g, it is suitable for various thermal management applications due to its omnidirectional fin orientation.
7140DG
HEAT SINK; Profile: U; Body Material: COPPER; Fin Orientation: TRANSVERSE; Height: 17.78 mm; Width: 9.52 mm;
WA-T220-101E
218-40CTE5
218-40CTE5 by Wakefield-vette is a black anodized aluminum heat sink with U profile, folded back fins, and dimensions of 26.2mm x 12.7mm x 10.2mm. Ideal for cooling electronic components in compact spaces like laptops, routers, and LED lighting systems.
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573100D00010G
HEAT SINK; Profile: U; Body Material: COPPER; Construction: FIN; Fin Orientation: LONGITUDINAL; Packing Method: TAPE AND REEL;
573100D00010G by Boyd is a U-profile heat sink with dimensions of 22.86mm x 8mm x 10.16mm (LxWxH). It has a thermal resistance of 15 ohm and is made of copper, making it suitable for applications requiring efficient heat dissipation.
573100D00000G
HEAT SINK; Body Material: COPPER; Height: 10.16 mm; Finish: TIN; Length: 22.86 mm; Thermal Resistance: 15 ohm;
573100D00000
HEAT SINK; Profile: U; Body Material: COPPER; Construction: EXTRUDED; Weight: 2.3 g; Height: 10.16 mm;
573100D00010
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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