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531002B00000G

Boyd

531002B00000G by Boyd

Boyd 531002B00000G Heat Sink features Thermal Resistance of 13.4 ohm, Height 25.4mm, and Length 34.9mm. Ideal for cooling electronic components in compact spaces due to its extruded aluminum construction and radial fin orientation.

Median Price

$9.240

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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DigiKey

USA . 1,399 parts In-Stock

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$9.240

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$7.233

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$6.398

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Adafruit Industries

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Nova Conductors

Japan . 300 parts In-Stock

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$1.234

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Vyrian

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Prism Electronics

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Argo Parts USA

USA . 2,638 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$1.173

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$1.148

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Continental Prestige Electronics

USA . 380 parts In-Stock

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$1.234

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$1.210

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Perfect Parts

USA . 4,664 parts In-Stock

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Glotronic Ltd.

UK . 1,970 parts In-Stock

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Aztec Data Supply Inc.

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Advanced Electronics

New Zealand . 200 parts In-Stock

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Authorized Procurement Solutions

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Overview

Discover the ultimate solution for heat dissipation with Boyd's 531002B00000G Heat Sink. Crafted with precision and expertise, Boyd ensures top-notch quality and superior performance in every product. This heat sink is perfect for a variety of applications, providing reliable thermal management to keep your devices running smoothly. Experience the value and benefits of efficient heat dissipation with Boyd's innovative technology. Upgrade your cooling system today with Boyd's exceptional heat sink!

Feature Benefit Bullets

Thermal Resistance: 13.4 ohm

Low thermal resistance ensures efficient heat dissipation, making this heat sink an excellent choice for cooling applications.

Thermal Device Type: HEAT SINK

With a dedicated design for heat dissipation, this heat sink is specifically crafted to effectively cool electronic components.

Height: 25.4 mm

The compact height of 25.4 mm allows for easy integration into tight spaces while still providing effective cooling capability.

Finish: ANODIZED

The anodized finish adds corrosion resistance and durability to the heat sink, making it a reliable choice for long-term use.

Width: 12.7 mm

The slim width of 12.7 mm allows for versatility in installation options, making this heat sink suitable for various applications.

Construction: EXTRUDED

The extruded construction of the heat sink provides enhanced thermal conductivity, improving overall cooling performance.

Color: BLACK

The sleek black color adds a professional look to the heat sink, making it ideal for both industrial and consumer electronics applications.

Fin Orientation: RADIAL

The radial fin orientation maximizes surface area for improved heat dissipation, ensuring efficient cooling of components.

Body Material: ALUMINUM

Constructed from aluminum, this heat sink offers excellent thermal conductivity and lightweight design, making it a reliable choice for cooling solutions.

Length: 34.9 mm

The length of 34.9 mm provides ample surface area for heat dissipation, making this heat sink suitable for applications requiring efficient cooling.

Technical Specifications

Heat Sinks 531002B00000G attributes and parameters. Explore more Heat Sinks devices from Boyd

Device Specifications

Construction:

Fin Orientation:

Physical Specifications

Height:

1 in (25.4 mm)

Width:

0.5 in (12.7 mm)

Length:

1.374 in (34.9 mm)

Material and Finish

Finish:

Anodized

Body Material Composition:

Color:

Black

Thermal Specifications

Thermal Resistance:

13.4 Ω

Usage and Compatibility

Device Type:

Manufacturer Highlights

Boyd

Boyd is the world's leading innovator in sustainable engineered material and thermal solutions that make our customers’ products better, safer, faster, and more reliable. We develop and combine technologies to solve ambitious performance targets in our customers’ most critical applications. By implementing technologies and material science in novel ways to seal, protect, cool, and interface, Boyd has continually redefined the possible and championed customer success for over 90 years. Innovation demands for smaller, lighter, and faster technologies with intuitive new features compete with the need for more sustainable solutions. More smart functionality operating faster in tighter spaces with more sophisticated interfaces mean increased power density and more heat, electrical, and mechanical challenges. Adding further complexity, devices are used in unpredictable environments with harsh conditions and must be contaminant and waterproof, insulated against temperature extremes, and ruggedized. Not only are we determined to find solutions to these challenges, Boyd strives to simplify where possible and create the most wholistic, effective, and sustainable solutions.

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