Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: RADIAL; Thermal Resistance: 13.4 ohm; Width: 12.7 mm;
Median Price
$5.635
Lifecycle Status
Suppliers In-Stock
6
In-Stock Inventory
1k+
Mouser Electronics
1+ parts
$1.850
100+ parts
$1.580
1k+ parts
$1.270
10k+ parts
$1.190
DigiKey
$9.420
$7.377
$6.526
-
Adafruit Industries
Nova Conductors
$1.234
Vyrian
Prism Electronics
Argo Parts USA
Netroflash
$1.173
$1.148
Continental Prestige Electronics
$1.210
Perfect Parts
Glotronic Ltd.
Aztec Data Supply Inc.
Advanced Electronics
Authorized Procurement Solutions
Heat Sinks 531002B00000G attributes and parameters. Explore more Heat Sinks devices from Aavid Thermalloy
Construction:
Fin Orientation:
Height:
Width:
Length:
Finish:
Body Material Composition:
Color:
Thermal Resistance:
Device Type:
1N4148
Panjit International
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
General Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Vicor
C1206C104M5RACTU
KEMET Corporation
KEMET C1206C104M5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±20% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
LL4148
Surge Components
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM555CN
Rca Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
LM7805CT/NOPB
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Voltage Tolerance: 5 %; Operating Temperature (TJ-Max): 125 Cel; Maximum Output Voltage-1: 5.25 V;
Semitronics
2N7002
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Time At Peak Reflow Temperature (s): 30; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
BSS138
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain Current (Abs) (ID): .2 A; Maximum Feedback Capacitance (Crss): 8 pF;
BAV99
Panasonic
MIXER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Texas Instruments
LM7805CT/NOPB by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1.5A. It operates b/w 0-125°C, has a package style of flange mount, and offers low line/load regulation making it ideal for various electronic applications requiring stable power supply.
LM358MX
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; No. of Elements: 1; Maximum Drain Current (Abs) (ID): .2 A;
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3 ohm; Minimum DS Breakdown Voltage: 50 V; Terminal Form: GULL WING;
First Components International
Frontier Electronics
LL4148-GS08
Telefunken Microelectronics
RECTIFIER DIODE; Surface Mount: YES; JESD-609 Code: e0; No. of Elements: 1; Maximum Operating Temperature: 175 Cel; Maximum Non Repetitive Peak Forward Current: 2 A;
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 40; Minimum DS Breakdown Voltage: 60 V;
SV-LED-125E
Ohmite Manufacturing
HEAT SINK;
647-10ABEP
WAKEFIELD-VETTE INC
Wakefield-vette's 647-10ABEP heat sink, with dimensions of 25.4mm x 25.4mm x 41.9mm and weight of 24.95g, is an extruded thermal device ideal for cooling applications in electronics and machinery.
658-60AB-T3
Wakefield-vette's 658-60AB-T3 is a PIN FIN ARRAY HEAT SINK with dimensions 27.9mm x 27.9mm x 15.2mm and weight of 14.17g, featuring anodized finish and omnidirectional fin orientation. Ideal for cooling electronic components in compact spaces due to its efficient heat dissipation capabilities.
529802B02500G
Aavid Thermalloy
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: RADIAL; Width: 25.4 mm; Color: BLACK;
507302B00000G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Construction: FIN; Fin Orientation: TRANSVERSE;
281-2AB
The Ohmite Manufacturing 281-2AB Heat Sink is 12.7mm in height, 13.2mm in width, and 19.1mm in length with an anodized black aluminum body. Ideal for thermal management in electronic devices, it efficiently dissipates heat to prevent overheating, ensuring optimal performance and longevity.
552844B00000G
Boyd
Boyd's 552844B00000G Heat Sink has a Thermal Resistance of 8.7 ohm, Height of 18.29mm, and Width of 45.2mm. Ideal for cooling electronic components in various applications due to its anodized finish and aluminum construction.
HTS501-P
TE Connectivity
TE Connectivity's HTS501-P heat sink, with UL approval, features a 9.06mm height and 34.92mm diameter aluminum body for ICs up to 15W power rating. Its radial fin orientation and clip profile make it ideal for efficient heat dissipation in various electronic applications.
PF526G
HEAT SINK; Body Material: ALUMINUM; Finish: ANODIZED; Thermal Resistance: 8.9 ohm; Color: BLACK; Height: 19 mm;
SK10438,1STS
Fischer Elektronik & Kg
SK10438,1STS by Fischer Elektronik & Kg is a black anodized heat sink measuring 38.1mm in height, 12.7mm in width, and 34.9mm in length. Its extruded construction with staggered fin orientation makes it ideal for cooling electronic components efficiently in various applications.
1542618-2
TE Connectivity's 1542618-2 heat sink, with a height of 6.5mm and width of 18mm, is approved by CSA and UL for up to 15W power rating. Made of cold-forged aluminum, it is ideal for use on transceivers due to its pin fin orientation and clip profile.
WA400-8P
Schaffner Holding Ag
WA400-8P by Schaffner Holding Ag is a heat sink with thermal resistance of 18 ohm, ideal for transistors. It measures 25x11x16 mm (HxWxL) and efficiently dissipates heat to prevent overheating in electronic devices. Perfect for applications requiring effective thermal management in compact spaces.
518-95AB
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Finish: ANODIZED; Height: 24.1 mm; Width: 57.9 mm;
ATSEU-077D-C3-R0
Advanced Thermal Solutions
V2008B
Assmann Wsw Components
Heat Sinks;
ICKBGA10X10
ICKBGA10X10 by Fischer Elektronik & Kg is a 6mm tall, black anodized heat sink with fin construction. It is designed for IC devices, measuring 10mm in width and length. Ideal for cooling electronic components efficiently in various applications.
WA-T247-101E
Ohmite's WA-T247-101E heat sink has thermal resistance of 11Ω, height 30.5mm, and length 23.1mm. Ideal for transistors, this extruded aluminum alloy clip-on heat sink with longitudinal fin orientation is anodized black and weighs 12g.
7136DG
Boyd's 7136DG Heat Sink features a Thermal Resistance of 19.7 ohm, U Profile, and Copper Body Material. Ideal for applications requiring efficient heat dissipation in compact spaces with its dimensions of 13.08mm W x 21.54mm H x 13.21mm L and transverse fin orientation.
ATS-1143-C1-R0
ATSEU-077C-C1-R0
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
531002B00000G
Boyd 531002B00000G Heat Sink features Thermal Resistance of 13.4 ohm, Height 25.4mm, and Length 34.9mm. Ideal for cooling electronic components in compact spaces due to its extruded aluminum construction and radial fin orientation.
531002B02500G
Aavid Thermalloy 531002B02500G is a U-profile heat sink with thermal resistance of 13.4 ohm. Constructed from extruded aluminum, it has dimensions of 34.92mm x 12.7mm x 25.4mm and radial fin orientation, ideal for cooling electronic components in various applications.
531002B02500
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: EXTRUDED; Finish: ANODIZED; Thermal Resistance: 13.4 ohm;
531002B02100G
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: RADIAL; Thermal Resistance: 13.4 ohm; Length: 34.92 mm;
531002B12500G
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: RADIAL; Length: 34.92 mm; Color: BLACK;
531002B32500G
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: RADIAL; Finish: ANODIZED; Color: BLACK;
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: RADIAL; Height: 25.4 mm; Finish: ANODIZED;
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: RADIAL; Thermal Resistance: 13.4 ohm;
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: RADIAL; Color: BLACK; Height: 25.4 mm;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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