Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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374424B00035G by Boyd is a PIN FIN ARRAY heat sink with dimensions of 27mm x 27mm x 18mm. It features anodized black aluminum construction and omnidirectional fin orientation. This heat sink is ideal for applications requiring efficient thermal management in electronic devices.
Median Price
$2.860
Lifecycle Status
Suppliers In-Stock
12
In-Stock Inventory
1k+
Element14
1+ parts
$2.560
100+ parts
$2.374
1k+ parts
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10k+ parts
DigiKey
$3.160
$2.479
$2.260
$2.178
Newark
$5.050
Farnell
$6.110
$3.200
Verical
$2.136
Arrow
$2.159
$2.095
Nova Conductors
$2.120
TME
$2.300
Sensible Micro Corp
Vyrian
Q Components
Bisco
Argo Parts USA
Continental Prestige Electronics
$5.340
Perfect Parts
Authorized Procurement Solutions
Aztec Data Supply Inc.
Netroflash
$2.078
$2.014
$1.972
Glotronic Ltd.
The use of a heat sink as the thermal device type ensures efficient heat dissipation, allowing the product to effectively cool down components and prevent overheating.
The pin fin array profile provides a larger surface area for heat dissipation, improving the overall thermal performance of the product.
The 18mm height allows for a compact design while still providing sufficient heat dissipation capabilities.
The anodized finish enhances the corrosion resistance and durability of the heat sink, ensuring long-lasting performance.
The 27mm width provides a balance between heat dissipation capacity and space-saving design.
The fin construction maximizes surface area for heat dissipation, making it an efficient choice for cooling applications.
The black color enhances heat absorption and radiation, improving the overall thermal efficiency of the heat sink.
The omnidirectional fin orientation ensures uniform heat dissipation in all directions, maximizing cooling performance.
Aluminum is a lightweight and highly conductive material, making it ideal for heat sinks as it efficiently transfers heat away from components.
The 27mm length provides a compact form factor for ease of installation in various applications while still offering effective heat dissipation capabilities.
Heat Sinks 374424B00035G attributes and parameters. Explore more Heat Sinks devices from Boyd
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Boyd is the world's leading innovator in sustainable engineered material and thermal solutions that make our customers’ products better, safer, faster, and more reliable. We develop and combine technologies to solve ambitious performance targets in our customers’ most critical applications. By implementing technologies and material science in novel ways to seal, protect, cool, and interface, Boyd has continually redefined the possible and championed customer success for over 90 years. Innovation demands for smaller, lighter, and faster technologies with intuitive new features compete with the need for more sustainable solutions. More smart functionality operating faster in tighter spaces with more sophisticated interfaces mean increased power density and more heat, electrical, and mechanical challenges. Adding further complexity, devices are used in unpredictable environments with harsh conditions and must be contaminant and waterproof, insulated against temperature extremes, and ruggedized. Not only are we determined to find solutions to these challenges, Boyd strives to simplify where possible and create the most wholistic, effective, and sustainable solutions.
1N4148
Shenzhen Yixinsemi Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 240; Terminal Finish: TIN LEAD;
OPA2277UA/2K5
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
M39029/58-360
Tri-star Electronics International
CONNECTOR ACCESSORY; Material: COPPER ALLOY; MIL Conformity: YES; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; MIL-Connector Accessory Name: CONTACT; Terminal Type: CRIMP;
Onsemi
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Finish: Matte Tin (Sn) - annealed; Transistor Element Material: SILICON;
FDV304P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .46 A;
TE Connectivity
TE Connectivity's M39029/58-360 is a CRIMP terminal backshell for 22-28 AWG wires, rated at 5A. Ideal for male contacts in Mil-Spec applications, it offers a cross-section area of 0.34 mm2 and ensures secure connections in demanding environments.
LM107H
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Nominal Common Mode Reject Ratio: 96 dB;
BAV99
Sprague Electric
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1.3 V; Maximum Output Current: .1 A; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 175 Cel;
Rectron
2N2222A
ROHM
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
National Semiconductor
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803A
Allegro MicroSystems
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Maximum Operating Temperature: 85 Cel; Terminal Form: THROUGH-HOLE;
1N4148WT
1N4148WT by Onsemi is a single rectifier diode with a max output current of 0.3A and forward voltage of 0.72V. It has a small outline package style, matte tin terminal finish, and operates at temperatures up to 150°C. Ideal for applications requiring fast reverse recovery time such as power supplies and signal demodulation circuits.
Hitachi
LL4148
Vishay Intertechnology
Vishay Intertechnology's LL4148 diode features a max reverse recovery time of 0.004 us, forward voltage of 1 V, and output current of 0.15 A. Ideal for rectification applications in electronics due to its high efficiency and low power dissipation capabilities.
MBR0520L-T1
Won-top Electronics
MBR0520L-T1 by Won-top Electronics is a Schottky rectifier diode with 20V peak reverse voltage and 0.5A output current. It is a single-config, surface-mount diode in a small outline package, suitable for applications requiring high-speed switching and low forward voltage drop. Operating temperature range from -65°C to 125°C makes it ideal for various electronic circuits.
SMBJ18CA
Forward International Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Nominal Breakdown Voltage: 21.05 V; Maximum Clamping Voltage: 29.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
C1206C104K5RACTU
KEMET Corporation
KEMET C1206C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications due to its rectangular package shape and wraparound terminals.
FA-T220-25E
Ohmite Manufacturing
The Ohmite FA-T220-25E heat sink, made of aluminum, measures 25.4mm in height, 25mm in width, and 41.6mm in length. With an anodized finish and weighing 17.5g, it is suitable for various thermal management applications due to its omnidirectional fin orientation.
ATS-61300W-C1-R0
Advanced Thermal Solutions
HEAT SINK;
FK24413D3PAK
Fischer Elektronik & Kg
FK24413D3PAK by Fischer Elektronik & Kg is a 10mm tall, 31mm wide, and 13mm long heat sink made of copper. Weighing 3.9g with a TIN LEAD finish, it is designed for use on ICs to dissipate heat efficiently in electronic devices.
508700B00000G
Aavid Thermalloy
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL; Finish: ANODIZED; Length: 50.8 mm;
ATS-1143-C1-R0
574602B03300G
Boyd
Boyd's 574602B03300G heat sink has a thermal resistance of 21.6 ohm, U profile, and aluminum body material. Ideal for applications requiring efficient heat dissipation in compact spaces like electronic devices or LED lighting systems.
PF527G
HEAT SINK; Body Material: ALUMINUM; Finish: ANODIZED; Height: 25 mm; Color: BLACK; Thermal Resistance: 7.4 ohm;
531102B00000G
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: RADIAL; Width: 12.7 mm; Height: 38.1 mm;
518-95AB
The Ohmite Manufacturing 518-95AB Heat Sink is an extruded aluminum device with dimensions of 61x57.9x24.1mm (LxWxH). It features an anodized black finish and is commonly used in electronic applications for thermal management due to its efficient heat dissipation capabilities.
ICKSMDB10SA
ICKSMDB10SA by Fischer Elektronik & Kg is a black anodized heat sink measuring 10x19x4.8mm. Ideal for dissipating heat in compact electronic devices, it offers efficient thermal management for improved performance and longevity. Perfect for applications requiring small form factor cooling solutions.
FA-T220-51E
The Ohmite FA-T220-51E is a black anodized aluminum heat sink measuring 41.6mm x 25mm x 50.8mm and weighing 37g. With omnidirectional fin orientation, it efficiently dissipates heat in various applications like electronics cooling systems. Ideal for compact spaces requiring effective thermal management.
7136DG
Boyd's 7136DG Heat Sink features a Thermal Resistance of 19.7 ohm, U Profile, and Copper Body Material. Ideal for applications requiring efficient heat dissipation in compact spaces with its dimensions of 13.08mm W x 21.54mm H x 13.21mm L and transverse fin orientation.
507302B00000G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Construction: FIN; Fin Orientation: TRANSVERSE;
ICKBGA10X10X10
ICKBGA10X10X10 by Fischer Elektronik & Kg is a 10mm black anodized heat sink with fin construction. Ideal for ICs, it offers efficient thermal dissipation with dimensions of 10x10x10 mm. Perfect for compact electronic devices requiring effective heat management.
507002B00000G
Boyd 507002B00000G Heat Sink features Thermal Resistance of 15.6 ohm, U Profile with Height 17.78mm, and Longitudinal Fin Orientation. Ideal for cooling applications in electronics due to its Aluminum construction and Anodized finish, measuring 44.45mm in Length and 9.52mm in Width.
530613B00000G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: TRANSVERSE; Finish: ANODIZED;
C247-075-3VE
WV-T247-101E
DV-T268-301E-TR
EV-T220-64E
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
374424B00035G
HEAT SINK; Profile: PIN FIN ARRAY; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: OMNIDIRECT; Width: 27 mm;
374424B00032G
HEAT SINK; Profile: PIN FIN ARRAY; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: OMNIDIRECT; Length: 27 mm;
374424B60023G
HEAT SINK; Profile: PIN FIN ARRAY; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: OMNIDIRECT; Finish: ANODIZED;
Supply Digital Components
$106.00
$54.25
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$7.29
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Total price ≈ $80,197.29
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